Process Software

Process Users Guide

BGA3 Low Loop Process Profile
8020 Software Part Number 08020-8000-041-##
8028 Software Part Number 08028-8000-041-##
MAXµm Software Part Number 08088-8000-041-##

The information in this document is the property of Kulicke & Soffa Industries, Inc.
Any reproduction, publication or distribution to a third party is strictly forbidden, unless written permission
is given by an authorized agent of Kulicke & Soffa.

November 27, 2001

Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Table of Contents
PROCESS USERS GUIDE...........................................................................................................................................................................1

TABLE OF CONTENTS ..............................................................................................................................................................................2

INTRODUCTION..........................................................................................................................................................................................3
W HAT IS A PREMIUM PROCESS?............................................................................................................................................................3
INTRODUCTION..........................................................................................................................................................................................4
FEATURES AND BENEFITS......................................................................................................................................................................4
LOOP SHAPES A CHIEVABLE...................................................................................................................................................................4
A PPLICATION FEASIBILITY...................................................................................................................................................................4
GETTING STARTED....................................................................................................................................................................................5
PROCESS SOFTWARE INSTALLATION ...................................................................................................................................................5
2 Disk Premium Process Sofware Installation ......................................................................................................................5
1 Disk Premium Process Sofware Installation ......................................................................................................................6

GUI SCREENS...............................................................................................................................................................................................7
BGA3 LOW LOOP SCREENS ....................................................................................................................................................................7
PARAMETER DEFINITION........................................................................................................................................................................8
PARAMETER CONSIDERATIONS AND DEFINITIONS...........................................................................................................................8
PARAMETER DEFINITIONS.....................................................................................................................................................................9
X Balance.......................................................................................................................................................................................... 12
PARAMETER DEFINITION..................................................................................................................................................................... 13

STARTING PARAMETERS .................................................................................................................................................................... 14

APPLICATION .......................................................................................................................................................................................... 15
A PPLICATION.........................................................................................................................................................................................15
SAMPLE APPLICATION ........................................................................................................................................................................ 16
Application Description .............................................................................................................................................................16
Looping Parameters .....................................................................................................................................................................16

NOTES ......................................................................................................................................................................................................... 17

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Introduction
What is a Premium Process?
The Premium Process Software is a Value added option for the MAXµm, 8020 and 8028 Automatic
Ball Bonder Systems that meet your complex and dynamic bonding requirements. As the
Semiconductor Industry changes the electronic packages to meet required consumer needs, the
Premium Process Software supports the assembly equipment in order to meet those needs.

The Premium Process Software for the MAXµm, 8020 and 8028 Automatic Ball Bonder require a Site
License and can be activated at our factory or acquired through Software@kns.com. Please contact
your K&S representative for literature and Site License pricing for any of the following Premium
Process:

• BGA3 Low Loop

• BGA4 CD Loop

• BGA Plus

• Bump

• Chip Scale Package (CSP) Long Loop

• Chip Scale Package (CSP) Loop

• J-Wire

• RF Loop

• Security Bonds (Bump/Loop)

• Spider Loop

• Stand-Off Stitch 1

• 7K Wires Process

• 12K Wires Process (MAXµm & 8028 Only)

• Free Air Ball (K&S Diagnostics)

• Flexible Pitch Indexing

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Introduction
Features and Benefits
The BGA3 Low Loop Premium Process Software is a value added looping trajectory to your MAXµm,
8020 and 8028 Operating Software that is developed for challenging Low Loop BGA packaging
requirements.
BGA3 Low Loop benefits are:

• Higher Yields
BGA3 Low Looping process gives a solution to the problems associated with
intermittent tight low wire loops.

• Increased Flexibility
The BGA3 Low Loop Process allows for parameter manipulation to obtain two loop
shapes: BGA2 Loop and BGA2 Worked Loop.

• Increased Capability
New parameters have been created to improve looping control over the specific
looping and bonding requirements.

Loop Shapes Achievable

BGA3 Low Loop Shape Type

BGA2 Loop Shape Type

BGA2 Worked Loop Shape Type

Application Feasibility
Long Wire, Low Loop 4-6 mils, Fine Pitch BGA, Std BGA, Ground and Power Ring clearance
requirements.

