PROCESS USERS GUIDE

BGA5 Process Profile

MAXµm Software Part Number 08088-8020-001-##
8028 Software Part Number 08028-8020-001-##

The information in this document is the property of Kulicke & Soffa. Any reproduction,
publication or distribution to a third party is strictly forbidden unless written permission is
given by an authorized agent of Kulicke & Soffa.

May 28, 2002

Rev 1.3

Process Software
BGA5 Loop Profile
TABLE OF CONTENTS

INTRODUCTION ........................................................................................................................................3
WHAT IS A PREMIUM PROCESS? ....................................................................................................................3
BGA5 FEATURES AND BENEFITS ...................................................................................................................3
LOOP SHAPES ACHIEVABLE WITH BGA5:........................................................................................................4
BGA5 GUI SCREENS ................................................................................................................................4
BGA5 APPLICATION FOCUS...........................................................................................................................4
BGA5 PARAMETER DEFINITIONS ..........................................................................................................5
SHAPE FACTOR .............................................................................................................................................7
SPAN LENGTH ...............................................................................................................................................8
SMOOTHNESS ...............................................................................................................................................9
TAIL KINK ....................................................................................................................................................10
LOOP BALANCE ...........................................................................................................................................12
Y BALANCE .................................................................................................................................................13
X BALANCE .................................................................................................................................................13
CONTACT ANGLE / CONTACT OFFSET...........................................................................................................14
RECOMMENDED STARTING PARAMETERS .......................................................................................15
STARTING PARAMETERS ..............................................................................................................................15
BGA5 OPTIMIZATION GUIDE.................................................................................................................16

SAMPLE APPLICATION..........................................................................................................................19
APPLICATION DESCRIPTION..........................................................................................................................19
LOOPING PARAMETERS ...............................................................................................................................19
TYPICAL INSTALLATION .......................................................................................................................20
1 Disk Premium Process Software Installation.............................................................................................................20
NOTES......................................................................................................................................................21

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BGA5 Loop Profile

Introduction
What is a Premium Process?
K&S Premium Process Software is a series of Value-added options available for the MAXµm, 80xx, or
1488 Automatic Ball Bonder Systems. They allow field upgrade and factory customization of these K&S
wire bonders to meet your complex and ever-changing wire-bonding requirements.

BGA5 and the other Premium Process options require a small Software Site License fee in return for a
simple upgrade that can be sent to you via the WWW and activated in your factory. Once this license is
on file, K&S will also automatically include your Premium Process options on future shipments of that
wire-bonder model to your Licensed Site. Questions about this or other wire-bonder software options
can be answered by your K & S representative or by response to an email sent to Software@kns.com.
K&S also maintains software and Premium Process literature on its WWW site, with a special link
directly to wire bonder software of: http://www.ksbonder.com

BGA5 Features and Benefits

The BGA5 trajectory was designed primarily for use in applications (such as stacked die) where
an obstacle near second bond needs to be cleared precisely, repeatably, and predictably. This
trajectory is similar to the BGA4 CD loop, but it adds functionality that improves looping
performance while simplifying looping control teach. In many cases, it does this while allowing
trade-offs that improve throughput (UPH) of the bonder. However, BGA5 or BGA4 (and all other
tail kink process profiles) should only be used where a trade off in UPH is justified by a need for
significant second bond clearance. Depending on application1, consider using worked loop,
CSP, and BGA3 instead of BGA4 or BGA5 for these situations.

The BGA5 Loop benefits are:

• Higher Yields
BGA5 Loop process gives a solution to the applications (such as stacked die)
where an obstacle near second bond needs to be cleared precisely, repeatably,
and predictably.

• Increased Flexibility
The BGA5 Loop Process allows for parameter manipulation to obtain four loop
shapes: BGA5, BGA4 CD Loop, BGA2 and BGA2 Worked.

• Increased Capability
A new parameter has been created to simplify looping control over the specific
looping and bonding requirements.
1
for example, significant application factors are wire length, diameter, type, loop height and required tail kink angle.

