CHAPTER 19:

THERMAL PROPERTIES

ISSUES TO ADDRESS...
• How does a material respond to heat?
• How do we define and measure...
--heat capacity
--coefficient of thermal expansion
--thermal conductivity
--thermal shock resistance

• How do ceramics, metals, and polymers rank?

Chapter 19- 1
 HEAT CAPACITY
• General: The ability of a material to absorb heat.
• Quantitative: The energy required to increase the
temperature of the material.
energy input (J/mol)
heat capacity dQ
(J/mol-K) C=
dT temperature change (K)

• Two ways to measure heat capacity:

-- Cp : Heat capacity at constant pressure.
-- Cv : Heat capacity at constant volume.

Chapter 19- 2
 HEAT CAPACITY VS T
• Heat capacity...
--increases with temperature
--reaches a limiting value of 3R
gas
Debye
θ
3R
C
Heat= constant
TDv(K)constant
temperature
capacity, C v
(usually
= 8.31 J/mol-K
less than T room )

Adapted from Fig. 19.2,

Callister 6e.

• Atomic view:
--Energy is stored as atomic vibrations.
--As T goes up, so does the avg. energy of atomic vibr.
Chapter 19- 3
HEAT CAPACITY: COMPARISON

• Why is cp significantly
larger for polymers?

Selected values from Table 19.1, Callister 6e.

Chapter 19- 4
 THERMAL EXPANSION
• Materials change size when heating.
L final − Linitial Tinit
Lfinal
= α (Tfinal − Tinitial )
Linitial
coefficient of
thermal expansion (1/K)

• Atomic view: Mean bond length increases with T.

Adapted from Fig. 19.3(a), Callister 6e.
(Fig. 19.3(a) adapted from R.M. Rose, L.A.
Shepard, and J. Wulff, The Structure and
Properties of Materials, Vol. 4, Electronic
Properties, John Wiley and Sons, Inc.,
1966.)

Chapter 19- 5
THERMAL EXPANSION: COMPARISON

• Q: Why does 
generally decrease
with increasing
bond energy?

Selected values from Table 19.1, Callister 6e.

Chapter 19- 6
 THERMAL CONDUCTIVITY

• General: The ability of a material to transfer heat.

• Quantitative: temperature
dT gradient
q = −k
heat flux dx
(J/m2-s) thermal conductivity (J/m-K-s)
heat
xT2112 >flux
T1

• Atomic view: Atomic vibrations in hotter region carry

energy (vibrations) to cooler regions.

Chapter 19- 7
THERMAL CONDUCTIVITY: COMPARISON

Selected values from Table 19.1, Callister 6e.

Chapter 19- 8
 EX: THERMAL STRESS
• Occurs due to:
--uneven heating/cooling
--mismatch in thermal expansion.
• Example Problem 19.1, p. 666, Callister 6e.
--A brass rod is stress-free at room temperature (20C).
--It is heated up, but prevented from lengthening.
--At what T does the stress reach -172MPa?
Lroom
T
ΔL
T
ΔL
= ε thermal = α (T − Troom )
Lroom
100GPa 20 x 10-6 /C
compressive σ keeps ΔL = 0 σ = E(−ε thermal ) = −Eα (T − Troom )

-172MPa 20C
Answer: 106C
Chapter 19- 9
 THERMAL SHOCK RESISTANCE
• Occurs due to: uneven heating/cooling.
• Ex: Assume top thin layer is rapidly cooled from T1 to T2:
σ12
doesn’t
tries
rTapidtoquench
contract
want to contract
during cooling

Tension develops at surface

σ = −Eα (T1 − T2 )
Temperature difference that Critical temperature difference
can be produced by cooling: for fracture (set  = f)
quench rate σf
(T1 − T2 ) = (T1 − T2 ) fracture =
k Eα
set equal
σ fk
• Result: (quench rate ) for fracture ∝
Eα
σ fk
• Large thermal shock resistance when is large.
Eα Chapter 19- 10
 THERMAL PROTECTION
Re-entry T SYSTEM nylon
silica
reinf
felt,tiles
C-C
(400-1260°C)
(1650°C)
silicon rubber
coating (400°C)

• Application: Distribution

Space Shuttle Orbiter

Fig. 23.0, Callister 5e. (Fig. 23.0 courtesy the National Fig. 19.2W, Callister 6e. (Fig. 19.2W adapted from L.J. Korb,
Aeronautics and Space Administration. C.A. Morant, R.M. Calland, and C.S. Thatcher, "The Shuttle
Orbiter Thermal Protection System", Ceramic Bulletin, No. 11,
• Silica tiles (400-1260C): Nov. 1981, p. 1189.)
--large scale application --microstructure:
100 μm
~90% porosity!
Si fibers
bonded to one
another during
heat treatment.
Fig. 19.3W, Callister 5e. (Fig. 19.3W courtesy the Fig. 19.4W, Callister 5e. (Fig. 219.4W courtesy
National Aeronautics and Space Administration. Lockheed Aerospace Ceramics
Systems, Sunnyvale, CA.) Chapter 19- 11
 SUMMARY
• A material responds to heat by:
--increased vibrational energy
--redistribution of this energy to achieve thermal equil.
• Heat capacity:
--energy required to increase a unit mass by a unit T.
--polymers have the largest values.
• Coefficient of thermal expansion:
--the stress-free strain induced by heating by a unit T.
--polymers have the largest values.
• Thermal conductivity:
--the ability of a material to transfer heat.
--metals have the largest values.
• Thermal shock resistance:
--the ability of a material to be rapidly cooled and not
crack. Maximize fk/E.
Chapter 19- 12
 ANNOUNCEMENTS
Reading:

Core Problems:

Self-help Problems:

Chapter 19- 0