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Getting Started
Process Software Installation

2 Disk Premium Process Sofware Installation

The 2 disk Premium Process Software installation procedure can only be used on bonders that
are already running the specified bonder software version (e.g.; 8-00-2-23, 8-28-2-23) called out
on the 2 diskette labels or instructions. Addition of Premium Processes will be significantly
shorter than COMPLETE or UPGRADE software installation. Also, information such as MDP's
and bond programs will normally be preserved on the hard drive (see “Notice” below). (It is still
good practice to save all Process Programs and the MDP’s onto separate formatted 1.44M
High-Density (HD) floppy disks in case of upgrade failure.)
1. From the GUI click on the <S YS ADMIN> Mode menu.
2. Click on <S OFTWARE OPTIONS >.
3. Click on <INSTALL> and select the appropriate responses to accept a reboot and installation.
4. Insert disk 2 when prompted and select ENTER.

For the 8020: Follow the on-screen prompts that walk you through the GUI installation with the
floppies. When prompted to "CHECK HARD-D RIVE", reply “N.” When prompted
to "REBOOT SYSTEM ", remove the last floppy diskette from the drive, and then
reboot the machine by cycling power OFF. Wait at least 10 seconds before
powering ON the machine again.

For the 8028: Follow the on-screen prompts that walk you through the GUI installation with the
floppies. When prompted to "CHECK HARD-D RIVE", reply “N.” When prompted
to "CONTINUE WITH INSTALLATION", select "Y", then after the last disk is intalled,
remove the last floppy diskette from the drive.
Note: The 8028 will reboot by itself.

5. Verify the correct Premium Process has been installed.

Notice:
K&S recommends you reply <N> when you see this prompt:

DO YOU WISH TO CHECK THE TARGET HARD-DRIVE FOR BAD SECTORS?

THIS COULD TAKE A WHILE (y/n): “n”

If you reply <Y> you might be forced to reinstall the entire bonder software then restore the MDPs
and recipes from backup if any sections of that hard-drive are repaired by that utility.

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

1 Disk Premium Process Sofware Installation

A new 1 disk Premium Process Software installation procedure can now be used on bonders
that are using software version 8-20-2-27, 8-28-28-27, 9-28-2-27 or later. This procedure
significantly shortens and simplifies installation Information such as MDP's and bond programs
will be preserved on the hard drive.

1. From the GUI, click on the <S YS ADMIN> Mode menu.

2. Click on <S OFTWARE OPTIONS >.
3. Click on <INSTALL> and select the appropriate responses to accept a reboot and installation.

For the 8020: The bonder will then load the premium process disk and will automatically
reboot when done.

For the 8028

or MAXµm: The bonder will then load the premium process disk and will automatically
reboot when done. NOTE: AT THE STARTUP OF GUI, ERROR MESSAGE
#1000 MAY APPEAR. PRESS CONTINUE TO PROCEED.

4. Verify the correct Premium Process has been installed.

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

GUI Screens
BGA3 Low Loop Screens

The following screens had been created to incorporate the parameters in the BGA3 Low Loop
process. If you have worked with the “M Loop” process, you may be already familiar with the following
screens.

Edit Loop Parameters Edit Loop Parameters

Group 1 Wire 1 Site 1 Group 1 Wire 1 Site 1
1 Edit GROUP 1 Edit GROUP
2 Wire Profile BGA3 LOW LOOP 2 Wire Profile BGA3 LOW LOOP
<<< Page 1 ( of 4 ) >>> <<< Page 2 ( of 4 ) >>>
3 Kink Height 8.00 mils 3 Impact Time 0 %
4 Reverse Motion 8.00 mils 4 Rmot Angle 90 deg
5 Loop Factor 0.00 mils 5 LF2 20.00
6 Contact Angle 0.00 6 Loop Balance 100.00 %
7 Contact Offset 0.00 mils 7 X Balance 100.00 %
8 LF4 100 % 8 Y Balance 100.00 %
9 Bleed Voltage 1000.00 mVolts 9 Shape Factor 0.00 deg
Done Parameter Set Done Parameter Set

Edit Loop Parameters Edit Loop Parameters

Group 1 Wire 1 Site 1 Group 1 Wire 1 Site 1
1 Edit GROUP 1 Edit GROUP
2 Wire Profile BGA3 LOW LOOP 2 Wire Profile BGA3 LOW LOOP
<<< Page 3 ( of 4 ) >>> <<< Page 4 ( of 4 ) >>>
3 Span Distance 0 3 Span Length 2 0 %
4 Auto Flat Length 0
5 Span Length 1 40 %
6 Flat Length 1 0.00 mils
7 Smoothness 25 %
8 Flat Smoothness 0.00 mils
9 Shape Factor 2 0.00 deg
Done Parameter Set Done Parameter Set

BGA3 Low Loop Profile

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Parameter Definition
Parameter Considerations and Definitions
The following parameters are used for the BGA3 Low Loop process. If you have worked with the “M
Loop” process, you may be familiar with most of these parameters.

