TITLE

INSTITUTION: DEDAN KIMATHI UNIVERSITY

COURSE: BSc. EEE

DEPARTMENT: ELECTRICAL DEPT

NAME: AQUILA SCEVA E021-01-1237/2022

LECTURER’S NAME: MR. MBUTHIA ELIAS

YEAR: 2023

UNIT NAME WORKSHOP PRACTISE II

UNIT CODE: EEE2103

TASK: SOLDERING

EXPERIEMENT DATE: 09/06/2023

SUBMISSION DATE: 14/06/2023

 AIMS AND OBJECTIVES
 These bonds of the Soldering is used to join metal parts to form a mechanical or electrical
bond.
 Metal parts form a connection when solder solidifies

INTRODUCTION
Soldering is a process of joining two metal surfaces together using a filler metal called solder.It
involves heating the surfaces to be joined and melting the solder, which is then allowed to cool

and solidify.

TYPES OF SOLDERING

1. soft soldering, which originally used a tin-lead alloy as the filler metal.
2. silver soldering, which uses an alloy containing silver.
3. brazing which uses a brass alloy for the filler.

Soft soldering is the most common, and widely used on electrical components. It is
considered good when flows of electrons in a circuit and good strength of the joint and in
this practical, soft soldering was employed. Soldering is an essential skill for those wishing
to work with electronic devices and systems. Soldering enables the rapid and reversible
formation of electrical connections. With some knowledge and practice, this skill can be
easily developed, and enjoyed, by anyone.

THEORY
The theory behind soldering involves the principles of metallurgy and
heat transfer. The solder typically has a lower melting point than the
metals being joined, allowing it to melt and flow between the surfaces
to create a strong bond when it solidifies

Some of the key principles to consider when soldering are as follows:

1. Soldering creates a metallurgical bond between the solder and the

base metals. When the solder melts, it forms a liquid phase that
interacts with the metal surfaces, creating interatomic bonds through
diffusion and intermetallic compound formation.
2. Wetting is the ability of the molten solder to spread and adhere to the
metal surfaces being joined. Good wetting is essential for achieving a
strong bond. Factors influencing wetting include surface cleanliness,
surface roughness, and the chemical composition of the metals and
solder.
3. Proper surface preparation is crucial for successful soldering. The
metal surfaces to be soldered should be clean, free of oxides, and
properly tinned. Tinning refers to the process of coating the surface
with a thin layer of solder, improving wetting and bonding.
4. Soldering requires controlled heat transfer to melt the solder without
damaging the surrounding components. The heat source, such as a
soldering iron or a reflow oven, should provide sufficient heat to
reach the solder's melting point while minimizing excessive heating of
the base metals.
5. Flux is a chemical agent used in soldering to promote wetting and
prevent oxidation. Flux removes oxides from the metal surfaces,
allowing the solder to bond properly. Flux can be in the form of a
liquid, paste, or core within the solder wire.
6. Temperature profile and soldering time: Different soldering
applications require specific temperature profiles and soldering times.
The temperature should be high enough to melt the solder but not
excessively prolong the exposure to heat, which can cause damage or
thermal stress to the components.
7. Intermetallic compounds: During soldering, intermetallic compounds
(IMCs) can form at the interface between the solder and the base
metals. These compounds contribute to the strength and reliability of
the solder joint. However, excessive or uneven IMC formation can
lead to brittle joints or reliability issues.

When performing soldering work, it is important to take several

precautions to ensure personal safety, prevent damage to components,
and achieve successful solder joints.
Here are some of the precaution measures to take to achieve that :

1. Always wear appropriate personal protective equipment (PPE), such

as safety glasses or goggles, to protect your eyes from potential solder
splashes or debris. Depending on the situation, you may also need to
wear gloves to protect your hands from burns or chemicals.
2. Ensure proper ventilation in the soldering area to minimize exposure
to solder fumes. Use a fume extractor or work in a well-ventilated
space to prevent inhalation of potentially harmful gases or particles.
3. Maintain a clean and organized workspace to prevent accidents and
mishaps. Keep flammable materials, such as paper or solvents, away
from the soldering area to reduce fire hazards.
4. Some components, such as integrated circuits or heat-sensitive
devices, can be damaged by excessive heat. Identify and protect
sensitive components by using heat sinks, thermal shields, or
specialized soldering techniques (e.g., low-temperature soldering or
hot air rework).
5. Electrostatic discharge (ESD) can damage sensitive electronic
components. Use proper ESD protection measures, such as grounding
straps or ESD mats, to prevent static electricity from harming the
components.
6. Handle the soldering iron with care to avoid burns or injuries.
Always place the iron on a stable and heat-resistant stand when not in
use. Never touch the soldering iron's tip or other hot surfaces without
appropriate protection
7. Use the correct temperature for soldering based on the type of solder
and components being used. High temperatures can damage
components, while low temperatures may result in weak or unreliable
solder joints.
8. Fluxes used in soldering can be corrosive or toxic. Follow the
manufacturer's instructions for proper handling and storage of fluxes.
Avoid contact with skin and eyes and use adequate ventilation when
working with fluxes.
9. If working with lead-free solder, be aware of the specific
requirements and considerations associated with its use.