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BGA5 Loop Profile

Loop Shapes Achievable with BGA5:

BGA5 GUI Screens

The following screen has been created to access the parameters of the BGA5 process. If you have
worked with the “BGA4” process, you should be familiar with most of these parameters.
Edit Loop Parameters
Group 1 Wire 1 Site 1
1 Edit GROUP
2 Wire Profile BGA5
<<< Page 5 (of 6) >>>
3 Use Die Edge OFF
4 Die Edge Clearence 0.00 mils
5 Shape Factor 2 60 deg
6 Span Length 2 0 %
7 Kink Loop Factor 0.00 mils
8 Kink Balance 100 %
9 Kink Bleed Voltage 0.00 mVolts
Done Parameter Set

BHD

Wire Length
BGA5 Application Focus
Long Wires, Cavity Down/ UP Bonding, Standard and Fine Pitch BGA, Ground and Power Ring clearance

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BGA5 Loop Profile

BGA5 Parameter Definitions

Key BGA5 Parameters

• Kink Loop Factor (a New parameter)

Adjusts the length, or relative position with respect to second bond, of the kink.
• Kink Balance (a New parameter)
A factor that is used to adjust the relative kink position for wires of varying length.
• Kink Bleed Voltage (a New parameter)
Controls the application of USG during the kink formation portion (downward motion)
of the looping process.
• Kink Speed (a New parameter)
Controls the bonder speed during the pay-out portion (upward motion) following kink formation.

Existing BGA4 Parameters available in BGA5 but normally not used in BGA5
• Last-Kink Length
Defines the location of the last kink from second bond. Leave at 0.0mils for “automatic” operation.
• Last-Kink Angle
Controls how severe a bend is to be placed on the wire at the last kink length location.
• Last-Kink Factor
Modifies the bend radius of the kinking motion to make best use of the natural wire tendencies.

Note: The above parameters have been “hidden” in BGA5 because they are normally not used.
Default values are normally adequate, so K&S recommends and Kink Loop Factor be used to
adjust the kink shape instead of adjusting the Last-Kink parameters.

BGA5 Loop Profile

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BGA5 Loop Profile

Ref Wire Length defines the wire length standard used when applying Loop Balance and Kink Balance.
When set to the default, 0.0 mils (original method), the application of Loop Balance and Kink Balance
is based on the current wire length only. When the Ref Wire Length is set to any other value (new
method) the amount of Loop Balance and Kink Balance is based on the difference between the Ref
Wire Length and the length of the current wire. The greater the difference, the greater the amount of
applied balance adjustment. In this method, balance settings other than 100% apply to those wire
lengths greater then the Ref Wire Length. The opposite applies to wire lengths less than the Ref Wire
Length.

Example: Loop Balance = 95% (100-5%)

Actual Wire Length > Ref Wire Length >> 95% (100-5%) balance applied
Actual Wire Length = Ref Wire Length >> 0% balance applied
Actual Wire Length < Ref Wire Length >> 105% (100+5%) balance applied

Kink Loop Factor and Kink Balance function like the parameters Loop Factor and Loop Balance that
are used to control loop height in loops with various lengths. Kink Loop Factor adjusts the kink
position, as a fixed distance in mils. Positive values are used to increase the kink length, negative to
decrease. In most cases, it is recommended to keep the Last-Kink parameters fixed and use Kink Loop
Factor to adjust the kink shape. In applications with similar lengths, Kink Loop Factor can be used to
fine-tune the kink length, rather than changing Last-Kink Length. If Last-Kink Length is being auto-
calculated (set to 0.0), this is the only way to adjust the length. Kink Balance is used to compensate the
kink length is wires with varying lengths. Values greater than 100% increase the kink length as the wire
length increases, values lower than 100% decrease the kink length as the wire length increases. This
parameter should be set to the default value of 100% if the wires are relatively the same length.

Kink Bleed Voltage controls the application of USG during the kink formation portion (downward
motion) of the looping process. To provide adequate wire clearance in most stacked die applications it is
necessary to form sharp angles in the wire. Generally, USG energy is used to reduce the friction
between the tool and the wire, providing a more steady wire feed during loop formation. Unfortunately,
the level of USG energy used can cause the buildup of gold on the face edges of the capillary, reducing
its life. This parameter allows the user to adjust the USG used only during the kink formation. During
the other portions of the looping process (before and after the kink) the application of USG is controlled
by the parameter Bleed Voltage.

Kink Speed controls the bonder speed during the most critical portion of the looping – the payout portion
(upward motion) following kink formation. With the addition of this parameter it is no longer necessary to
slow the formation speed of the entire loop to improve loop consistency.

The Last-Kink parameters default values provide sufficient kink formation in most applications (up-bond
and down-bond). The default value of 0.0 mils for Last-Kink Length sets the parameter in an auto-
calculate mode. With this setting, the length used to form the kink is calculated automatically depending
on the configuration of the looping application. The parameter may also be manually set to a specific
value by changing the default. As with the BGA4CD loop, adjustments to Last-Kink Angle and Last-
Kink Factor should be made minimizing wire payout during the kinking.

