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Textbook Ebook Gan Transistors For Efficient Power Conversion Third Edition de Rooij All Chapter PDF
Textbook Ebook Gan Transistors For Efficient Power Conversion Third Edition de Rooij All Chapter PDF
Third Edition
Alex Lidow
Efficient Power Conversion Corporation (EPC)
USA
Michael de Rooij
Efficient Power Conversion Corporation (EPC)
USA
Johan Strydom
Kilby Labs
Texas Instruments
USA
David Reusch
VPT, Inc.
USA
John Glaser
Efficient Power Conversion Corporation (EPC)
USA
This edition first published 2020
© 2020 John Wiley & Sons Ltd
Edition History
1e 2012 Power Conversion Publications, 2e 2015 Wiley
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The right of Alex Lidow, Michael de Rooij, Johan Strydom, David Reusch and John Glaser to be identified as the
authors of this work has been asserted in accordance with law.
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10 9 8 7 6 5 4 3 2 1
In memory of Eric Lidow, the original power conversion pioneer.
vii
Contents
Foreword xv
Acknowledgments xvii
9 RF Performance 201
9.1 Introduction 201
9.2 Differences Between RF and Switching Transistors 202
9.3 RF Basics 204
9.4 RF Transistor Metrics 205
9.4.1 Determining the High‐Frequency Characteristics of RF Transistors 206
9.4.2 Pulse Testing for Thermal Considerations 207
9.4.3 Analyzing the s‐Parameters 209
9.4.3.1 Test for Stability 209
9.4.3.2 Transistor Input and Output Reflection 210
9.4.3.3 Transducer Gain 211
9.4.3.4 Unilateral/Bilateral Transistor Test 211
9.5 Amplifier Design Using Small‐Signal s‐Parameters 212
9.5.1 Conditionally Stable Bilateral Transistor Amplifier Design 213
9.5.1.1 Available Gain 213
9.5.1.2 Constant Available Gain Circles 213
9.6 Amplifier Design Example 214
9.6.1 Matching and Bias Tee Network Design 216
9.6.2 Experimental Verification 219
9.7 Summary 221
References 221
13 Lidar 281
13.1 Introduction to Light Detection and Ranging (Lidar) 281
13.2 Pulsed Laser Driver Overview 281
13.2.1 Pulse Requirements 282
13.2.2 Semiconductor Optical Sources 284
13.2.3 Basic Driver Circuits 285
13.2.4 Driver Switch Properties 286
13.3 Basic Design Process 288
13.3.1 Resonant Capacitive Discharge Laser Driver Design 288
13.3.2 Quantitative Effect of Stray Inductance 289
13.4 Hardware Driver Design 290
13.5 Experimental Results 291
13.5.1 High‐Speed Laser Driver Design Example 291
13.5.2 Fastest 292
13.5.3 Highest Current 293
13.5.4 Low Voltage 293
13.6 Other Considerations 294
13.6.1 Resonant Capacitors 294
13.6.2 Charging 295
13.6.3 Voltage Probing 295
13.6.4 Current Sensing 296
13.6.5 Dual‐Edge Control 297
13.7 Summary 299
References 299
Contents xiii
Appendix 355
Index 361
xv
Foreword
It is well established that the CMOS inverter and DRAM are the two basic building
blocks of digital signal processing. Decades of improving inverter switching speed
and memory density under Moore’s Law has unearthed numerous applications that
were previously unimaginable. Power processing is built upon two similar functional
building blocks: power switches and energy storage devices, such as the inductor and
capacitor. The push for higher switching frequencies has always been a major catalyst
for performance improvement and size reduction.
Since its introduction in the mid‐1970s, the power MOSFET, with its greater switch-
ing speed, has replaced the bipolar transistor. To date, the power MOSFET has been
perfected up to its theoretical limit. Device switching losses can be reduced further with
the help of soft‐switching techniques. However, its gate‐drive loss is still excessive, lim-
iting the switching frequency to the low hundreds of kilohertz in most applications.
The recent introduction of GaN, with much improved figures of merit, opens the
door for operating frequencies well into the megahertz range. A number of design
examples are illustrated in this book and other literatures, citing impressive power
density improvements by a factor of 5 or 10. However, I believe the potential contri-
bution of GaN goes beyond the simple measures of efficiency and power density. GaN
has the potential to have a profound impact on our design practice, including a
possible paradigm shift.
