ISAT 436

Micro-/Nanofabrication
and Applications

MicroElectroMechanical
Systems: MEMS
David J. Lawrence
Spring 2004
 MEMS (MicroElectroMechanical
Systems)
 R. C. Jaeger, Chapter 11, beginning on page 269.
 MEMS are one of the most exciting application areas
for microfabrication.
 MEMS combine the signal processing and
computational capability of analog and digital
integrated circuits with a variety of non-electronic
elements, such as sensors (e.g., pressure,
temperature, and chemical sensors), actuators (e.g.,
micromotors, comb drives, and pumps), mechanical
elements (e.g., gears, springs, and cantilevers), and
optical elements (e.g., fixed and tilting mirrors).
 MEMS (MicroElectroMechanical
Systems)

 Micromachining technologies can be

divided into three categories:
 Bulk micromachining
 Surface micromachining
 High aspect ratio electroplated structures
 Mechanical Properties of
Silicon

 Silicon is brittle.
 This is especially evident for large-diameter, thin
wafers.
 It tends to fracture (cleave) along certain crystal
planes.
 This breakage can often be traced to flaws (e.g.,
scratches), often near the edges of wafers.
 Mechanical Properties of
Silicon

 However, silicon is not as delicate as many

people think.
 Its yield strength exceeds that of high-
strength steel and tungsten.
 Silicon’s hardness is greater than that of
tungsten.
 See Table 11.1 on page 270 of Jaeger.
 Other Materials Used in MEMS

 Polycrystalline silicon (polysilicon).

 Silicon dioxide (an insulator or dielectric).
 Silicon nitride (another insulator) is harder than
high-strength steel.
 Phosphosilicate glass (PSG) is another insulator.
 Metals (e.g., aluminum, titanium, and nickel).
 Others …
 See Table 11.1 on page 270 of Jaeger.
 Deposition

 The materials needed for mechanical elements

can be produced on silicon wafers using the
techniques we have already studied:
 Oxidation of silicon

 PVD (evaporation or sputtering)

 CVD

 Plus a technique that we have not yet studied:

 Electrodeposition (or electroplating)
 Photolithography

 Of course, photolithography is used to

define the patterns in the materials used
for MEMS
 Etching

 Etching is an important process in MEMS

microfabrication.
 Wet chemical etching of silicon can be
isotropic or anisotropic depending upon the
chemical composition of the etchant.
 Wet chemical etching can also be made to
stop at a p-n junction.
 See pages 271-278 of Jaeger.
 Etching

 Dry etching of silicon (and other materials)

can be very anisotropic if the process
conditions are properly chosen.
 For example, deep reactive-ion etching
(DRIE) can be used to produce high-
aspect-ratio structures.
 See pages 278-280 of Jaeger.
 Sacrificial Layers
 If a mechanical element must be free to move
(e.g., a cantilever beam, a spring, or a gear), it
often must be deposited on top of a “sacrificial
layer” or a “release layer”.
 The sacrificial layer is later etched out from
beneath the element that is to be free to move.
 Phosphosilicate glass (PSG) is often used as the
sacrificial layer.
 Cavities and channels can also be fabricated by
using sacrificial layers.
 See pages 279-287 of Jaeger.
 MEMS Application:
Displays
 Digital Micromirror Devices (DMD) were developed by
Texas Instruments.
 These devices are based upon electrically-controlled,
tilting micromirrors.
 Website: www.dlp.com
DLP = Digital Light Projector
 These devices have numerous applications:
 Business
 Home entertainment
 Cinema
 MEMS Application:
Displays

 Two micromirrors: one tilted to “on” position, the other tilted to “off”
position. (www.dlp.com)
 MEMS Application:
Displays

 Two micromirrors: one tilted to “on” position, the other tilted to “off”
position. (www.dlp.com)
 (www.dlp.com)
MEMS Application:
Displays
 MEMS Application:
Displays

 (www.dlp.com)
 MEMS Application:
Displays

 (www.dlp.com)