HP BladeSystem c-Class

Power and Cooling

Module 3

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© 2008 Hewlett-Packard Development Company, L.P.

The information contained herein is subject to change without notice
Objectives
• Discuss the impact of growing power demand and power density
• Describe the technologies that supply power to BladeSystem c-
Class systems
• Describe Thermal Logic technology
• Describe the cooling technologies designed for BladeSystem c-
Class systems

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A limited power budget and growing power
demand

More performance and

density
Draws Generates
more more
power heat

Which eventually
impacts Requires
performance, reliability, more
and cost cooling

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Modern data center design
• Raised floor, forced air cooling through perforated panels
• Power and network wiring may be under floor or overhead
• Designed for 5-10 year lifecycles

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Power

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Why enclosure power in c-Class?
• Match what the customer already has in the data center
• c-Class uses standard power cords
– IEC-C19 – 16A 208V = 3328VA
– NEMA L15-30P 24A 3Ø 208V = 8646VA
– IEC 309 5-pin 16A 3Ø 230V = 11040VA
• p-Class (shipped in 2002)
– BL20p x 8 (1.4GHz Pentium III – 40W CPU)
– One L15-30P line cord could power four to five enclosures
• Rack based power for c-Class would require 60 to 100A
three-phase power
• c-Class today and future
• 16 x half-height blades (130W Dempsey CPU)
• One L15-30P line cord can power one enclosure

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Power supplies
• 2250W output
• Self-cooled
DC power
• Self monitoring backplane
connector
– AC input detection
– DC output measurement

AC input module
connector

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AC Line Input Modules

3Ø AC Module

NA/JPN L15-30p

Intl IEC309 5-Pin 16A

1Ø AC Module

C-19 16A
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Power Supply Redundant

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AC Redundant

1 2 3 4 5 6

A circuit B circuit

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Total available power
• 2250W are available from each power supply
• If no power redundancy is configured then, total power available is defined as the power
available from all supplies installed
– 6 power supplies installed = 13500W
• If N+1 Power Mode is configured, then total power available is defined as total power
available less one power supply
– 5+1 configuration = 11250W
• If N+N AC Redundant is configured, then total power available is the amount from the
A or B side with the lesser number of supplies
– 3+3 configuration = 6750W

1 2 3 4 5 6

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Single Ø AC power supply placement
Blades inserted Zone 1 Zones 1-2 Zones 1-3 Zones 1-4
in zone

Blade (from front

of unit)

PS = N

PS = N + 1

PS = N+N

• Placement rules are enforced by the Onboard Administrator

• Note that the grey areas denote installed devices; blue areas are blanks

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Power supply population
• In single-phase configurations, you can use fewer than six power
supplies
– Two power supplies: bays 1 and 4
– Three power supplies: bays 1, 2, and 4
– Four power supplies: bays 1, 2, 4, and 5
– Five power supplies: bays 1, 2, 3, 4, and 5

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Using the 40A 1Ø PDU – NA/JPN
• 8.3KVA PDU - 252663-D75
• 2 x 50A 1Ø connections per c-Class enclosure
• One enclosure contains up to
six 2250W power supplies

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Using the 24A 1Ø PDU – NA/JPN
• 5KVA PDU - 252663-D74
• 2 x 30A 1Ø connections per c-Class server blade enclosure
• Enclosure contains four 2250W power supplies
– Onboard Administrator manages blade power on automatically
• Enclosure load limited to 5KVA

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Using the 60A 3Ø PDU – NA/JPN
• S348 PDU - AF916A
• 17.2 kVA N+N redundant power
• 2 x 60A 3Ø connections
• 3 x c-Class server blade enclosures
• Each enclosure contains six 2250W
power supplies
• Maximum power per enclosure =
5.4KVA
• 4 x 8KVA enclosures with four
PDUs is also possible

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Using the 32A 3Ø PDU – International
• S332 - AF917A
• 22 KVA N+N redundant power
• 2 x 32A 3Ø connections
• Four c-Class server blade
enclosures
• Each power enclosure contains
six 2250W power supplies
• Enclosure load less than 5.5KVA
• Four 8KVA enclosures supported
by four PDUs is also possible

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HP Dynamic Power Saver
Example: 1800W draw system

• 6 power supplies, 300W each, 75% efficiency

• 2400W in for 1800W out
• 600W wasted

• 2 power supplies, 900W each, 91% efficiency

• 1978W in for 1800W out
• Saving of 422W per enclosure

20 enclosures @ 0.075 per kW/hr can save ≈ $5,545 per year

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HP ProLiant Power Regulator
• Server level, policy-based power Give CPUs full power for
management applications when needed
– Dynamic and static control of processor
power states
– Leverages recently exposed Intel and AMD
p-state registers
– Unique operating system independence
– Control settings from RBSU or iLO
– p-state historical data displayed through
iLO Advanced interface
• Benefits
– Save on power and cooling costs with no POWER
COSTS

performance loss
– Increase facility compute capacity
• Supported on most current generation
ProLiant servers
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ProLiant Power Regulator — Advanced power
management
• Monitor and manage individual and groups of servers by physical or
logical location (power domain)
• Monitor vital power information
– Power usage in watts
– BTU/hr output
– Ambient air temperature
• Policy-based management
– Power cap policy: Set maximum BTUs/hr or wattage threshold (capped
on a server by server basis)
– Temporary conservation policy: Set time of day to drop lower priority
servers into lower power state
– Severe facilities issue: Drop lower priority servers into lower power
state when a severe facilities issue occurs
– Energy efficiency policy: Set all servers in power domain to dynamic
power regulating
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Thermal Logic
technology

