Process Software

Process Users Guide

Gold Ball Bump

Process Profile
8020 Software Part Number 08020-8000-005-##
8028 Software Part Number 08028-8000-005-##
MAXµm Software Part Number 08088-8000-005-##

The information in this document is the property of Kulicke & Soffa Industries, Inc. Any reproduction,
publication or distribution to a third party is strictly forbidden unless written permission is given by an
authorized agent of Kulicke & Soffa.

November 27, 2001

Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
Gold Ball Bumping
Table of Contents

Process Users Guide ..............................................................................................................................................................1

TABLE OF CONTENTS .................................................................................................................... 2

INTRODUCTION .............................................................................................................................. 3
W HAT IS A PREMIUM PROCESS?............................................................................................................. 3
INTRODUCTION .............................................................................................................................. 4
FEATURES AND BENEFITS...................................................................................................................... 4
BALL BUMP TYPES ACHIEVEABLE ........................................................................................................... 4
GETTING STARTED......................................................................................................................... 5
PROCESS SOFTWARE INSTALLATION ....................................................................................................... 5
2 Disk Premium Process Sofware Installation..................................................................................................................5
1 Disk Premium Process Sofware Installation..................................................................................................................6
APPLICATION FEASIBILITY ...................................................................................................................... 6
GUI SCREENS ................................................................................................................................. 7
GOLD BALL BUMPING SCREENS.............................................................................................................. 7
GUI SCREENS ................................................................................................................................. 8
STANDARD BUMP GUI SCREENS ............................................................................................................ 8
PARAMETER DEFINITION................................................................................................................ 9
PARAMETER CONSIDERATIONS AND DEFINITIONS......................................................................................... 9
DEFINITION ......................................................................................................................................... 9
APPLICATION............................................................................................................................... 10
APPLICATION .................................................................................................................................... 10
SAMPLE APPLICATION ................................................................................................................ 11

NOTES .......................................................................................................................................... 12

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November 27, 2001
Kulicke & Soffa Industries Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
Gold Ball Bumping
Introduction
What is a Premium Process?

Ball Bonder Systems that meet your complex and dynamic bonding requirements. As the Semiconductor
Industry changes the electronic packages to meet required consumer needs, the Premium Process
Software supports the assembly equipment in order to meet those needs.

The Premium Process Software for the MAXµm, 8098, 8020 and 8028 Automatic Ball Bonder require a
Site License and can be activated at our factory or acquired through Software@kns.com. Please
contact your K&S representative for literature and Site License pricing for any of the following Premium
Process:

• BGA3 Low Loop

• BGA4 CD Loop

• BGA Plus

• Bump

• Chip Scale Package (CSP) Long Loop

• Chip Scale Package (CSP) Loop

• J-Wire II

• RF Loop II

• Security Bond II (Bump, Loop, Loop II)

• Spider Loop

• Stand-Off Stitch 1

• 7K Wires Process

• 12K Wires Process (8028 & MAXµm Only)

• Free Air Ball (K&S Diagnostics)

• Flexible Pitch Indexing

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November 27, 2001
Kulicke & Soffa Industries Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
Gold Ball Bumping
Introduction
Features and Benefits
The Gold Ball Bumping Premium Process Software is an optional profile that operates with the
MAXµm, 8020 and 8028 Operating Software.
Gold Ball Bumping benefits include:

• Higher Yields
The Gold Ball Bumping process gives a solution to Flip Chip and TAB type
applications.

• Increased Flexibility
The Gold Ball Bumping Process provides two types of bumping: Standard
Bumping and Smooth Bumping.

• Increased Capability
New parameters have been implemented to improve motion control for the two
types of Bumping.

Ball Bump Types Achieveable

Smooth Bump

Standard Bump

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November 27, 2001
Kulicke & Soffa Industries Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
Gold Ball Bumping
Getting Started
Process Software Installation

2 Disk Premium Process Sofware Installation

The 2 disk Premium Process Software installation procedure can only be used on bonders that are already
running the specified bonder software version (e.g.; 8-00-2-23, 8-28-2-23) called out on the 2 diskette labels or
instructions. Addition of Premium Processes will be significantly shorter than COMPLETE or UPGRADE
software installation. Also, information such as MDP's and bond programs will normally be preserved on the
hard drive (see “Notice” below). (It is still good practice to save all Process Programs and the MDP’s onto
separate formatted 1.44M High-Density (HD) floppy disks in case of upgrade failure.)
1. From the GUI click on the <SYS ADMIN> Mode menu.
2. Click on <Software Options>.
3. Click on <INSTALL> and select the appropriate responses to accept a reboot and installation.
4. Insert disk 2 when prompted and select ENTER.

For the 8020: Follow the on-screen prompts that walk you through the GUI installation with the
floppies. When prompted to "CHECK HARD-D RIVE", reply “N.” When prompted to
"REBOOT SYSTEM ", remove the last floppy diskette from the drive, and then reboot
the machine by cycling power OFF. Wait at least 10 seconds before powering
ON the machine again.

For the 8028: Follow the on-screen prompts that walk you through the GUI installation with the
floppies. When prompted to "CHECK HARD-D RIVE", reply “N.” When prompted to
"CONTINUE WITH INSTALLATION", select "Y", then after the last disk is intalled,
remove the last floppy diskette from the drive.
Note: The 8028 will reboot by itself.

5. Verify the correct Premium Process has been installed.

Notice:
K&S recommends you reply <N> when you see this prompt:

DO YOU WISH TO CHECK THE TARGET HARD-DRIVE FOR BAD SECTORS?