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BGA5 Loop Profile

The following parameters are used for the BGA5 Loop process. If you have worked with the
“BGA4” process, you may be familiar with most of these parameters.

Shape Factor
Defines how severe a bend is to be placed on a wire at the Span Length 1 location by specifying
the angle of arc to be swept during the kinking motion. Representations below show a wire with
the shape factor kink formed at the capillary tip bond.

USAGE
Shape Factor is generally set around 20 degrees so that the highest point of the loop remains
over the first bond. Span Length 2 and Shape Factor 2 settings of 0 are recommended.

Shape Factor 1

Shape Factor 2

Shape Factor 2
Shape Factor 1

Shape Factor 2
Shape Factor 1

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BGA5 Loop Profile

Span Length
Defines in length or as a percentage of wire length the location where a bend is formed in the
wire for a worked type loop. Below are example representations that show a wire payout for
span length to the point of the Shape Factor kinking motion.

USAGE
Used for low and / or long loops to add stiffness to the loop and reduce wire sway. Span
Lengths of less that half of the wire length provides better loop control, however longer lengths
are possible especially when incorporated with smoothness to create a BGA style loop. Refer to
the BGA5 optimization guide found on page 16 for further details.

Span Length 2
Span Length 1

Span Length 2
Span Length 1

Span Length 2
Span Length 1

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BGA5 Loop Profile

Smoothness
Provides control over how localized a bend is produced by Shape Factor. By specifying a
distance as a percentage of wire length that the wire bending is to begin spreading deformation
out over the distance between Smoothness and Span Length. This creates a gentler curve to
the wire as seen in the representations below. To have an effect on the loop profile the
smoothness factor needs to be set to a value less than span length. Setting it to a value equal to
Span Length will disable smoothness.

USAGE
Generally used where a gentle curve is desired instead of a more defined worked kink. A typical
value will be 20% when a rounded loop is desired or 100% when a worked loop is preferred.
Refer to the BGA5 optimization guide on page 16 for further details.

Example Loop Shapes:

Rule: Smoothness < Span Length
Span Length = 85%
Smoothness = 55%

Rule: Smoothness < Span Length

Span Length = 85%
Smoothness = 65%

Rule: Smoothness < Span Length

Span Length = 85%
Smoothness = 75%

Rule: Smoothness >/= Span Length

Span Length = 85%
Smoothness = 86%

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BGA5 Loop Profile

Tail Kink
• Last-Kink Length defines the location of the last kink from second bond in units of length.
• Last-Kink Angle controls how severe a bend is to be placed on the wire at the last kink
length location.
• Last-Kink Factor modifies the bend radius of the kinking motion to make best use of the
natural tendencies of the wire.

USAGE

Up-Bond
Last-Kink parameters are used to clear power rings and solder masks located near
second bond in up-bonding situations. It is recommended to keep the Last-Kink
parameters fixed and use Kink Lop Factor to adjust the kink shape. If required, the Last-
Kink parameters may be manually adjusted for some applications.

Example Loop Shapes:

Last Kink Length = 0 mils

Last Kink Angle = 100o
Last Kink Factor = 60%

Last Kink Length = 0 mils

Last Kink Angle = 110o
Last Kink Factor = 60%

Last Kink Length = 0 mils

Last Kink Angle = 100o
Last Kink Factor = 60%
Kink Loop Factor > 0

Last Kink Length = 0 mils

Last Kink Angle = 100o
Last Kink Factor = 60%
Kink Loop Factor < 0

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BGA5 Loop Profile
Down-Bond

Last-Kink parameters are used to clear die edge (in-board bonding) or lower wire loops as in the
case of stacked die applications. As with up bonding, it is recommended to keep the Last-Kink
parameters fixed and use Kink Lop Factor to adjust the kink shape. If required, the Last-Kink
parameters may be manually adjusted for some applications.

Example Loop Shapes:

Last Kink Length = 0 mils*

Last Kink Angle = 100o
Last Kink Factor = 60%
Kink Loop Factor =0

Last Kink Length = 0 mils*

Last Kink Angle = 100o
Last Kink Factor = 60%
Kink Loop Factor >0

Last Kink Length = 0 mils*

Last Kink Angle = 100o
Last Kink Factor = 60%
Kink Loop Factor <0

NOTE: Normally the physical tail kink angle formed * Last Kink Parameter Defaults
Last Kink Length = 0 mil
will have an angle of < 45° with BGA5 regardless of Last Kink Angle = 100 o
Last Kink Angle Setting. Loop Kink Factor = 60%

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BGA5 Loop Profile

Loop Balance
Is a factor that is used to adjust the relative height between wires of varying length.

