V Electronics without silicon is unbelievable.

V Today, we are using silicon for the

manufacturing of Electronic Chip's.
V But, it has many disadvantages , when it is
used in power electronic applications, such
as bulk in size, slow operating speed etc.
V Silicon chip, which has supplied several
decades· worth of remarkable increases in
computing power and speed, looks unlikely
to be capable of sustaining this pace for
more than another decade .
V Carbon, Silicon and Germanium belong to
the same group in the periodic table.

V They have four valance electrons in their

outer shell.

V Pure Silicon and Germanium are

semiconductors in normal temperature.

V So in earlier days they were used widely for

the manufacturing of electronic components.
VBut later it was found that Germanium has
many disadvantages compared to silicon,
such as large reverse current, less stability
towards temperature etc.
V So the industry focused in developing
electronic components using silicon wafers.

V Now research people found that Carbon has

more advantages than Silicon.
V By using carbon as the manufacturing
material, we can achieve smaller, faster and
stronger chips.
V On single definition, Diamond Chip or
carbon Chip is an Electronic Chip
manufactured on a Diamond structural
Carbon wafer.
OR
V Ot can also be defined as the Electronic
Chip manufactured using carbon as the
wafer.
V ˜irstly, diamond structural carbon is non-
conducting in nature.
V To make it conducting - doping process is
performed.
3 Boron--as the p-type doping Agent
3 Nitrogen--as the n-type doping agent.
V This process is similar to Silicon chip
manufacturing.
V But this process will take more time
compared with that of silicon because it is
very difficult to diffuse through strongly
bonded diamond structure.
A diamond semiconductor
operates on 81 GHz
frequency, and is more than
twice the speed of earlier
devices.

Developed by the !ippon

Telegraph and Telephone
Corporation (!TT), Japan.

According to NTT, this latest

development will allow
amplification in the
millimeter-wave band from
30 to 300 GHz possible for
the first time.
V Smaller Components Are Possible

V Ot Works At Higher Temperature

V ˜aster Than Silicon Chip

V Larger Power Handling Capacity

VR aller Co ponents Are Possible

3 As the size is smaller -- it is possible to cut

very smaller lines through diamond
structural carbon.

3 We can imagine a transistor whose size is

one-hundredth of silicon transistor.
V Ot Works At Higher Te perature
3 Atvery high temperature, crystal structure of
the silicon will collapse.

3 Butdiamond chip can function well in these

elevated temperatures.

3 Diamond has an extremely high thermal

conductivity, can withstand high electric
fields, and can be made into a semiconductor
-- ideal for power devices.
V Ot Works At Higher Te perature ëcontd..)
3 They can work at a temperature of up to
1000 degrees Celsius, while silicon chips stop
working above 150 degrees Celsius

3 Diamond can also resist voltages up to

around 200 volts, compared to around 20
volts for a silicon chip.

3 Due to this power electronics, such as an

inverter, can become made much smaller in
size.
V ˜aster Than Rilicon Chip

3 ºobility of the electrons inside the doped

diamond structural carbon is higher than
that of in the silicon structure.

3 As the size of the silicon is higher than that

of carbon, the chance of collision
of electrons, with larger silicon atoms
increases as compared to carbon chip.
V aarger Power Handling Capacity
3 Diamond has a strongly bonded crystal
structure. So carbon chip can work under
high power environment.

3 Otis assumed that a carbon transistor will

deliver one watt of power at rate of 100 GHZ.

3 The inter phase between low power control

circuit with a high power circuit will not be
needed as we can directly connect high
power circuits with a diamond chip.
V ºuch ore expensive than silicon
3 A four-millimeter-square diamond substrate
costs several tens of thousands of yen
compared to virtually nothing for silicon.

V Electricity cannot travel s oothly

through dia ond
3 Researches are seeking impurities that can be
added to aid electricity flow.
V The chip would be most useful in devices
located near hot-burning engines.

V Thus Diamond Chip replaces the need of

silicon chip in every aspect in future
generations