Outermost electrons

Subatomic structure
defines
Atomic bonds

defines

Basic materials properties Material type

modified by
Atomic packing
Microstructure defines modified by Materials processing
techniques
defines Packing defects
Ideal materials modified by Controlled by
properties macroscopic defects
Component
gives production techniques

Actual material properties

 RELATION BETWEEN ATOMIC
BONDING AND PLASTICITY

Plasticity = permanent shape change

atoms break and reform
 RELATION BETWEEN ATOMIC
BONDING AND PLASTICITY

Plasticity = permanent shape change

atoms break and reform
“easy” for metallically bonded material
 RELATION BETWEEN ATOMIC
BONDING AND PLASTICITY

Plasticity = permanent shape change

atoms break and reform
“easy” for metallically bonded material
 RELATION BETWEEN ATOMIC
BONDING AND PLASTICITY

Plasticity = permanent shape change

atoms break and reform
“easy” for metallically bonded material

Shearing allows bonds to break AND reform

Ionically bonded
Ionically bonded

More difficult
Ionically bonded

More difficult because of coulombic neutrality

Ionically bonded

ionic solids are brittle

More difficult because of electronic neitrality

Covalent?
Directional bonds a problem
Note plastic deformation in metal alloys:

Alloys are not compounds

Random distribution of alloying elements
All atoms bonded metallically
no coulombic neutrality issues
Note plastic deformation in metal alloys:

Alloys are not compounds

Random distribution of alloying elements
All atoms bonded metallically
no coulombic neutrality issues
 BONDING FORCES AND ENERGY
force Net force repulsion:
non valence electrons interact
attract (core electrons)

repel r0
Interatomic separation, x

Forces cancel out i.e. equilibrium

Potential atomic separation
energy

repel E0 i.e. at equilibrium atomic separation

energy lowest
x
attract
 RELATION BETWEEN ATOMIC
BONDING AND STIFFNESS

STIFFNESS:
stiffer
load
Slope = stiffness

deformation

Elastic region
 RELATION BETWEEN ATOMIC
BONDING AND STIFFNESS

STIFFNESS:
stiffer
load
Slope = stiffness

deformation

Elastic region
 RELATION BETWEEN ATOMIC
BONDING AND STIFFNESS

Stiffer material (stronger bonds)

force Tangent at r0  stiffness (=dF/dr)
attract

repel x
 RELATION BETWEEN ATOMIC
BONDING AND THERMAL EXPANSION

energy

atomic separation

E*
heat material =
E0 x energy increase
0
 RELATION BETWEEN ATOMIC
BONDING AND THERMAL EXPANSION
physical interpretation?
atom vibrates
energy

variation of mean
separation with temp

atomic separation

E*
heat material =
E0 x energy increase
0
 RELATION BETWEEN ATOMIC
BONDING AND THERMAL EXPANSION
more
deeper/symmetrical curve =
stronger bonds =
lower thermal expansion
energy

(and higher melting points)

atomic separation

electronegativity 2
Z1 Z 2 q
Fa ( x)  electron
capacity of a material to be 4 0 x 2 charge
polarized by an electric field
permettivity of vacuum IONIC
RELATION BETWEEN ATOMIC BONDING
AND ELECTRICAL CONDUCTIVITY
Electrical energy is carried from one position in a material to
another
rate of carrying = electrical conductivity
Conductivity depends on:
mobility of carriers i.e. type of carrier ….
electrons or ions

And numbers of carriers / unit volume (spatial density)

metals: electrons are free to move etc..

Ionic/covalent solids: electrons? shells filled

ions? not as mobile as electrons
RELATION BETWEEN ATOMIC BONDING
AND TRANSPARENCY TO LIGHT

Light is transmitted by photons

Photons can interact with electrons
If electrons are ‘locked’ (ionic or covalent bonding)
band gap energy is large;
Photon energy insufficient to excite electron
Photons transmitted
‘Glass’ is transparent
Poly methyl methacrylate (pleaxiglass) is transparent
RELATION BETWEEN ATOMIC BONDING
AND TRANSPARENCY TO LIGHT
If electrons are ‘free’, (metallic bonding)
they are easily excited to higher energies
(‘band gap energy is low’)
Photons give up energy to electrons
Photons absorbed
No metal is transparent
But why do they reflect?
Usually:
Photons do not penetrate deeply
Not much overall photon energy absorbed, but…
..trajectory changes
Photon of lower energy reflected by the first layers
SUMMARY – BASIC MATERIALS
PROPERTIES

Metals:
formable because:
- non directional bonds
- no ‘charge’ constraints

conduct electricity because of electron cloud

opaque because of electron cloud

Properties ‘directly’ related to bond strength:

Stiffness, melting point and thermal expansion