USAGE
Loop Balance values >100% will raise the height of longer wires and lower the height of shorter
wires. Loop Balance values <100% will lower the height of longer wires and raise the height of
shorter wires.

Loop Balance 95%

Short Wire Long Wire

Loop Balance 100%

Short Wire Long Wire

Loop Balance 105%

Short Wire Long Wire

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Y Balance
Balances Loop heights between front and rear wires. Y Balance Adjust is a factor that is used to
equalize relative loop heights between front and backside wires. Values greater than 100% has
the affect of raising front-most wires and simultaneously lowering backside wire loops. In
contrast, using values less than 100% has the affect of lowering front-side wires while
simultaneously raising backside wire loops. The Y Balance setting of 100% has no effect on
loop height.

USAGE
Adjustments should be made in 0.2% increments and will require readjustments to loop factor
after loop heights are equalized.

Y REAR

Y REAR
X LEFT

X LEFT X

X RIGHT

Y FRONT
Y FRONT

X Balance
X Balance is a factor that is used to equalize relative loop heights between left-side and right-
side wires. Values greater than 100% has the affect of raising left-side wires and simultaneously
lowering right-side wire loops. In contrast, using values less than 100% has the affect of
lowering left-side wires while simultaneously raising right-side wire loops. An X Balance setting
of 100% has no effect on loop height.

USAGE
Adjustments should be made in 0.2% increments and will require readjustments to loop factor
after loop heights are equalized.

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Contact Angle / Contact Offset

Contact Angle
Sets the approach angle of the capillary to second bond.

Contact Offset
Adjusts the second bond X, Y coordinates of the Z touchdown point towards first bond so that
the remainder of the XY motion is made with the capillary dragging along the surface.

USAGE
Contact Angle and Contact Offset are used as a tool to modify the second bond impact
characteristics. The dragging motion can be used to elongate the second bond, this can help to
pull straight a swayed wire and to separate and weaken a tail bond from the second bond.

LF2 = 0

Contact Angle

Contact Offset

LF2 = 20 2nd Bond Point

TIP2

LF2
LF2 sets the distance the bond head moves parallel to the bond surface prior to making second
bond.

USAGE
LF2 is used to control the lay down of the wire. A value of 0 uses the belly of the wire to kick the
loop up so that a clearance can be created for ground bar clearances. A value of 20 will pull out
on the wire, laying the wire flat and usually providing better wire straightness.

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Recommended Starting Parameters
This section provides starting parameters to help you learn and understand the BGA5 Loop
process. It has been provided to serve as a starting point for your process, and your specific
application may require changes from some of these starting values.

The RECOMMENDED STARTING PARAMETER value is listed in the tables below.

Starting Parameters

Parameter BGA5 BGA4 Comments

Kink Height 6 6
Reverse Motion 4 6
Reverse Motion Angle 90 100
Bleed Voltage 1000 1000
Span Length 1 30 30
Span Length 2 60 0
Shape Factor 1 -20 25
Shape Factor 2 20 0
Smoothness 100 45
Loop Factor -2 -7
Loop Balance 100 100
X Balance 100 100
Y Balance 100 100
LF2 0 12
LF4 100 100* In BGA4, LF4 is used to improve loop consistency in trade off for UPH
Impact Time 0 0
Contact Angle 0 0
Contact Offset 0 0
Last Kink Length 0 10
Last Kink Angle 100 100
Last Kink Factor 60 60
Kink Loop Factor 0 NA Parameters used to optimize the BGA5 over a large length of wire that is not available
in BGA4.
Kink Balance 100% NA
Kink Speed 100% NA A new parameter used to improve wire payout without affecting overall cycle time.
Kink Bleed Voltage 0 Bleed The parameter Bleed Voltage is used in BGA4 during tail kink formation. During tail
Voltage kink formation, the higher bleed voltage settings can cause the wire to stick to the
capillary affecting wire payout that results in inconsistent tail kink heights.