Shape Factor 1 & 2

Defines how severe a bend is to be placed on a wire at the Span Length location by specifying the
angle of arc to be swept during the forming motion. Representations below show a wire with the shape
factor kink formed at the capillary tip bond.

USEAGE
Shape Factor is generally set around 20 degrees so that the highest point of the loop remains over the
first bond. Span Length and Shape Factor settings of 0 will provide a standard loop shape.

Shape Factor 1

Shape Factor 2

Shape Factor 1

Shape Factor 2

Shape Factor 1

Shape Factor 2

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Parameter Definitions
Span Length 1
Defines where, in the wire loop, the location of the Shape Factor 1 bend is formed in the wire.
Span Length 2
Defines where, in the wire loop, the location of the Shape Factor 2 bend is formed in the wire.

USEAGE
Used for low and / or long loops to add stiffness to the loop and reduce wire sway. Span Lengths of
less that half of the wire length provides better loop control, however longer lengths are possible
especially when incorporated with smoothness to create a BGA style loop.

Span Length 1
Span Length 2

Span Length 1

Span Length 2

Span Length 2

Span Length 1

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Parameter Definition
Smoothness & Flat Smoothness
Provides control over how localized a bend is produced by Shape Factor 1 by specifying a distance
that the wire bending is to begin spreading wire deformation out over the distance between
Smoothness and Flat Length 1. This creates a gentler curve to the wire as seen in the representations
below. To have an effect on the loop profile the smoothness factor needs to be set to a value less than
span length. Smoothness can be disabled by setting it to a value equal to Span Length.

USEAGE
Generally used where a gentle curve is desired instead of a more defined worked kink. A typical value
will be 20% when a rounded loop is desired or 100% when a worked loop is preferred.

Example Loop Shapes:

Rule: Smoothness < Span Length
Span Length = 85%
Smoothness = 55%

Rule: Smoothness < Span Length

Span Length = 85%
Smoothness = 65%

Rule: Smoothness < Span Length

Span Length = 85%
Smoothness = 75%

Rule: Smoothness >/= Span Length

Span Length = 85%
Smoothness = 86%

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Parameter Definition
LOOP BALANCE
Is a factor that is used to adjust the relative height between wires of varying length.

USEAGE
Loop Balance values >100% will raise the height of longer wires and lower the height of shorter wires.
Loop Balance values <100% will lower the height of longer wires and raise the height of shorter wires.

Loop Balance 95%

Short Wire Long Wire

Loop Balance 100%

Short Wire Long Wire

Loop Balance 105%

Short Wire Long Wire

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Parameter Definitions
Y Balance
Balances Loop heights between front and rear wires. Y Balance Adjust is a factor that is used to
equalize relative loop heights between front and backside wires. Values greater than 100% has the
affect of raising front-most wires and simultaneously lowering backside wire loops. In contrast, using
values less than 100% has the affect of lowering front-side wires while simultaneously raising
backside wire loops. The Y Balance setting of 100% has no effect on loop height.

USEAGE
Adjustments should be made in 0.2% increments and will require readjustments to loop factor after
loop heights are equalized.

Y REAR

Y REAR
X LEFT

X LEFT X RIGHT

X RIGHT
Y FRONT
Y FRONT

X Balance
A factor that is used to equalize relative loop heights between left-side and right-side wires. Values
greater than 100% has the affect of raising left-side wires and simultaneously lowering right-side wire
loops. In contrast, using values less than 100% has the affect of lowering left-side wires while
simultaneously raising right-side wire loops. An X Balance setting of 100% has no effect on loop
height.

USEAGE
Adjustments should be made in 0.2% increments and will require readjustments to loop factor after
loop heights are equalized.

Contact Angle
Sets the approach angle of the capillary to second bond.

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Parameter Definition
Contact Offset
Adjusts the second bond X, Y coordinates of the Z touchdown point towards first bond so that the
remainder of the XY motion is made with the capillary dragging along the surface.

USEAGE
Contact Angle and Contact Offset are used as a tool to modify the second bond impact
characteristics. The dragging motion can be used to elongate the second bond, this can help to pull
straight a swayed wire and to separate and weaken a tail bond from the second bond.

LF2 = 0

Contact Angle

Contact Offset

LF2 = 20 2nd Bond Point

TIP2

LF2
LF2 sets the distance the bond head moves parallel to the bond surface prior to making second bond.

USEAGE
LF2 is used to control the lay down of the wire. A value of 0 uses the belly of the wire to kick the loop
up so that a clearance can be created for ground bar clearances. A value of 20 will pull out on the
wire, laying the wire flat and usually providing better wire straightness.

