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HFA30PB60
HFA30PB60
HEXFRED®
Ultrafast Soft Recovery Diode, 30 A
FEATURES
• Ultrafast recovery
• Ultrasoft recovery
• Very low IRRM
• Very low Qrr
• Guaranteed avalanche
• Specified at operating conditions
• Designed and qualified for industrial level
Base
common
cathode BENEFITS
• Reduced RFI and EMI
2 • Reduced power loss in diode and switching transistor
• Higher frequency operation
• Reduced snubbing
• Reduced parts count
1 3 DESCRIPTION
Anode Anode
1 2
HFA30PB120 is a state of the art center tap ultrafast
recovery diode. Employing the latest in epitaxial construction
and advanced processing techniques it features a superb
TO-247AC modified combination of characteristics which result in performance
which is unsurpassed by any rectifier previously available.
With basic ratings of 1200 V and 30 A continuous current, the
HFA30PB120 is especially well suited for use as the
PRODUCT SUMMARY companion diode for IGBTs and MOSFETs. In addition to
VR 1200 V ultrafast recovery time, the HEXFRED® product line features
extremely low values of peak recovery current (IRRM) and
VF at 30 A at 25 °C 4.1 V does not exhibit any tendency to “snap-off” during the
IF(AV) 30 A tb portion of recovery. The HEXFRED features combine to
offer designers a rectifier with lower noise and significantly
trr (typical) 47 ns lower switching losses in both the diode and the switching
TJ (maximum) 150 °C transistor. These HEXFRED advantages can help to
significantly reduce snubbing, component count and
Qrr (typical) 120 nC
heatsink sizes. The HEXFRED HFA30PB120 is ideally
dI(rec)M/dt (typical) at 125 °C 240 A/µs suited for applications in power supplies and power
IRRM (typical) 4.7 A conversion systems (such as inverters), motor drives, and
many other similar applications where high speed, high
efficiency is needed.
10
T J = 125°C
1
Tj = 175°C
T J = 25°C
IF, Instantaneous Forward Current (A)
0.1
200 400 600 800 1000 1200
10
Fig. 2 - Typical Reverse Current vs.
Reverse Voltage
Tj = 125°C 1000
Tj = 25°C
100 TJ = 25°C
1
1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0
Fig. 1 - Typical Forward Voltage Drop vs. Fig. 3 - Typical Junction Capacitance vs.
Instantaneous Forward Current Reverse Voltage
1
Thermal Response ( Z thJC )
D = 0.50
0.1
0.20
R1 R2 R3
R1 R2 R3 Ri (°C/W) τi (sec)
0.10 τJ τC 0.234 0.000100
τJ τ
0.05
τ1 τ2 τ3
0.02 τ1 τ2 τ3 0.069 0.000434
0.01 0.01
Ci= τi/Ri 0.056 0.002202
SINGLE PULSE Ci i/Ri
( THERMAL RESPONSE ) Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
1E-006 1E-005 0.0001 0.001 0.01 0.1
300 3000
VR = 390V VR = 390V
I = 60A
275 T J = 25°C _____ IF = 60A TJ = 25°C _____ F
T J = 125°C ---------- TJ = 125°C ---------- F = 30A
I
250 IF = 30A 2500 IF = 15A
IF = 15A
225
200 2000
175
Qrr (nC)
trr (ns)
150 1500
125
100 1000
75
50 500
25
0 0
100 150 200 250 300 350 400 450 500 100 200 300 400 500
diF /dt (A/µs) diF /dt (A/µs)
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt Fig. 7 - Typical Stored Charge vs. dIF/dt
(Per Leg) (Per Leg)
35 900
V = 390 V VR = 390V
R
T = 25 °C _____ TJ = 25°C _____
J
T = 125 °C ----------
800
30 J TJ = 125°C ----------
700
IF = 60 A
25 IF 15 A
IF = 30 A
600
di(rec)M / dt (A/µs)
IF = 15 A
20
IR R M (A)
500
15 400
IF = 30 A
300
10
200 IF = 60 A
5
100
0 0
100 150 200 250 300 350 400 450 500 100 150 200 250 300 350 400 450 500
Fig. 6 - Typical Recovery Current vs. dIF/dt (Per Leg) Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt
(Per Leg)
VR = 200 V
0.01 Ω
L = 70 µH
D.U.T.
D
dIF/dt
adjust
G IRFP250
(3)
trr
IF
ta tb
0
(4)
Qrr
(2)
IRRM 0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(1) dIF/dt - rate of change of current (4) Qrr - area under curve defined by trr
through zero crossing and IRRM
trr x IRRM
(2) IRRM - peak reverse recovery current Qrr =
2
(3) trr - reverse recovery time measured
(5) dI(rec)M/dt - peak rate of change of
from zero crossing point of negative
current during tb portion of trr
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
Fig. 10 - Reverse Recovery Waveform and Definitions
L = 100 µH IL(PK)
High-speed
switch
D.U.T.
Rg = 25 Ω Freewheel
diode +
Current Vd = 50 V Decay
monitor time
V(AVAL)
VR(RATED)
1 2 3 4 5 6
1 - HEXFRED® family
2 - Process designator: A = Electron irradiated
B = Platinum diffused
3 - Current rating (30 = 30 A)
4 - Package outline (PB = TO-247, 2 pins)
5 - Voltage rating (120 = 1200 V)
6 - None = Standard production
PbF = Lead (Pb)-free
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