Batch Processing – Definition,

Advantages, Disadvantages
• A sequence of one more steps (recipe) usually
carried out in more than one vessel and in a
defined order, yielding a finished product
• Production amounts are usually smaller than for
continuous processing
• Requires reduced inventories and shorter
response times
• Final product quality must be satisfied with each
batch (no blending)
• More emphasis on production scheduling in
batch processing

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 Other Advantages
• Batch time can be adjusted to meet quality
specs
• Repetition is conducive to continuous
improvement in product
• Slow dynamics permit real-time calculations
• Greater agility

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3
 Batch Processing Used in
Manufacturing
• Electronic materials
• Specialty chemicals
• Metals
• Ceramics
• Polymers
• Food and agricultural materials
• Biochemicals
• Multiphase materials/blends
• Coatings
• Composites
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Representative processing steps in a semiconductor wafer fab
(Deposition, Patterning, Etching, Doping, etc) 5
Unit operations in microelectronics
manufacturing are characterized by:
1. Physical/chemical complexity
2. Inability to measure directly many
process variables
3. High sensitivity to process changes
4. Multiple inputs/multiple outputs

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CD Variation Effects in Pattern Transfer
Wafer Reticle Stepper Etch
Flatness CD Aberrations Power
Reflectivity Defects Lens Heating Pressure
Topography Edge Roughness Focus Flow rates
Proximity Effects Leveling
Dose

Refractive Index Temperature Time Amines

Thickness Uniformity Temperature Humidity
Uniformity Time Dispense Pattern Pressure
Viscosity Delay Rinse
Contrast

Resist PEB Develop Environment

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Silicon Integrated Circuit
Technology Roadmap

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 Comparative Economics
Revenue/Capital1
Chemical & Petrochemical 22.4
Pharmaceutical 19.6
Semiconductor 6.8

• Capital productivity is a major driving force

for semiconductors
_______________
From 1997 US Census Bureau
1

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Why Control Critical Dimension (CD)?
• Small changes in CD distribution = Large $ values lost
Higher speed

(Low conductance)
(High leakage)
Zero Yield

Zero Yield
3 36nm

3 = 12nm

210 230 250 270 290

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Gate CD (nm)
Figure 19.1 The five levels of process control and optimization in
manufacturing. Time scales are shown for each level.

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 Control Hierarchy in Batch
Processing
1. Sequential control to step the process through
a recipe
2. Logic control to deal with device interlocks
3. Within-the-batch control to make set point
changes and reject disturbances
4. Run-to-run control to meet final quality
constraints
5. Batch production control to maximize utilization
of equipment and minimize cycle time
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 Within-the-Batch Control:
Operational Challenges
• Time-varying process characteristics (no
steady state)
• Nonlinear behavior
• Model inaccuracies
• On-line sensors often not available
• Constrained operation
• Unmeasured disturbances
• Irreversible behavior
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14
 1000C

Temperature

Time 10 sec

Figure 3. Definition of bring-in (Rapid Thermal Processing)

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 Run-to-Run (RtR) Control
• Keeps batch process product on target by using
feedback to manipulate batch recipe for
consecutive batches
• Required due to a lack of in situ, real-time
measurements of product quality of interest
• Extremely useful where initial conditions or tool
states are variable and unmeasurable
• Supervisory controller determines optimal
setpoints for real-time control loops (typically
PID)

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 RtR Control
• Predominantly used in semiconductor and
batch chemical industries
• Can be viewed as discrete-time process
(k, k+1, k+2 … vs. t)
• Good for treating drifting processes (e.g.
reactor fouling)
• Run-to-run optimization can be performed
using process model
• Integrates with fault detection
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 Use of RtR Control
• Examples of events which can have slow
dynamics or infrequent step changes
- equipment aging
- periodic machine maintenance
- changes in feedforward signal
- measure disturbance
- major fault, such as instrumentation
degradation

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 Application: Resist etch process
• The incoming pattern is masked
Linewidth
with linewidths greater than
required.
• An additional step is added to the
S iO N
T rim m ed etch process which etches the
R esist
resist pattern.
• The resist etch step trims the
P oly S ilicon
lines to the proper resist linewidth.
• The rest of the etch transfers the
STI G ate O xide STI resulting mask pattern into the
polysilicon, creating the poly gate
S ilicon S ubstrate structures.

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 Results – Increased Cpk
40

Prior to APC Implementation

With Automated Run-to-Run Control

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Frequency

20

10

0
-1 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Normalized Deviation From Target

Metric Uncontrolled Controlled % Change

Mean Deviation From Target -0.201 0.045 -77%
Standard Deviation 0.254 0.188 -26%
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Cpk 1.05 1.7 +62%
Reduction in STI Rework with RtR
Fab 25 STI Rework Rate

6.00%
Standard SPC Charting Manual Implementation Automated Implementation
Process Control of APC Algorithm of APC Algorithm
5.00%
Percent Rework

4.00%

3.00%

2.00%

1.00%

0.00%
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15

17

19

21
23

25

27

29

31

33

35

37

39

41
1

1998 Work Week

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Figure 22.19 Batch control system – a more detailed view 22
 Characteristics of batch scheduling and
planning problems (Pekny and Reklaitis)

DETERMINE GIVEN

What Product requirements

Product amounts: lot sizes, batch Horizon, demands, starting and
Sizes Ending inventories

When Operational steps

Timing of specific operations, run Precedence order
lengths Resource utilization

Where Production facilities

Sites, units, equipment items Types, capacities

How Resource limitations

Resource types and amounts Types, amounts, rates

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 Welcome to the Real World!
• For a real lot in a real fab, there are:

– Reworks
– Different process equipment at previous steps
– WIP ordering/processing
– Equipment/Consumable material changes
– Recipe changes/adjustments
– Scheduled/Unscheduled maintenance
– Multiple reticle instances
– Engineering lots

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Figure 22.17 Multiproduct batch plant
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Multi-Product Processing Overview
Fab Tool

A B B A A B Process 1

Fab Tool

Process 1
A A A A

Process 2

Fab Tool

Process 1

A B B A A B
Process 2
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 Metrology Variations
4

3.5

Correct Metrology
2.5

1.5

0.5 Ordering
Process
0
A B C D E

2
4
1.8

1.6 3. 5

1.4 3

Incorrect Metrology
1.2 2. 5
1 2
0.8
1. 5

Ordering
0.6
1
0.4
0. 5
0.2
0
0
A B C D E E D C B A

3.5
3

2.5
2
Incorrect Metrology
1.5
1

0.5
Ordering
0
C D A E B

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