Design Dengan Microstrip

Sukiswo
sukiswok@yahoo.com

Elektronika Telekomunikasi, Sukiswo ST, MT 1

Outline
Pengertian
Design Dengan Microstrip
Microstrip sebangai saluran transmisi (line
transmission)
Microstrip as Equivalent Componen
Distributed Equivalent Component Design
Pengertian
Microstrip is a type of electrical
transmission line which can be fabricated
using printed circuit board [PCB]
technology, and is used to convey
microwave-frequency signals.
It consists of a conducting strip separated
from a ground plane by a dielectric layer
known as the substrate.
Pengertian

Cross-section of microstrip geometry.

Conductor (A) is separated from ground
plane (D) by dielectric substrate (C). Upper
dielectric (B) is typically air.
Pengertian
Band Stop Filter 1 GHz
Pengertian
Power Divider 1 GHz
Pengertian
Microwave components such as antennas,
couplers, filters, power dividers etc. can be
formed from microstrip, the entire device
existing as the pattern of metallization on
the substrate.
Microstrip is thus much less expensive than
traditional waveguide technology, as well as
being far lighter and more compact.
Pengertian
The disadvantages of microstrip compared with waveguide
are the generally lower power handling capacity, and
higher losses.
Also, unlike waveguide, microstrip is not enclosed, and is
therefore susceptible to cross-talk and unintentional
radiation.
For lowest cost, microstrip devices may be built on an
ordinary FR4 (standard PCB) substrate.
However it is often found that the dielectric losses in FR4
are too high at microwave frequencies, and that the
dielectric constant is not sufficiently tightly controlled.
For these reasons, an alumina substrate is commonly used.
Pengertian
On a smaller scale, microstrip transmission lines
are also built into monolithic microwave integrated
circuits [MMIC]s.
Microstrip lines are also used in high-speed digital
PCB designs, where signals need to be routed from
one part of the assembly to another with minimal
distortion, and avoiding high cross-talk and
radiation.
Microstrip is very similar to stripline and coplanar
waveguide [CPW], and it is possible to integrate all
three on the same substrate.
Design With Microstrip
At microwave frequencies, microstrip is employed not only as a
transmission line on PCBs, but also as equivalent passive
components, tuned circuits, and high-Q microwave filters and
resonators.
Design With Microstrip
Microstrip transmission line is used in microwave
applications due to its low loss, low cost, small size, ease of
implementation, and the ability to mount components, such
as surface-mount capacitors, resistors, and transistors,
directly onto the microstrip itself.
Design With Microstrip
Most microstrips are unbalanced transmission lines and, because of their
unshielded nature, can radiate some RF.
However, radiations from properly terminated microstrips are fairly
small.
Stripline (Fig. 1.42) is similar to microstrip, but is placed between the
metallization layers of a PCB and, due to these balanced twin
groundplanes, does not radiate.
Design With Microstrip
The characteristic impedance of microstrip transmission
line is governed by the width of the conductor, the
thickness of the dielectric, and the dielectric constant; with
low impedance microstrip lines being wide, and high
impedance microstrip lines being narrow
But the most important attribute of terminated microstrip as
transmission line is that its impedance does not change with
frequency, or with length.
The normal characteristic impedances of microstrip and
stripline are designed to be anywhere between 10 to 110 ,
with 50 being the universal norm for RF transmission
line use.
Microstrip is very common in frequencies of operation at
250 MHz and above
Microstrip as Transmission Line
A 50- microstrip is utilized in microwave circuits to
prevent reflections and mismatch losses between
physically separated components, with a calculated
nominal width that will prevent the line from being either
inductive or capacitive at any point along its length.
In fact, with a sources output impedance matched to the
microstrip, and the microstrip matched to the input
impedance of the load, no standing or reflected waves will
result.
Consequently, there will be no power dissipated as heat,
except in the actual resistance of the copper and dielectric
as I2R losses.
Microstrip as Transmission Line
In microstrip, the dielectric constant (Er) of the
PCBs substrate material will not be the sole Er
that the microstrip transmission line itself sees.
This is due to the flux leakage into the air above
the PC board, combined with the flux penetrating
into the dielectric.
So the actual effective dielectric constant (EEFF),
which is the true dielectric constant that the
microstrip will now see, will be at some value
between the surrounding air and the true dielectric
constant of the PCB.
Microstrip as Transmission Line
Due to the small RF field leakage that emanates
from all microstrips, these types of transmission
lines should be isolated by at least two or more line
widths away from other traces and circuits in order
to decrease any mutual coupling effects.
To lower the chances of crosstalk even further an
isolation ground trace may possibly be necessary
between two such lines.
To decrease any impedance bumps at high
microwave frequencies, microstrip should always
be run as short and as straight as possible, with any
angle using a mitered or slow round bend (Fig.
1.43)
Microstrip as Transmission Line
Another issue to watch for when designing microwave circuits with microstrip
transmission lines is the waveguide effect (see RF Shielding Resonances): Any
metal enclosure that is used to shield the microstrip, or its source or load
circuit, may act as a waveguide, and drastically alter the circuits behavior.
This effect can be eliminated by changing the width of the shield to cover a
smaller area, or by inserting a special microwave foam attenuator material
within the top of the enclosure.
Design with Microstrip
Use the following equation to plug in different
microstrip widths to obtain the desired impedance:

Where
ZO = characteristic impedance of the microstrip,
W = width of the microstrip conductor (use same units as h below)
h = thickness of the substrate between the groundplane and the microstrip
conductor (use same units as W)
Er = dielectric constant of the board material
Microstrip as Equivalent Componen
Distributed components, such as inductors and
capacitors, can be formed from microstrip
transmission-line sections on PCBs at microwave
frequencies.
A series or shunt inductor can be formed from a
thin trace (Fig. 1.44),
A shunt capacitor can be formed from a wide trace
(Fig. 1.45),
And even a transformer can be formed by varying
the width of the microstrip (Fig. 1.46).
Microstrip as Equivalent Componen
Microstrip as Equivalent Componen
Microstrip as Equivalent Componen
Microstrip as Equivalent Componen
Distributed equivalent microstrip works in replicating a
lumped component because high impedance (thin)
microstrip traces possess very little capacitance (due to the
small surface area of the structure), but possessing a useful
amount of inductance.
This inductance is caused by the current flowing through
the constricted microstrip element, which is both thin and
long.
In other words, we are taking a normal 50- microstrip,
with its built-in distributed inductance and capacitance that
makes the microstrip line 50 throughout its entire length,
and simply minimizing the capacitance, while maximizing
its inductance.
Microstrip as Equivalent Componen
The reverse is also true if we want to create a distributed
capacitor, since the 50- microstrip can now be formed as
a wide strip, with the PCBs copper groundplane and its
dielectric being located directly beneath it.
Thus, the much larger surface area of this fatter microstrip
(over its 50- configuration) appears as a capacitor at RF
frequencies.
However, we cannot accurately, nor with any value above
1 pF or so, replicate series capacitors in distributed form,
so we should select an appropriate lumped matching
network that is devoid of any such series capacitors, and
then convert it to a distributed structure.
Microstrip as Equivalent Componen
The accuracy of the equivalency itself will only be exact
for frequencies that are less than 30 long across the
distributed equivalent shunt component.
Equivalency is still possible with longer lengths, but
keeping all equivalent component elements at less than 30
will supply the best performance.
Maintaining this shorter length in the distributed
component design will sometimes demand compensating,
which we can do by narrowing the distributed inductors
trace width (increasing impedance), or widening the
distributed capacitor trace width (decreasing impedance),
to keep the total length under 30.
Due to the increased losses and the lack of width
repeatability during board fabrication, we cannot normally
use equivalent inductors that are narrower than 6 mils.
Distributed Equivalent Component Design
As stated above, it is important to strive to make a
distributed component shorter than 30 out of the 360 of an
entire wavelength, or the equivalent component effect will
begin to depart more and more from that of an ideal lumped
component.
To calculate how long 30 is out of 360, simply divide 30
by 360, then multiply this value by the actual wavelength of
the signal on the PCB, keeping in mind that the signals
wavelength in the substrate will not be the same as if it were
traveling through a vacuum.
To find the actual wavelength of the signal, which is being
slowed down by the PCBs substrate material, calculate the
microstrips velocity of propagation (VP).
First, find the effective dielectric constant (EEFF) of the
microstrip, since the signal will be partly in the dielectric
and partly in the air above the microstrip, which affects the
propagation velocity through this combination of the two
dielectric mediums.
Distributed Equivalent Component Design
First, find the effective dielectric constant (EEFF) of the
microstrip, since the signal will be partly in the dielectric and
partly in the air above the microstrip, which affects the
propagation velocity through this combination of the two
dielectric mediums.
Distributed Equivalent Component Design
Distributed Equivalent Component Design
Distributed Equivalent Component Design
Perhitungan Microstrip
Perhitungan Microstrip
Perhitungan Microstrip
Perhitungan Microstrip
Perhitungan Microstrip
Perhitungan Microstrip
Perhitungan Microstrip
Perhitungan Microstrip