Span Distance
Selects the method used to define Span Length 1, in percentage or mils.

Auto Flat Length

Adjust Flat Length distances based on wire angle.

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Starting Parameters
This section provides starting parameters and the recommended ranges to help you learn and
understand the BGA3process. It has been provided to serve as a starting point for your process, and
your specific application may require changes from some of these starting values.

The recommended starting parameter value is listed in the tables below.

Starting Parameters

Parameter BGA3 Low Loop BGA2 BGA2 Worked

Kink Height 6 6 6
Reverse Motion 6 6 6
Reverse Motion Angle 100 100 100
Bleed Voltage 1000 1000 1000
Span Length 1 33 75 75
Span Length 2 66 0 0
Shape Factor 1 -35 25 25
Shape Factor 2 45 0 0
Smoothness 45 45 80
Loop Factor -7 -7 -7
Loop Balance 100 100 100
X Balance 100 100 100
Y Balance 100 100 100
LF2 12 12 12
LF4 100 100 100
Impact Time 0 0 0
Contact Angle 0 0 0
Contact Offset 0 0 0

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Application
Application
The BGA3 profile has been modified to allow two methods for defining the first span length of the wire
loop. The current parameters "SPAN LENGTH 1" and "SMOOTHNESS" are defined as a percentage of the
wire length. The new additional parameters "FLAT LENGTH 1" and "FLAT SMOOTHNESS" are defined in
mils. The method is controlled by the parameter "SPAN DISTANCE" (0 – Percent, 1 – Mils). Defining
the lengths in mils, instead of a percentage, permits the automatic adjustment of the lengths based on
the wire angle. This may be required for corner wires where the clearance to the edge of the die is
larger. The "AUTO FLAT LENGTH" feature automatically adjusts the length of the flat from 1.0X (@
0/90/180/270 degrees) to a maximum of 1.4X (@ 45/135/225/315 degrees) based on the angle.

Generally used for low and / or long loops to add stiffness to the loop and reduce wire sway. Span
Lengths of less that half of the wire length provides better loop control, however longer lengths are
possible especially when incorporated with smoothness to create a BGA style loop. Shape Factor is
generally set around 20 degrees so that the highest point of the loop remains over the first bond.
Shape Factor may be set as a negative number to form an ‘M’ loop with the kink pointing down.
Span/Flat Length and Shape Factor settings of 0 will provide a standard loop shape.

"SMOOTHNESS/FLAT SMOOTHNESS" is generally used where a gentle curve is desired instead of a more
defined worked kink. A typical value will be 20% when a rounded loop is desired or 100% when a
worked loop is preferred.

The default for "SPAN DISTANCE" is 0 (percent). When Span Distance is set to 0 (percent) the
parameters "AUTO FLAT LENGTH", "FLAT LENGTH 1", and "FLAT SMOOTHNESS" are disabled.

The following procedure should be used to provide a low loop profile for use in a chip-scale application.
In cases such as this, the target loop height is <5 mils (Figure 1), with the loop being formed as close
to the die as possible.

1. Locate 2nd bond of the loops as close to the die edge of the leads as possible.
2. Set Span Distance = 1 (mils).
3. Set Auto Flat Length to 1 (ON).
4. Set Flat Length 1 equal to the distance from bond pad to die edge (X or Y direction).
5. Set Span Length 2 to approximately 50% to 70% of the wire length.
6. Set Shape Factor 1 to a positive value of 10° to 50° depending on the Span Distance parameter
setting. A setting of 1 (mils) requires a lower Shape Factor 1 setting.
7. Set Shape Factor 2 to a negative value of –10° to –30°.

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Sample Application
APPLICATION DESCRIPTION
Inspection Avg STD Min
Loop Height above ball 4.5 0.10 4.3
Loop Height top of loop - - -

LOOPING PARAMETERS
Parameter Value
Loop Profile BGA3 Low Loop
Kink Height 3
Reverse Motion 2
Loop Factor 2
Loop Balance 100
Contact Angle 0
Contact Offset 0
LF4 100
Impact Time 0
Rmot Angle 100
LF2 10
Shape Factor 1 40
Span Distance 1
Auto Flat Length 1
Flat Length 1 10
Flat Smoothness 10
Shape Factor 2 -25
Span Length 2 70

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA3 Low Loop Profile

Notes
This page is for additional notes by the user.

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November 27, 2001
Kulicke and Soffa Industries, Inc.
2101 Blair Mill Road, Willow Grove PA 19090 USA