VLSI INTECONNECT

DEF:

material used in interconnect

Copper : replaced aluminium as interconnect material

CNT (carbon nano tubes): graphene sheets rolled in

cylindrical form

Graphene nano ribbons: CNT unrolled are graphene nano

ribbons

INTRODUCTION : CARBON NANO TUBES

DEF:
of the

These are graphene sheets rolled up into cylinders with diameter

order of nanometers.

Important properties comparing with Cu

High mechanical strength

High thermal stability

Large current carrying capacity

Large mean free path

CONT..

CLASSIFICATION OF CNT

ON THE BASIS OF CHILARITY

Metallic CNT : contribute to current conduction

Semiconducting CNT: Does not contribute to current conduction

ON THE BASIS OF STRUCTURE

SWCNT : only one thin wall of graphene sheets rolled

MWCNT : multiple concentric CNT with varing diameter

CNT VS COPPER AS INTERCONNECT

Properties

CNT

COPPER

Mean free path(nm ) @ room temp

> 1000

40

Max current density

>1x10*10

1x10*6

Thermal conductivity

5800

385

SWCNT VS COPPER

Resistance comparison

CAPACITANCE COMPARISON

SUMMARY

CNT are the promising candidate of future vlsi interconnect. They are
mechanically and thermally stable and are prone to electromigration.
Due to lack of technology manufacturing of CNT is difficult and
unwanted contact resistance is included. The resistance of CNT is
much lower than copper while the capacitance is larger but the delay
product of CNT is lower than copper making it suitable for interconnect
application and better than copper.At the same time graphene nano
ribbons are introduced which are easy to manufacture when compared
with CNT.

references
1.

K. Banerjee and N. Srivastava, Are carbon nanotubes the future of VLSI interconnections?, in
Proc. Des. Autom. Conf., 2006, pp. 809814.

2.

A. Naeemi, et al., Performance Comparison between Carbon Nanotube and Copper

Interconnects for GSI, IEEE International Electron Devices Meeting, 2004, pp. 699-702.

3.

F. Kreupl, A. P. Graham, G. S. Duesberg, W. Steinhoegl, M. Liebau, E. Unger, W. Hoenlein, Carbon

nanotubes in interconnect applications, Microelectronic Engineering 64 (2002) 399.408

4.

Mayank Kumar Rai, Sankar Sarkar, Carbon Nano Tube as VLSI Interconnect, Electronic
Properties of Carbon Nanotubes,intech,2011

5.

A. Naeemi, et al., Performance Comparison between Carbon Nanotube and Copper

Interconnects for Gigascale Integration(GSI), IEEE Electron Device Letters, Vol. 26, No.2, pp. 8486, 2005

6.

A. Naeemi and J. D. Meindl, "Monolayer Metallic NanotubeInterconnects: Promising Candidates

for Short Local Interconnects", IEEE Electron Device Letters, Vol. 26, No. 8, pp.544-546, 2005.

7.

Srivastava, N. and Banerjee, K., Performance Analysis of Carbon Nanotube Interconnects for
VLSI Applications, ICCAD, pp. 383-390,2005,.