Professional Documents
Culture Documents
Chameleon Chip
Chameleon Chip
Agenda
1.Introduction
2.Multifunction Implementation
3.The General Architecture Of Reconfigurable Processor
4.Architecture
5.Reconfigurable Processing Fabric
6.Programmable I/O
7.Technologies Used In Chip
8.Design Process
9.Comparison With Other Technologies
10.Advantages
11.Disadvantages
12.Applications
13.Conclusion
1.Introduction
A reconfigurable processor is a microprocessor with erasable hardware
that can rewire itself dynamically.
This allows the chip to adapt effectively to the programming tasks
demanded by the particular software they are interfacing with at any
given time.
Reconfigurable processor chip usually contains several parallel
processing computational units known as functional blocks.
While reconfiguring the chip, the connections inside the functional
blocks and the connections in between the functional blocks are
changing,
that means when a particular software is
loaded the present hardware design is erased and a new hardware
design is generated by making a particular number of connections
active while making others idle.
This will define the optimum hardware configuration for that
particular software.
The CS2112 has 4 Slices with 3 Tiles in each. Each tile can be
reconfigured at runtime
Tiles contain :
Datapath Units
Local Store Memories
16x24 multipliers
Control Logic Unit
The high-performance 32bit Data path Unit (DPU): The Tile includes seven Data path
Units. The DPU is a data processing module that directly supports all C and Verilog
operations.
6.Programmable I/O
RCP includes banks of Programmable I/O (PIO) pins which
provide tremendous bandwidth.
3. eBIOS:
It provides a interface between the Embedded Processor System and the
Fabric.
eBIOS provides resource allocation, configuration management and DMA
services.
The eBIOS calls are automatically generated at compile time, but can be edited
for precise control of any function.
8.Design Process
9.Comparison With Other Technologies
Today’s system architects have at their disposal an arsenal of
highly integrated, high-performance semiconductor
technologies, such as application-specific integrated circuits
(ASICs), application-specific standard products (ASSPs),
digital signal processors (DSPs), and field-programmable gate
arrays (FPGAs). However, system architects continue to
struggle with the requirement that communication systems
deliver both performance and flexibility.
Reducing power