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General solution
Similarly, at X=L
Ts,2 = C1L + C2 = C1L + TS,1
Thermal Resistance
The thermal resistance for conduction in a plane wall is:
Ohm’s law:
Thermal contact resistance for (a) metallic interfaces under vacuum conditions and (b)
aluminum interface (10-μm surface roughness, 105 Nm2) with different interfacial fluids.
Chapter 3: One-Dimensional, Steady-State Conduction
Chapter 3: One-Dimensional, Steady-State Conduction
Flow of the heat through a composite wall. The wall of an oven consists of three layers of brick.
The inside in built of 8 in of firebrick, ka= 0.68 Btu/h ft oF, surrounded by 4 in of insulating
brick kb=0.15, and an outside layer of 6 in of building brick, kc= 0.40. The oven operates at 1600
oF and it is anticipated that outer side of the wall can be maintained a 125 oF by the circulation
of air. How much heat will be lost if the walls have a area (1 ft2) and what are the temperatures
at the Interface of the layers.
Ka = 0.68 Btu/h ft oF
Kb = 0.15 Btu/ h ft oF
Kc = 0.40 Btu/ h ft oF
La = 8 in
Lb = 4 in
Lc = 6 in
To =1600oF
T3 = 125oF
Chapter 3: One-Dimensional, Steady-State Conduction
A house has a composite wall of wood, fiberglass insulation, and plaster board, as indicated in
the sketch. On a cold winter day the convection heat transfer coefficients are ho = 60 W/m2 K
and hi = 30 W/m2 K. The total wall surface area is 350 m2.
(a) Determine a symbolic expression for the total thermal resistance of the wall, including
inside and outside convection effects for the prescribed conditions.
(b) Determine the total heat loss through the wall.
(c) If the wind were blowing violently, raising ho to 300 W/m2 K, determine the percentage
increase in the heat loss.
(d) What is the controlling resistance that determines the amount of heat flow through the
wall?
Chapter 3: One-Dimensional, Steady-State Conduction
A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02-mm-thick
epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed surfaces are
cooled by air, which is at a temperature of 25°C and provides a convection coefficient of 100
W/m2K. If the chip dissipates 104 W/m2 under normal conditions, will it operate below a
maximum allowable temperature of 85°C ?
Chapter 3: One-Dimensional, Steady-State Conduction
Radial Systems The Cylinder
General solution
A =4πr2
Resistance
Chapter 3: One-Dimensional, Steady-State Conduction
A spherical, thin-walled metallic container is used to store liquid nitrogen at 77K. The
container has a diameter of 0.5 m and is covered with an evacuated, reflective insulation
composed of silica powder. The insulation is 25 mm thick, and its outer surface is exposed to
ambient air at 300 K. The convection coefficient is known to be 20 W/m2 K. The latent heat of
vaporization and the density of liquid nitrogen are 2x105 J/kg and 804 kg/m3, respectively.
1.What is the rate of heat transfer to the liquid nitrogen?
2.What is the rate of liquid boil-off?
Chapter 3: One-Dimensional, Steady-State Conduction
EXAMPLE 3.1
In Example 1.6, we calculated the heat loss rate from a human body in air and water environments.
Now we consider the same conditions except that the surroundings (air or water) are at 10oC. To
reduce the heat loss rate, the person wears special sporting gear (snow suit and wet suit) made from
a nanostructured silica aerogel insulation with an extremely low thermal conductivity of 0.014 W/m
K. The emissivity of the outer surface of the snow and wet suits is 0.95. What thickness of aero- gel
insulation is needed to reduce the heat loss rate to 100 W (a typical metabolic heat generation rate) in
air and water? What are the resulting skin temperatures?
Chapter 3: One-Dimensional, Steady-State Conduction
EXAMPLE 3.3
The thermal conductivity of a D= 14-nm-diameter carbon nanotube is measured with an
instrument that is fabricated of a wafer of silicon nitride at a temperature of T∞ = 300 K.
The 20-μm-long nanotube rests on two 0.5-μm-thick, 10 μm x 10 μm square islands that
are separated by a distance s= 5 μm. A thin layer of platinum is used as an electrical
resistor on the heated island (at temperature Th) to dissipate q = 11.3 μW of electrical
power. On the sensing island, a similar layer of platinum is used to determine its
temperature, Ts. The platinum’s electrical resistance, R(Ts) = E/I, is found by measuring the
voltage drop and electrical current across the plat- in um layer. The temperature of the
sensing island, Ts, is then determined from the relationship of the platinum electrical
resistance to its temperature. Each island is suspended by two Lsn = 250-μm-long silicon
nitride beams that are wsn = 3 μm wide and tsn = 0.5 μm thick. A platinum line of width
wpt = 1 μm and thickness tpt = 0.2 μm is deposited within each silicon nitride beam to
power the heated island or detect the voltage drop associated with the determination of
Ts. The entire experi- ment is performed in a vacuum with Tsur = 300 K and at steady state,
Ts = 308.4 K. Estimate the thermal conductivity of the carbon nanotube.