Power electronics is interdisciplinary. The essential constituencies of a power elec-
tronics system include switches, energy storage devices, circuit topology, system packag-
ing, electromagnetic interactions, thermal management, EMC/EMI, and manufacturing
considerations. When the switching frequency is low, these various constituencies are
loosely coupled. Current design practices address these issues in piecemeal fashion.
When a system is designed for a much higher frequency, the components are arranged
in close proximity to minimize undesirable parasitics. This invariably leads to unwanted
electromagnetic coupling and thermal interaction.
This increasing intricacy between components and circuits requires a more holistic
approach, concurrently taking into account all electrical, mechanical, electromagnetic,
and thermal considerations. Furthermore, all operations should be executed correctly,
both spatially and temporally. These challenges would prompt circuit designers to
pursue a more integrated approach. For power electronics, integration will take place at
the functional level or the subsystem level whenever feasible and practical. These inte-
grated modules will serve as the basic building blocks of further system integration.
xvi Foreword
Acknowledgments
The authors wish to acknowledge the many exceptional contributions toward the
content of this book from our colleagues.
Dr. Edward Jones contributed to Chapters 3, 6, and 7 with significant content and
excellent insights into these as well as several other chapters. Dr. Yuanzhe Zhang is the
resident expert on envelope tracking and created much of the work behind Chapter 14
as well as numerous insights and suggestions on other chapters. Dr. Suvankar Biswas
did work supporting Chapters 5, 10, and 11. Steve Colino was the driving force behind
our class D audio in Chapter 12, while giving many suggestions and insights into almost
every chapter. Mohamed Ahmed, in addition to being a star Ph.D. candidate at Virginia
Tech, was a brilliant intern for EPC during the summer of 2018 and did much of the
experimental work behind the LLC converters in Chapter 10.
We would also like to acknowledge Jianjun (Joe) Cao, Robert Beach, Alana Nakata,
Guang Yuan Zhao, Yanping Ma, Robert Strittmatter, and Seshadri Kolluri for providing
much of the technical foundation behind GaN transistors and integrated circuits.
A special thank you is due to Joe Engle who, in addition to reviewing and editing all
corners of this work, put all the logistics together to make it happen. Sometimes this
logistics meant long continuous hours of editing, coupled with amazing diplomacy
working with a wide spectrum of personalities. Jenny Somers, the lead graphic artist on
this work, as well as many other GaN‐related papers and application notes, deserves a
medal of honor as well as an honorary degree in GaN for her creative, and extremely
accurate, projection of scientific data into documentary communications.
A note of gratitude to the editors and staff at Wiley who were instrumental in
undertaking a diligent review of the text and shepherding the book through the pro-
duction process.
Finally, we would like to thank Archie Huang and Sue Lin for believing in GaN from
the beginning. Their vision and support will change the semiconductor industry
forever.
GaN Transistors for Efficient Power Conversion, Third Edition. Alex Lidow, Michael de Rooij,
Johan Strydom, David Reusch and John Glaser.
© 2020 John Wiley & Sons Ltd. Published 2020 by John Wiley & Sons Ltd.
2 GaN Transistors for Efficient Power Conversion
All of these advantages stemmed from the basic physical properties of silicon
c ombined with a huge investment in manufacturing infrastructure and engineering. Let
us look at some of those basic properties and compare them with other successor
candidates. Table 1.1 identifies five key electrical properties of three semiconductor
materials contending for the power management market.
One way of translating these basic crystal parameters into a comparison of device
performance is to calculate the best theoretical performance achievable for each of the
three candidates. For power devices, there are many characteristics that matter in the
variety of power conversion systems available today. Five of the most important are:
conduction efficiency (on‐resistance), breakdown voltage, size, switching efficiency,
and cost.
In the next section, the first four of the material characteristics in Table 1.1 will be
reviewed, leading to the conclusion that both SiC [6] and GaN are capable of producing
devices with superior on‐resistance, breakdown voltage, and a smaller‐sized transistor
compared to Si. In Chapter 2, how these material characteristics translate into superior
switching efficiency for a GaN transistor will be explored and in Chapter 17, how a GaN
transistor can also be produced at a lower cost than a silicon MOSFET of equivalent
performance will be addressed.
The breakdown voltage of a device (VBR) is therefore proportional to the width of the
drift region (wdrift). In the case of SiC and GaN, the drift region can be 10 times smaller
than in silicon for the same breakdown voltage. In order to support this electric field,
there need to be carriers in the drift region that are depleted away at the point where the
device reaches the critical field. This is where there is a huge gain in devices with high
critical fields. The number of electrons (assuming an N‐type semiconductor) between
two terminals can be calculated using Poisson’s equation:
q ND o r Ecrit / wdrift (1.2)
In this equation q is the charge of the electron (1.6 · 10−19 C), ND is the total number of
electrons in the volume, ɛo is the permittivity of a vacuum measured in Farads per meter
(8.854 · 10−12 F/m), and ɛr is the relative permittivity of the crystal compared to a vac-
uum. In its simplest form under DC conditions, permittivity is the dielectric constant of
the crystal.
Referring to Eq. (1.2), it can be seen that if the critical field of the crystal is 10 times
higher, from Eq. (1.1), the electrical terminals can be 10 times closer together. Therefore,
the number of electrons, ND, in the drift region can be 100 times greater, but only have
one‐tenth the distance to travel. This is the basis for the ability of GaN and SiC to out-
perform silicon in power conversion.
where μn is the mobility of electrons. Combining Eqs. (1.1) to (1.3) produces the follow-
ing relationship between breakdown voltage and on‐resistance:
RDS on 4 V 2BR / o r r E 3crit (1.4)
This equation can now be plotted as shown in Figure 1.1 for Si, SiC, and GaN. This plot
is for an ideal structure. Real semiconductors are not always ideal structures and,
therefore, it is always a challenge to achieve the theoretical limit. In the case of silicon
MOSFETs, it took 30 years.
101
Si Limit
100
SiC Limit
RDS(on) (Ω mm2)
–1
10
GaN Limit
10–2
10–3
10–4
101 102 103 104
Breakdown Voltage (V)
Figure 1.1 Theoretical on‐resistance for a one square millimeter device versus blocking voltage
capability for Si, SiC, and GaN based power devices.
Si
Ga
C
N
(a) (b)
higher the strain, the greater the electric field. By growing a thin layer of AlGaN on top
of a GaN crystal, a strain is created at the interface that induces a compensating 2DEG,
as shown schematically in Figure 1.3 [7–9]. This 2DEG is used to efficiently conduct
electrons when an electric field is applied across, as shown in Figure 1.4.
This 2DEG is highly conductive, in part due to the confinement of the electrons to a
very small region at the interface. This confinement increases the mobility of electrons
from about 1000 cm2/V·s in unstrained GaN to between 1500 and 2000 cm2/V s in the
2DEG region. The high concentration of electrons with very high mobility is the basis
for the HEMT, the primary subject of this book.
6 GaN Transistors for Efficient Power Conversion
AIGaN
GaN
Figure 1.3 Simplified cross section of a GaN/AlGaN heterostructure showing the formation of a 2DEG
due to the strain‐induced polarization at the interface between the two materials.
Current Flow
AIGaN
GaN
Figure 1.4 By applying a voltage to the 2DEG an electric current is induced in the crystal.
Christmas before the war. There never will be another in any land,
with any peoples, like the Christmas of 1859—on the old plantation.
Days beforehand preparations were in progress for the wedding at
the quarters, and the ball at the “big house.” Children coming home
for the holidays were both amused and delighted to learn that Nancy
Brackenridge was to be the quarter bride. “Nancy a bride! Oh, la!”
they exclaimed. “Why Nancy must be forty years old.” And she was
going to marry Aleck, who, if he would wait a year or two, might
marry Nancy’s daughter. While the young schoolgirls were busy
“letting out” the white satin ball dress that had descended from the
parlor dance to the quarter bride, and were picking out and
freshening up the wreath and corsage bouquet of lilies of the valley
that had been the wedding flowers of the mistress of the big house,
and while the boys were ransacking the distant woods for holly
branches and magnolia boughs, enough for the ballroom as well as
the wedding supper table, the family were busy with the
multitudinous preparations for the annual dance, for which Arlington,
with its ample parlors and halls, and its proverbial hospitality, was
noted far and wide.
The children made molasses gingerbread and sweet potato pies,
and one big bride’s cake, with a real ring in it. They spread the table
in the big quarters nursery, and the boys decorated it with greenery
and a lot of cut paper fly catchers, laid on the roast mutton and pig,
and hot biscuits from the big house kitchen, and the pies and cakes
of the girls’ own make. The girls proceeded to dress Nancy
Brackenridge, pulling together that refractory satin waist which,
though it had been “let out” to its fullest extent, still showed a sad
gap, to be concealed by a dextrous arrangement of some discarded
hair ribbons. Nancy was black as a crow and had rather a startling
look in that dazzling white satin dress and the pure white flowers
pinned to her kinks. At length the girls gave a finishing pat to the
toilet, and their brothers pronounced her “bully,” and called Marthy
Ann to see how fine her mammy was.
As was the custom, the whole household went to the quarters to
witness the wedding. Lewis, the plantation preacher, in a cast-off
swallow-tail coat of Marse Jim’s that was uncomfortably tight,
especially about the waist line, performed the ceremony. Then my
husband advanced and made some remarks, to the effect that this
marriage was a solemn tie, and there must be no shirking of its
duties; they must behave and be faithful to each other; he would
have no foolishness. These remarks, though by no means elegant,
fitted the occasion to a fraction. There were no high flights of
eloquence which the darky mind could not reach, it was plain,
unvarnished admonition.
The following morning, Christmas Day, the field negroes were
summoned to the back porch of the big house, where Marse Jim,
after a few preliminary remarks, distributed the presents—a head
handkerchief, a pocketknife, a pipe, a dress for the baby, shoes for
the growing boy (his first pair, maybe), etc., etc., down the list. Each
gift was received with a “Thankee, sir,” and, perhaps, also a remark
anent its usefulness. Then after Charlotte brought forth the jug of
whisky and the tin cups, and everyone had a comforting dram, they
filed off to the quarters, with a week of holiday before them and a trip
to town to do their little buying.
James Alexander McHatton
The very last Christmas on the old plantation we had a tree. None
of us had ever seen a Christmas tree; there were no cedars or pines,
so we finally settled upon a tall althea bush, hung presents on it, for
all the house servants, as well as for the family and a few guests.
The tree had to be lighted up, so it was postponed till evening. The
idea of the house servants having such a celebration quite upset the
little negroes. I heard one remark, “All us house niggers is going to
be hung on a tree.” Before the dawn of another Christmas the
negroes had become discontented, demoralized and scattered, freer
than the whites, for the blacks recognized no responsibilities
whatever. The family had abandoned the old plantation home. We
could not stand the changed condition of things any longer, and the
Federals had entered into possession and completed the ruin. Very
likely some reminiscent darky told new-found friends, “All de house
niggers was hung on a tree last Christmas.” I have heard from
Northern lips even more astonishing stories of maltreated slaves
than a wholesale hanging.
Frequently before the holidays some of the negroes were
questioned as to what they would like to have, and the planter would
make notes and have the order filled in the city. That, I think, was the
custom at Whitehall plantation. I was visiting there on one occasion
when a woman told Judge Chinn she wanted a mourning veil. “A
mourning veil!” he replied. “I thought you were going to marry Tom
this Christmas?” “I is, marster, but you know Jim died last grinding,
and I ain’t never mourned none for Jim. I want to mourn some ’fore I
marries ag’in.” I did not remain to see, but I do not doubt she got the
mourning veil and had the melancholy satisfaction of wearing it
around the quarter lot a few days before she married Tom.
After the departure of our happy negroes, whose voices and
laughter could be heard long after the yard gate was closed and they
had vanished out of sight, we rushed around like wild to complete
preparations for the coming ball guests. They began to arrive in the
afternoon from down the coast and from the opposite side of the
river. Miles and miles some of them drove in carriages, with
champagne baskets, capital forerunners of the modern suit case,
tied on behind, and, like as not, a dusky maid perched on top of it;
poor thing, the carriage being full, she had to travel in that precarious
way, holding on for dear life. Those old-time turtle-back vehicles had
outside a small single seat for the coachman only. Parties came also
in skiffs, with their champagne baskets and maids. Long before time