There are bodies that regulate the standards of soldering work such as:
RoHS (Restriction of Hazardous Substances): The RoHS directive
restricts the use of certain hazardous substances in electrical
and electronic equipment. It limits the use of substances such
as lead, mercury, cadmium, hexavalent chromium, and certain
brominated flame retardants in solder and other components.
Compliance with RoHS ensures that soldered connections meet
environmental and health safety requirements.
REACH (Registration, Evaluation, Authorization, and Restriction
of Chemicals): REACH is a regulation aimed at ensuring the safe
use and registration of chemical substances. It addresses the
registration, evaluation, and restriction of substances to protect
human health and the environment. REACH compliance is
relevant to soldering as it pertains to the use and handling of
soldering fluxes and other chemicals.
ANSI/ESD (Electrostatic Discharge) Standards: ANSI/ESD
standards provide guidelines for handling electrostatic
discharge-sensitive devices (ESDs) during soldering and other
manufacturing processes. These standards specify practices for
the control, prevention, and mitigation of electrostatic
discharge, which can damage electronic components and affect
the reliability of soldered connections.
ISO 9001: ISO 9001 is a widely recognized standard for quality
management systems (QMS). Although not specific to
soldering, it sets the requirements for establishing and
maintaining an effective QMS, which includes processes related
to soldering and other manufacturing operations. ISO 9001
certification demonstrates a commitment to quality and
continuous improvement in soldering practices.
Industry-Specific Standards: Depending on the industry or
application, there may be industry-specific standards or
certifications relevant to soldering. For example, in the
automotive industry, the Automotive Electronics Council (AEC)
has developed standards, such as AEC-Q100 and AEC-Q200,
that define the qualification requirements for electronic
components, including soldering reliability. Other industries,
such as aerospace, medical devices, or telecommunications,
may have their own specific standards related to soldering and
electronic assembly.
Principle of a soldering iron is used to heat the metal (base material) of
the part to be soldered. The solder is then melted onto the metal (due to
wetting and capillary action) to create an alloy of the metal and solder at
the connection.

TOOLS AND ACCESSORIES

 Soldering gun
 Tuck nails 36 in number
 Blockboard
 Ball pein hammer
 Pliers
 Soldering wire
 Source of power
 File

PROCEDURE
Clean the heads of the 36 tuck nails using a file
Design the amplifying electrical circuit on a plane paper,
give and indicate the positions of the tuck nails.
Mount the designed paper on the blocking board and
hammer the tuck nails on the dots.
Strip 2.5mm 2cable 1m long to obtain 1 No cable strand.
Solder the copper strand on the mounted tuck nails.

N/B All tucknails should be on a straight line and driven

5mm on the board
 DISCUSSION & DIAGRAM

After keenly following the procedure, the above layout was made. An
appropriate soldering gun was used and the soldering process was a
success because of filing the tuck nails for purposes of ensuring a
clean surface, that is it enhances good soldering joints to avoid poor
joints caused by poorly cleaned surfaces. The flux was carefully
applied just but the right amounts and activation of flux done by
heating it and the copper wire in place to fix the joint.
RESULTS AND OBSERVATIONS

The solder appearance is a shiny tip therefore conveying an impression of good soldering

No signs of poor joints e.g lumps of solder on the tips of tuck nails

SOURCES OF ERROR
1. Insufficient heating of the soldering bit
2. Not allowing the components to cool before moving them
3. Poorly cleaning the surfaces to be soldered

CONCLUSION
After a thorough research, we’ve found out that; Soldering is an essential tool in building
anything from a child’s toy to an aircraft. While welding makes very strong joints between
metals, it is usually used in building something that needs to stand up to great strains and
stresses such as battle tanks. Welding makes a very strong mechanical connection.
Soldering, on the other hand, makes a weaker joint. It is often intended to make electrical
contacts or contacts where the connection is reversible rather than permanent.
Soldering uses alloys from metals that have a melting point lower than 450°C. A typical
solder is an alloy of 99.25 percent tin and 0.75 percent copper. Solder alloys may contain
flux, such as ammonium chloride or hydrochloric acid, which prevents oxide formation.
RECOMMENDATIONS
 Leave no corrosive residues.
 Leave a non-tacky residue that does not collect dust.
 Be safe and must not degrade equipment.
 Allow penetration of probe pins for electrical testing allow visual inspection of
joints.
 Provide excellent solderability
 REFERENCES
o Tutorials web .com
o Coilcraft.com
o Chemtronics.com