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Thermal Logic technology

minimize power consumption optimize cooling

Efficient components Efficient systems Efficient data centers

  ProLiant Power Regulator  HP Modular Cooling

  Enterprise chipsets  HP 10000 G2 racks
 Small drives  Integrity Virtual Server  HP PDU Management Module
Environment
 Intelligent power  Data Center Services
supplies  ProLiant Essentials
 Efficient power
conversion

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Benefits of the technology
• Simplifies up front planning
• Enables management based upon power
– Measures your actual power consumption
• Maximizes the performance for given power and cooling
envelope/footprint
• Enables near real-time environmental awareness
– Enables you to respond quickly to changing data center capabilities
• Extends the life of the data center
– Forestalls expensive power and cooling upgrades

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Thermal Logic management

Thermal controls that optimize

performance, power, and cooling
capacity to maximize power budget
and ensure availability

Power usage and distribution

Airflow and acoustics

Real-time view of power usage and
temperature at component, enclosure, Performance
and rack level
Workload
Rack-level BTU/hr

Enclosure inflow and outflow temp

Actual power utilization

Max power available

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Thermal Logic components
Workload
PARSEC balancing
architecture
Max Min Active Cool Processor
fans Management throttling
Enclosure

Water
cooling Rack
Modular
design
Smart Power and
Cooling Pooled
Services Data center Low power
power
components
Power
control

Multi-core Single and three-

processors phase choice

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PARSEC architecture
c7000 enclosure Active Cool fans
• Adaptive flow for maximum power
efficiency, air movement, and acoustics

Interconnect bays
• The interconnects are powered and cooled
as part of the PARSEC architecture

Onboard Administrator
• Remote administration view
• Robust, multi-enclosure control

Power management
PARSEC architecture • Single- or three-phase enclosures and N+N
• Parallel, redundant and
or N+1 redundancy
scalable cooling and • Best performance per watt
airflow design

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Thermal Logic management
Single enclosure – Onboard Administrator

Enclosure
temps

Actual power
used
Max power
available

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Thermal Logic Management
Multi-enclosure – Onboard Administrator

Enclosure inflow Rack-level

and outflow BTU/hour
temperatures

Actual power
usage

Maximum power
available

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Cooling

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c7000 enclosure design challenges
• Challenges faced by the aperture open
c-Class design engineers
– Small aperture in the backplane
assembly
• To get sufficient air from blades
requires high pressure
– BL460c with dual-core Xeon
requires ~30CFM to cool
• Requires high airflow
– Up to 16 Dempsey half-height
blades per chassis
c7000 power backplane/signal
• Requires large air volumes to
midplane composite (partial view)
moved
• Thermal Logic and Active Cool
fans are the answers

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BladeSystem c-Class solutions
Active Cool fan technology
• High volume
20 nts
• High pressure pa t
e
• Best in class acoustics
• Best in class power consumption
A new cooling architecture
• A bladed system — Beyond just a
server blade
• Combines the best of both worlds
– Provides centralized cooling
– Scales with growth

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HP Active Cool Fans

LED color Fan status

Solid green Fan working normally
Solid amber Fan failure

Blinking amber Check Insight Display for information

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BladeSystem c7000 enclosure airflow
Center air plenum

Fans

Half-Height Server Blade

Switch Modules

OA

Half-Height Server Blade

Fans

Power Supply Modules Fans

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Self-sealing enclosure

Server
Fan louvers activates
automatically open lever when
when fan is installed installed

Door opens to
allow airflow
Fan louvers through server
automatically close
when fan is
removed

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Fan zones

Fan 5 Fan 4 Fan 3 Fan 2 Fan 1

Blade Blade Blade Blade

Zone 1 Zone 2 Zone 3 Zone 4

2 FH or 2 FH or 2 FH or 2 FH or
4 HH 4 HH 4 HH 4 HH

Fan 10 Fan 9 Fan 8 Fan 7 Fan 6

PS 1 PS 2 PS 3 PS 4 PS 5 PS 6

Enclosure front view

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Fan location rules (Firmware Release 40)

Zones One One and two All All

Server blades Up to 2 Up to 8 Up to 16 Populate any

bays
Number
4 6 8 10
of fans
Fan location Bays Bays Bays Populate all bays
4 and 5 3, 4, 5, 1, 2, 4, 5,
9 and 10 8, 9, 10 6, 7, 9, 10

• Always install the first full-height server blade in device bay 1

• Placement rules are enforced by the Onboard Administrator

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Cooling multiple enclosures

8KW 16KW 24KW 32KW

Operate with standard forced air cooling HP Modular Cooling System

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HP Modular Cooling System

Controller

Fan
Assembly

Blind-Mate
Quick
Disconnect
Couplings

Heat Exchanger

Side Air
Ducts

Front Panel
Display

Water
Connections Side View
Top View

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Lab
activity
Using the HP ProLiant
BL c-Class Power Calculator

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