THIS COULD TAKE A WHILE (y/n): “n”

If you reply <Y> you might be forced to reinstall the entire bonder software then restore the MDPs
and recipes from backup if any sections of that hard-drive are repaired by that utility.

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November 27, 2001
Kulicke & Soffa Industries Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
Gold Ball Bumping

1 Disk Premium Process Sofware Installation

A new 1 disk Premium Process Software installation procedure can now be used on bonders that
are using software version 8-20-2-27, 8-28-28-27, 9-28-2-27 or later. This procedure significantly
shortens and simplifies installation Information such as MDP's and bond programs will be
preserved on the hard drive.

1. From the GUI, click on the <S YS ADMIN> Mode menu.

2. Click on <S OFTWARE OPTIONS >.
3. Click on <INSTALL> and select the appropriate responses to accept a reboot and installation.

For the 8020: The bonder will then load the premium process disk and will automatically reboot
when done.

For the 8028

or MAXµm: The bonder will then load the premium process disk and will automatically reboot
when done. NOTE: AT THE STARTUP OF GUI, ERROR MESSAGE #1000
MAY APPEAR. PRESS CONTINUE TO PROCEED.

Verify the correct Premium Process has been installed.

Application Feasibility

• Flip Chip and or Tab type applications

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November 27, 2001
Kulicke & Soffa Industries Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
Gold Ball Bumping
GUI Screens
Gold Ball Bumping Screens

The following screens have been created to incorporate the parameters in the Gold Ball Bumping
process. If you have worked with the Ball Bumping process, you may be already familiar with the
following screens.

Edit Loop Parameter Edit Bond2 Parameters

Group 1 Wire 1 Site 1 Group 1 Wire 1 Site 1
1 Edit GROUP 1 Edit GROUP
2 Wire Profile BUMP1 BOND 2 Z-Tear State OFF
3 Smooth Bump 0 3 Z-Tear USG 0 mAmps
4 Bump Height 0.50 mils 4 Z-Tear Speed 100 %
5 Seperation Height 1.00 mils Done Parameter Set
6 Smooth Distance 0.00 mils
7 Smooth Speed 100 %
8 Smooth USG 0
mAmps

Smooth Gold Ball Bumps

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November 27, 2001
Kulicke & Soffa Industries Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
Gold Ball Bumping
GUI Screens
Standard Bump GUI Screens

Edit Loop Parameters Edit Bond2 Parameters

Group 1 Wire 1 Site 1 Group 1 Wire 1 Site 1
1 Edit GROUP 1 Edit GROUP
2 Wire Profile BUMP1 BOND 2 Z-Tear State OFF
3 Smooth Bump 0 3 Z-Tear USG 0 mAmps
4 Bump Height 3.00 mils 4 Z-Tear Speed 100 %
5 Smooth Distance 0,00 mils Done Parameter Set
6 Smooth Speed 100 %
7 Smooth USG 0
mAmps
Done Parameter Set

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November 27, 2001
Kulicke & Soffa Industries Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
Gold Ball Bumping
Parameter Definition
Parameter Considerations and Definitions

The following parameters are used in the Gold Ball Bumping process. If you have worked with the
Gold Ball Bumping process, you may be familiar with most of these parameters.

Definition

Smooth Bump
The switch that determines the mode of bumped ball. A setting of “0” will produce a “tailed” bump,

Bump Height
The distance the capillary raises before Smoothing begins.

Separation Height
The distance the capillary raises up before Smoothing begins.

Smooth Distance
The XY distance the capillary moves following the rise to Bump Height to smooth the ball top.

Smooth Speed
The motion speed during Smoothing.

Smooth USG
The amount of USG energy (in mA) applied during Smoothing.

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November 27, 2001
Kulicke & Soffa Industries Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
Gold Ball Bumping
Application
Application

SMOOTH BUMP is used to activate the BUMP HEIGHT, SMOOTH DISTANCE, SMOOTH SPEED and
SMOOTH USG parameters. In addition to the Bump Parameters, the use of the Z-Tear feature in the
Second Bond parameters will be useful in controlling the tailing after the bump ball is bonded in
either mode.

The SEPARATION HEIGHT and BUMP HEIGHT settings are used to control where smoothing occurs.
A setting too low may cause the ball to be pushed off of the pad. A setting too high may result in
inconsistent tearing at the ball.

The amount of SMOOTH DISTANCE is dependent on the both wire diameter and capillary hole
diameter. A setting too high may result in a Short Tail. A setting too low may result in inconsistent
tearing at the ball. It is recommended to use the following to determine a starting value, and adjust
as necessary to achieve consistent tearing:

Tip - CD
Smooth Distance =
2

SMOOTH SPEED and SMOOTH USG are available to provide consistent bump formation, and should
be adjusted as required for each application.

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November 27, 2001
Kulicke & Soffa Industries Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
Gold Ball Bumping
Sample Application
Looping Parameters

Parameter Value
Loop Profile Bump1
Smooth Bump 1
Bump Height 0.3
Separation Height 0.6
Smooth Distance 1.3
Smooth Speed 100
Smooth USG 150
Z-Tear Speed 70
Z-Tear USG 150

Capillary: 414FA-2065-R35 (H-1.3, CD-2.2, Tip-5.5, FA-11)

Wire: AW88 1.0 mil
Free-Air-Ball Size: 2.3 mils

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November 27, 2001
Kulicke & Soffa Industries Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
Gold Ball Bumping
Notes
This page is for additional notes by the user.

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November 27, 2001
Kulicke & Soffa Industries Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA