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CMP 222 Use of MSI, LSI and VLSI IC' Hardware Design
CMP 222 Use of MSI, LSI and VLSI IC' Hardware Design
Design
• Integration –integration: the joining of capacitors, resistors, diodes
and transistors, by wires or by printed circuit boards (PCB)to form a
circuit so as to save cost, energy and enhance speed. These are
usually joined by soldering and are called Discrete Circuits
• MSI- Less than 500 components (more than 10 but less than 100
gates)
• LSI- More than 500 components but less than 300000 (more than
100 gates)
• 2. (Bipolar Technology)
• 3. IC Fabrication
• Fabrication Process
• Example of a Diode and a MOSFET
• 5. Interconnects
Storage Devices
» Primary and Secondary memories
» Primary Storage
» Also known as main memory.
» Main memory is directly or indirectly
connected to the central processing unit via a
memory bus.
• The CPU continuously reads instructions
stored there and executes them as required.
• Example:
– RAM
– ROM
– Cache
Primary Storage RAM
• It is called Random Access Memory because any of the
data in RAM can be accessed just as fast as any of the
other data.
• Dynamic RAM
• • Slower
• • Less expensive
• • Less power consumption
• • Needs to be refreshed thousands of times per second
Primary Storage ROM
•
• • This memory is used as the computer begins to boot up.