MODERN TECHNIQUES USED

IN METAL JOINING
UNDER GUIDANCE OF
MR. R.V. SINGH
PRAKASH RANJAN
ROHIT MANAKIA
CONTENT

• ABSTRACT
• INTRODUCTION
• ADHESIVE BONDING
• STRUCTURAL ADHESIVE
• MACHINERY ADHESIVE
• MESO GLUE
• REFERENCE
ABSTRACT

Advancements in nanoscience are making it possible to metallically glue two solids

together at room temperature, in air, and under a small amount of mechanical pressure.
Metallic glues can serve as excellent conductors for heat dissipation and electrical
current in electronic devices and also as leak-resistant seals for vacuum
environments.Adhesives offer several advantages that make them an attractive
alternative to mechanical fastening or thermal joining, such as welding, soldering, and
brazing. Advantages include the following: They can be effective on dissimilar metal
substrates with dissimilar melting points; they do not cause distortion, discoloration, or
weld worms; holes do not need to be drilled into the material in preparation for
fasteners; and they distribute stress load evenly over a broad area.
INTRODUCTION

Metal joining is defined as joining of two metal parts either temporarily

or permanent with or without the application of heat and pressure. In
other words, Metal joining is a controlled process used to fuse metals.
There are several techniques of metal joining of which welding is one of
the more basic forms. Expertise and technological advances have enabled
metal joining innovations, which in turn have lead to component
advances in many industrial sectors, including aerospace.
ADHESIVE BONDING

Adhesive bonding (also referred to as gluing or glue bonding) describes a wafer bonding technique with
applying an intermediate layer to connect substrates of different materials. These produced connections
can be soluble or insoluble. The bonding procedure is based on polymerization reaction of organic
molecules to form long polymer chains during annealing. The intermediate layer is applied by spin-on,
spray-on, screen-printing, embossing, dispensing or block printing on one or two substrate surfaces. The
adhesive layer thickness depends on the viscosity, rotational speed and the applied tool pressure. The
commercially available adhesive can be organic or inorganic and is deposited on one or both substrate
surfaces. Adhesive bonding has the advantage of relatively low bonding temperature as well as the
absence of electric voltage and current. Based on the fact that the wafers are not in direct contact, this
procedure enables the use of different substrates, e.g. silicon, glass, metals and other semiconductor
materials. The procedure enables bonding temperatures from 1000 °C down to room temperature.
The most important process parameters for achieving a high bonding strength are:
• adhesive material
• coating thickness
• bonding temperature
• processing time
• chamber pressure
• tool pressure
STRUCTURAL ADHESIVE

Metal substrates and adhesives have widely different coefficients of thermal

expansion (CTE), which, during repeated heating and cooling, can cause the
bonded joint to weaken. Some adhesives are sufficiently resilient to
accommodate these stresses. Also, for metals such as aluminum and steel that
can form a loose oxide layer in moist environments, some adhesives prevent
moisture from reaching the metal surface in the bond joint.
Seven "families" of adhesives are commonly used to bond metal. The four
adhesive technologies most commonly used for metal bonding—two-part no-
mix acrylics; two-part mix acrylics; two-part epoxies; and polyurethanes—
deliver high bond strength and can withstand harsh environments.
The remaining three chemistries— cyanoacrylates, light-cure acrylics, and
silicones—are suitable for specific applications but are either less capable of
withstanding harsh environments or offering the high bond strength of the other
families.
MACHINERY ADHESIVES

The term machinery adhesives refers to the family of anaerobic adhesives that are
typically used in applications such as threadlocking; retaining rigid, cylindrical
assemblies; and sealing between flanges. An anaerobic adhesive remains liquid until it
is isolated from oxygen in the presence of active metal ions, such as iron or copper.
For example, when an anaerobic adhesive is sealed between a nut and a bolt on a
threaded assembly, it rapidly cures, or hardens, to form a tough, crosslinked plastic
with tenacious adhesion to many metals. Though anaerobic applications differ widely,
in most cases the adhesive provides high shear strength and exhibits very little flexing
or peel forces.
MESO GLUE

Metallic glues can serve as excellent conductors for heat dissipation and electrical
current in electronic devices and also as leak-resistant seals for vacuum environments.
The potential market for these applications is extensive and growing rapidly.
It is common practice to join two solids together using a third substance for gluing or
soldering. Metallic gluing refers to the process of joining two solids with metal as the
connecting party, which operates at room temperature, in air, and under low pressure.
Metallic glues feature the combined advantages of the ambient condition of gluing and
the superior properties of the joint from high- temperature soldering (or welding and
brazing), making them beneficial to many advanced technologies.
Usually, joining of two metal objects either by welding or soldering them – depending on how big they
are. Both processes involve the application of heat, however. This can damage the items (in the case of
electronics), or even cause explosions (in the case of things like gas pipes). That's why scientists at
Boston's Northeastern University created MesoGlue. It's a glue that bonds metal to metal – or to other
materials – and it sets at room temperature. MesoGlue is made up of microscopic nanorods that have a
metal core. Some of them are coated with the element indium, and some with gallium. The facing
surfaces of the two objects-to-be-joined are first treated with these rods. A layer of the indium-coated rods
is applied to one surface, while a layer of the gallium-coated rods goes on the other. In both cases the rods
stand up from the surface, sort of like the bristles of a hairbrush. When the heads of the brushes mash
together, all the little bristles push past each other so the two brushes are basically stuck together. The
interlacing process is fairly similar in this glue. The bristles are spaced well enough so they can slide or
be pressed in between each other.
When the indium and gallium on the rods come into contact, they form a liquid. The
metal cores of the rods then react with that liquid, causing it to harden into a cohesive
solid. This results in a bond that reportedly matches the strength of a traditional weld
or solder. Additionally, unlike those formed by regular polymer-based glues,
MesoGlue bonds are thermally and electrically conductive, they aren't adversely
affected by heat, they're highly resistant to air/moisture leaks, and they require little
pressure when being formed. Additionally, unlike those formed by regular polymer-
based glues, MesoGlue bonds are thermally and electrically conductive, they aren't
adversely affected by heat, they're highly resistant to air/moisture leaks, and they
require little pressure when being formed.
REFERENCE

• The Fabricator, January 9. 2007, Patrick Courtney

• Stephen Stagon, Alex Knapp, Paul Elliott and Hanchen
Huang. Metallic
Glue for Ambient Environments Making Strides. Advanced Materials &
Processes, January 2016