Chapter 3: One-Dimensional, Steady-State Conduction
Chapter 3: One-Dimensional, Steady-State Conduction
EXAMPLE 3.4
The diagram shows a conical section fabricated from pyroceram. It is of circular cross section
with the diameter D = ax, where a = 0.25. The small end is at x1 =50 mm and the large end at
x2 = 250 mm. The end temperatures are T1 = 400 K and T2 = 600 K, while the lateral surface is
well insulated.
1-Derive an expression for the temperature distribution T(x) in symbolic form, assuming one-
dimensional conditions. Sketch the temperature distribution.
2-Calculate the heat rate qx through the cone.
Chapter 3: One-Dimensional, Steady-State Conduction
EXAMPLE 3.5
The possible existence of an optimum insulation thickness for radial systems is suggested by
the presence of competing effects associated with an increase in this thickness. In particular,
although the conduction resistance increases with the addition of insulation, the convection
resistance decreases due to increasing outer surface area. Hence there may exist an insulation
thickness that minimizes heat loss by maximizing the total resistance to heat transfer. Resolve
this issue by considering the following system.
1-A thin-walled copper tube of radius ri is used to transport a low-temperature refrigerant and
is at a temperature Ti that is less than that of the ambient air at T∞ around the tube. Is there
an optimum thickness associated with application of insulation to the tube?
2-Confirm the above result by computing the total thermal resistance per unit length of tube
for a 10 mm diameter tube having the following insulation thick- nesses: 0, 2, 5, 10, 20, and 40
mm. The insulation is composed of cellular glass, and the outer surface convection coefficient
is 5 W/m2 K.
Chapter 3: One-Dimensional, Steady-State Conduction
The thermal resistances corresponding to the prescribed insulation thicknesses may be
calculated and are plotted as follows
Chapter 3: One-Dimensional, Steady-State Conduction
Problem. 3.52.
Steam flowing through a long, thin-walled pipe maintains the pipe wall at a uniform
temperature of 500 K. The pipe is covered with an insulation blanket comprised of two
different materials, A and B.
The interface between the two materials may be assumed to have an infinite contact
resistance, and the entire outer surface is exposed to air for which T∞ = 300 K and h = 25
W/m2 K.
(a) Sketch the thermal circuit of the system. Label (using the above symbols) all pertinent
nodes and resistances.
(b) For the prescribed conditions, what is the total heat loss from the pipe? What are the
outer surface temperatures Ts,2(A) and Ts,2(B)?
Chapter 3: One-Dimensional, Steady-State Conduction
One-dimensional, steady-state solutions to the heat equation with
no generation
Chapter 3: One-Dimensional, Steady-State Conduction
Conduction with Thermal Energy Generation
The rate at which energy is generated by passing a The volumetric generation rate (W/m3) is then:
current I through a medium of electrical resistance
R is:
X=L
C1= 0
The temperature distribution is therefore
Chapter 3: One-Dimensional, Steady-State Conduction
Consider a long solid tube, insulated at the outer radius r2 and cooled at the inner radius r1, with
uniform heat generation q ̇ (W/m3) within the solid.
1- Obtain the general solution for the temperature distribution in the tube.
2- In a practical application a limit would be placed on the maximum temperature that is
permissible at the insulated surface (r = r2). Specifying this limit as Ts,2, identify appropriate
boundary conditions that could be used to deter- mine the arbitrary constants appearing in the
general solution. Determine these constants and the corresponding form of the temperature
distribution.
3- Determine the heat removal rate per unit length of tube.
4- If the coolant is available at a temperature T∞, obtain an expression for the con- vection
coefficient that would have to be maintained at the inner surface to allow for operation at
prescribed values of Ts,2 and q ̇.
Chapter 3: One-Dimensional, Steady-State Conduction
Heat Transfer from Extended Surfaces
Fin configurations. (a) Straight fin of uniform cross section. (b) Straight fin of nonuniform cross section.
(c) Annular fin. (d) Pin fin
Chapter 3: One-Dimensional, Steady-State Conduction
A General Conduction Analysis
From Fourier’s law we know that
Excess temperature θ
X= L
The first condition, Case A,
Substituting Equation
Solving for C1 and C2, it may be shown, after some manipulation, that
Chapter 3: One-Dimensional, Steady-State Conduction
applying Fourier’s law
Temperature distribution and heat loss for fins of uniform cross section
Chapter 3: One-Dimensional, Steady-State Conduction
Fin efficiency η
Fin effectiveness ε ƒ
ƒ
Εf ≥ 2
For a straight fin of uniform cross
for the infinite fin approximation (Case D),
section and an adiabatic tip
the result is
Chapter 2
2.40, 2.45, 2.47, 2.51, 2.54.
Chapter 3
Wall plane : 3.2 , 3.3, 3.4, 3.6, 3.8, 3.9, 3.12, 3.15, 3.19.
Conduction with Thermal Energy Generation: 3.72, 3.76, 3.70, 3.86, 3.91, 3.95.
Extended Surfaces : 3.105, 3.106, 3.111, 3.113, 3.115, 3.120, 3.122, 3.123.
Fin Systems and Arrays : 3.130, 3.134, 3.138, 3.140, 3.145, 3.147.