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BGA5 Loop Profile
BGA5 Optimization Guide
1. Adjust (initial) Kink Height, Reverse Motion, Loop factor to provide desired loop height. Leave the Last-
Kink parameters at the default values:
Last-Kink Length: 0.0 mils (Auto-calculation)
Last-Kink Angle: 100.0 degrees
Last-Kink Factor: 60 %

2. Adjust (initial) Span Length/Shape Factor 1 parameters according to the loop length and desired loop
shape.
Span Length 1:
Loop Lengths ≤ 100 mils: 30% - 80% (if Span Length/Shape Factor 2 set to 0.0)
Loop Lengths > 100 mils: 20% - 40% (30)

Shape Factor 1:
Loop Lengths ≤ 100 mils: 0 to 30 degrees (20)
Loop Lengths > 100 mils: -20 to 20 degrees (-10)

3. If necessary, adjust (initial) Span Length/Shape Factor 2 parameters according to the loop length and
desired loop shape.
Span Length 2: 40% - 80% (60)
Shape Factor 2: ≤ 25 degrees (20)

4. Adjust tail kink height.

A. Adjust Loop Factor. This will affect the overall loop height and shape as well.
I. Increase value (+): Raises tail kink height.
II. Decrease value (-): Lowers tail kink height.

B. Adjust Kink Loop Factor/Balance:

I. Increase value: Raises tail kink height.
II. Decrease value: Lowers tail kink height.

Notes:
1. This adjustment is effective within a range defined by the wire length and the value of
Last-Kink Length.
2. Kink Balance is only needed to compensate for the differences in tail kink shape between
long and short wires in a wire group.

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BGA5 Loop Profile

Kink Length Consistency

BGA4CD BGA5

Tail kink shape (length and height) varies Tail kink shape remains consistent
as wire length changes. across the various length wires.

Note: Wire lengths ranged from 80 to 150 mils.

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BGA5 Loop Profile
C. Adjust Span Length/Shape Factor 2 to change the shape of the tail kink.
I. To increase the kink:
a. Increase Span Length 2 approximately 5%-10%.
b. Increase Shape Factor 2 by approximately 5 degrees (maximum 25 degrees)

II. To decrease the kink:

a. Decrease Span Length 2 approximately 5%-10%.
b. Decrease Shape Factor 2 by approximately 5 degrees (maximum 25 degrees)

Figure 1. Adjust Span Length/Shape Factor 2.

D. Adjust Last-Kink Length from the default (0.0 mils) to a value approximately ½ the distance
between the first and second bond plane levels (See Figure 1).
I. Increase value: Raises tail kink height.
II. Decrease value: Lowers tail kink height.

Notes:
1. Lower parameter settings may result in the collapse of the loop or irregular loop
shaping. High settings may cause the tail kink to sag.

E. Adjust Last-Kink Angle and Factor (See Figure 2).

Last-Kink Angle: 90-110 degrees
Last-Kink Factor: 50%-70%

I. Increase value: Sharper kink.

II. Decrease value: Softer kink.

Notes:
1. Low parameter settings may result in the collapse of the loop or irregular loop shaping.
High settings may cause the tail kink to sag.
2. High parameter settings may result in too sharp of a kink causing the wire to stick to the
capillary resulting in inconsistent payout and irregular loop shapes, loop collapse or
the kinks to sag.
3. Up-bonded (cavity-down) loops usually require lower kink settings than down-bond
(stacked-die) devices.

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Sample Application

Application Description

Inspection Avg STD Min

Loop Height above 5.37 0.54 4.03
ball
Top Loop Clearance 4.20 0.15 4.02

Looping Parameters

Parameter Value
Loop Profile BGA5 Loop
Kink Height 3
Reverse Motion 0
Loop Factor 1.2
Rmot Angle 90
LF2 -20
Shape Factor 1 -30
Span Length 1 10
Loop Balance 100
Smoothness 100
Shape Factor 2 26
Span Length 2 93
Last Kink Length 6.5
Last Kink Angle 105
Last Kink Factor 60
Kink Loop Factor 4
Kink Balance 106

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Typical Installation
1 Disk Premium Process Software Installation

A 1 disk Premium Process Software installation procedure can now be used to add BGA5 on
bonders that are using software version 8-28-28-28a, 9-28-2-29a or later. This procedure is a
short and simple installation that does not disturb MDP's and bond programs on the hard drive.

1. From the GUI, click on the <SYS ADMIN> Mode menu.

2. Click on <SOFTWARE OPTIONS>.
3. Click on <INSTALL> and select the appropriate responses to accept a reboot and installation.
The bonder will then load the premium process disk and will automatically
reboot when done.

4. Verify the correct Premium Process has been installed, by looking for “BGA5” as one of the
looping trajectories available.

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Notes
This page is for additional notes by the user.

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