Hot dipping

Hot dipping
• Principles
Hot dip deposition is a physical-
chemical process based on the
coating of a pretreated (e.g. by
cleaning or etching,with or without
additional precoating) substrate
material ( solid phase) and
immersion in a bath of molten metal
or alloy for a specific time
 Hot dipping
The coated substrate( in the case of metal or
alloy) basically consists of three layers:
• The outside( or top or outer) pure coating
• The intermediate –diffused chemically
bonded components( eg.MxNy)
• Pure substrate material
Coating times vary from 05 to 5 minutes and
thickness range from 0.0005 to 0.003 inches
 Deposited metals
• Theortical,candidates for hot dip deposition
include all metals which can melted to
produce an adherent coating without
undesirably changing the substrate through
the melting temperatures of the coating.
Melting point of low melting point
metals
• Zinc 420 C

• Tin 232 C

• Aluminium 660 C

• Lead 327 C
 Applications/Examples of hot
dipping
• Al hot dip coating on Ni electroplated
• Zn, Fe electroplated
• Zn hot dip coating on Cu
• Hot dip coating on refractory
metals(W,Mo,etc)
• Laser melting of coated metal particles
• Al hot dip coating of Ti with Ni-P sublayer
• Vacuum Fe coating over Zn hot dip
coating on steel