EMC 3014 – Insufficient Glue

R.Ganapathi | POA Assy Spice

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Introduction & Problem Statement

• Insufficient glue LYM trend chart on upstream after AVI set criteria for glue coverage .
• After check , found most of insufficient glue LYM issue for led coverage.
• If LED bonded on minimum pre-bond size (0.16mm2) then AVI will capture as reject .
• Below is the trend chart & slide 2 is the sample rejected image by AVI.

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Insufficient Glue trend chart & Improvement Action

3014 – LYM TRIGGERED FROM SEPTEMBER’21 – DECEMBER’21

3014 - Insufficient & Lifted Due to Insufficient

1. Re-tighten Pre – bond (0.02 –
70 0.06) @ 29.11.2021

60 59
1. After pre-bond revision (0.01 – 0.06) for diode
@ 30.9.2021 insufficient trend for diode increase.
50
Total LYM
40
1. Insufficient on LED .
30 2. Over-reject by AVI due to reject
criteria in variation.

20 17 16
10
10 7
4
2
0
0
September'21 October'21 November'21 December'21

Next Slide consist action plan for Insufficient Die / Diode

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Introduction & Problem Statement

• Insufficient glue can be found at Zener or LED bonding process.
• Insufficient glue happen when the lower pre-bond set value produce glue height less then 30% and also
abnormal glue shape that fails AVI visual criteria.
• Below is the insufficient glue pattern for Zener and LED .

Insufficient Zener – Diode

Insufficient Led

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Insufficient Glue Improvement Action Plan

1st Pass (Zener Diode) Glue On Die & Insufficient Glue Action Item
No Action Date Owner Status
R.Ganapathi &
1 Reduce pre-bond from (0.03 – 0.08) to (0.01 – 0.06) and monitor. 30.9.2021 Done
Rhames Permal

R.Ganapathi &
2 Re-tighten pre-bond on minimum side to 0.02 . {New pre-bond (0.02 – 0.06)} 29.11.2021 Done
Rhames Permal

2nd Pass (LED) Insufficient Glue Action Item

No Action Date Owner Status

R.Ganapathi &
1 Increase pre-bond from (0.16 – 0.4) to (0.2 – 0.4) . 20.12.2021 Done
Rhames Permal

R.Ganapathi &
2 Collect insufficient pattern and re-align with avi to avoid over reject. WW3 In –Progress
Rhames Permal

R.Ganapathi &
3 Study PR template Size , Location & Typical Pre-bond parameter as reference point . WW3 In –Progress
Rhames Permal

R.Ganapathi &
4 Individual Z height 0 , glue dispensing offset detection. (ASM ONLY) WW4 In –Progress
Rhames Permal

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Insufficient Glue Improvement Action Plan

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Greeting

Thank You

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