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Course Descriptions
• Data representation in digital computers
• Boolean algebra
• Minimization and implementation of logic functions.
• Design of combinational circuits
• Programmable devices (PLA, PAL, FPGA), multiplexers, decoders,
memory and tri-state devices.
• Basic ALU design
• Elements of sequential circuits: latches, flip-flops and counters.
• Design of synchronous sequential machines
• Introduction to CAD and hardware description languages
SYLLABUS
• Number Systems
• Boolean Algebra; K-map & Tabular Minimization Methods
• Combinational Circuit Design; Arithmetic Logic Circuits,
• Computer Aided design (CAD) Tools
• Hardware Description Languages (HDL)
• Sequential Logic Design
• Programmable Logic Devices; PAL, PLA, FPGA
• Memory Devices; RAM, ROM, SRAM
• CMOS Logic Family
Learning outcomes
1 Recognize data in different digital formats, convert from one format to another and perform basic
mathematical operations.
2
Analyze and Synthesis a logic circuit, set-up its truth table and describe its functionality.
3
Assess logic functions using Boolean algebra, and Karnaugh maps
4
Recommend combinational logic circuits and sub-systems of medium complexity using combinational-circuit
building blocks.
5
Describe simple synchronous sequential circuits and finite state machines.
6
Describe the general architecture and functionality of memory devices.
7
Define basic digital circuits using a hardware description language
8
Simulate logic circuits at component-level using digital simulation tools with schematic capture. Utilize
test/measurement equipment to debug/verify functionality
9
Write laboratory reports, interpret and appraise the experimental results.
ASSESSMENT
• Exam 1 Week 5 10%
• Midterm Week 10 20%
• Exam 2 Week 13 10%
GRADING
• 90 –100%A
• 80 – 89% B
• 70 –79% C
• 60 – 69% D
• Below 60% F
• All grades are assigned on an individual basis.
Note: Above numerical values are representative of the particular grade band.
8
ECCE 210 Digital Logic Design Slide 8
Lecture 1: Course Outline & Introduction
9
ECCE 210 Digital Logic Design Slide 9
Lecture 1: Course Outline & Introduction
10
ECCE 210 Digital Logic Design Slide 10
Lecture 1: Course Outline & Introduction
11
ECCE 210 Digital Logic Design Slide 11
Lecture 1: Course Outline & Introduction
Information Delivery
• Presentation in class is the main channel
of information, including knowledge,
schedule announcements.
• Lecture notes and labscripts will be posted
on course website.
• Tutorials for vivado and Verilog will be
posted on lab website
Course management
• When Sunday, Tuesday, Thursday 9am
• Where TBD
• Instructors
Phone 02-5018513
Location in course
textbook
Chapter 1
Learning objectives
• Be aware where logic circuits are in our
daily life.
• To know how logic circuits are
implemented in real world.
• To get familiar with the concept of design
process in industry.
• Understand the purpose of ECCE 210
Electronics/Computing Evolution
Bell’s Law: New class of Computing every
decade
Device density(Moors Law)
Volume increases
Price Decrease
http://www.nobelprize.org/educational/physics/integrated_circuit/history/
ECCE 210 Digital Logic Design Slide 20
Lecture 1: Course Outline & Introduction
Moore’s Law
• 1965: Gordon Moore plotted the number of
transistors on each chip
– Fit straight line on semilog scale
– Transistor counts have doubled every 18 months
Integration Levels
SSI: 10 gates
MSI: 1000 gates
LSI: 10,000 gates
VLSI: > 10k gates
Manufactures are
now moving to multi
core devices.
Digital hardware
• Technology evolution
Before 1960s, transistors and resistors as individual parts
Integrated circuits: a number of transistors on a single chip (SSI,
MSI)
By 1970, a microprocessor on a single chip
In the early 1990s, a few million transistors on a chip (VLSI)
By the late 1990s, 10 million transistors on a chip
After 2019 Billion of transistors on single chip
• Moore’s law
The number of transistors on a chip will double every 1.5 to 2
years. (from 1980 to 2010)
Lower cost
High speed
Low Power
Digital hardware
• Implemented:
On a single chip
Multiple chips on a PCB (printed circuit board)
• Available chips that may be used
Standard chips: <100 transistors, simple function,
fixed functionality.
PLD (programmable logic devices): larger size,
general structure, user defines the function by
programming PLD.
Custom design (no chip available): manufacturing a
chip on semiconductor material directly based on
logic function, area efficient, high speed, low cost for
high volum
Digital hardware
• Comparison
SYSTEM
MODULE
+
GATE
CIRCUIT
Vin Vout
DEVICE
G
S D
n+ n+
age
Y=not(A&B&C) gu
n
r La ve
l
sf e L e
n te
r Tra HDL Ga
is te r V
g o
Re rilog
Ve
s w s
View Vie
s to r o ut
i y
n s La
Tra
Digital Design Abstraction Levels
iphone 4 PCB board
SOC-Chip
Module adder(a,b,cin,sum,cout)
MODULE
Input a,b,cin;
+
Output sum, cout;
GATE
CIRCUIT/
Physical Design
DEVICE
G
S D
n+ n+
30
Lecture 1: Course Outline & Introduction
Chip/die photo
ign
es
l D
ic a
y s
P h
nd
it a
c u
ir
: C
r ing
ee
g in
n
ni cE
t ro
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E
Summary
• Syllabus
– Why this course?
– What we will learn
– Outcomes of this course
– Grading policy
• Introduction to logic design
– Life needs digital
– History of digital circuits
– Design methodology
Backup/extra
Block Level
Design (u-
Architecture) Physical
System
Design
validation
Design concept
A
Partition
B
No
Correct?
Yes D
Physical mapping
Timing simulation
No
Correct?
Yes