HANOI UNIVERSITY OF SCIENCE AND TECHNOLOGY

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ASSIGNMENT ON
Materials Manufacturing and
Metalworking
 
TITLE: Synthesis of copper matrix
nanocomposites

 
September, 2019
Meet Our Team

Trần Trung Ngô Doãn Hiến Lưu Thành

Hiếu Trung& SVP
Co-Founder
Co-Founder & CEO Co-Founder & COO
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INTRODUCTION
Copper is an indispensable material in our modern society and electronic industry.
INTRODUCTION
Research interest on copper matrix nanocomposites has been increasing.

Publication trends of peer-reviewed articles on CNT–Cu composites

source: Web of Science
COPPER MATRIX
NANOCOMPOSIT
ES
DEFINITION
● Composite

● Copper matrix nanocomposites

CLASSIFICATION

- Depending on the reinforcement, copper matrix composites are

classified into several categories.
- The most commonly strengthening phase include: oxides
Al2O3,Y2O3, SiO2, carbides SiC, WC, TiC, ZrC, borides TiB2, ZrB2 and
others such us carbon or intermetalic phases Al-Fe.
START TALKING ABOUT
Copper / carbon nanotube
(Cu / CNT) composites
Our Focus
Two major approaches have been developed for Cu/CNT fabrication:
powder-processing and electrochemical deposition.
Powder-processing
Powder-processing
1. Blending methods
● Ball milling

Schematic draft of the ball milling process (a).

The used balls are hitting the CNTs and the matrix powder material (b)
Welding and integrating the two components (c)
Bounce of the powder particle to restart this process again at another spot (d).
Powder-processing
1. Blending methods
● Molecular-level mixing

Schematic draft of the molecular-level mixing method.

CNTs are functionalized by functional groups, which will be covalently bond onto the CNTs surface (a).
Metal ions can electrostatically interact with the functional groups, thus coating the CNT surface with metal ions (b).
These ions are transformed to a pure metal layer by calcination and reduction under temperature and H2, N2 or CO
atmosphere (c). Finally, the CNTs are fully decorated or even integrated in the metal matrix material (d).
Powder-processing
2. Processing methods
● Cold Pressed Sintering (CPS)

Schematic draft of pressureless sintering or cold pressed sintering.

A die is filled with the powder material, which is then pressed uniaxial to a green pellet.
The sample is then removed and sintered without pressure in a furnace under vacuum or inert gas atmosphere.
Powder-processing
2. Processing methods
● Hot Uniaxial Pressing (HUP)

Schematic draft of the hot uniaxial pressing method.

A pre-compacted green pellet is inserted in a die, and uniaxial pressure is applied while the pellet is heated by induction
under vacuum or inert gas atmosphere. The densified sample is finally removed.
Powder-processing
2. Processing methods
● Spark Plasma Sintering (SPS)

Schematic draft of the Spark plasma sintering method.

A graphitic die is filled with the powder material, and a uniaxial pressure is applied via two graphite punches. A pulsed
electric DC is applicated, which leads to the heating of the sample by its electrical resistance. The process is conducted
under vacuum or inert gas atmosphere.
Electrodepositing Cu/CNT composites

Step Step Step

1 2 3
Comparison of two methods
Advantages
Advantages

● The composites with up to 12 vol% CNTs demonstrated better wear

properties and hardness than copper.
● A lower coefficient of thermal expansion (CTE) (of 12.1 ppm) than
Cu (17 ppm).
● The Cu/SWCNT(10 vol%) composites showed an increase in both
hardness (42% compared to Cu) and electrical conductivity (three
times higher at 80 K).
● Electrodeposition has made lightweight composite fabrication
possible.
Challenges
1. Ensure effective CNT–Cu interfacial interaction
● Cu does not chemically interact with carbon.
● There is a large surface energy difference between the two
materials (Cu: approx. 1800 mJ m−2 versus CNTs: approx. 30–45 mJ
cm−2 ).
● However, enhancing CNT–Cu interaction is critical for improving
stress transfer and electron/phonon transport through composites.
Challenges
1. Ensure effective CNT–Cu interfacial interaction
● Oxygen as CNT–Cu interfacial interaction enhancer
● Carbide-forming metals as CNT–Cu interfacial interaction enhancer
Challenges
2. Control CNT and Cu-matrix attributes
● The composite performance is likely to be affected by the basic
attributes of the two constituents i.e. CNTs (such as diameter, wall
number, etc.,) and Cu matrix (grain size and micro/nanostructures,
defect density).
Challenges
2. Control CNT and Cu-matrix attributes
● Synthesizing and utilizing such CNTs for composite fabrication is
inherently a major issue.
● CNT attributes can change during composite fabrication processing.
● Lack of complete understanding on how Cu-matrix attributes
influence various composite properties.
● Lack of methods to control Cu-matrix attributes.
Challenges
3. Cu/CNT industrialization
● Cu/CNT needs industrialization, i.e. reproducible mass-production at
low cost using industry-compatible methods, while preserving
properties.
● However, current template-making methodologies for
electrodeposition are expensive and unsuitable for mass-
production.
● Cu/CNT metrology and quality assurance protocols meeting
industrial standards need establishing.
THANKS FOR
WATCHING