Professional Documents
Culture Documents
Roadmap Update
Agenda
2
I. Product Overview and Application
3
I. Product Overview
General Motherboard & BOX PC series
4
I. Vertical Applications in CARES
5
II. Intel IOTG Roadmap & New Products
A. Big Core
RPL-S /RPL-P /ADL-PS
B. Small Core
ADL-N series
6
A. Intel® IOTG Roadmap – Big Core
1. ADL-S & RPL-S Series
7
Copyright © 2023 ASRock Industrial Corp. All Rights Reserved
Intel® ADL-S & RPL-S Product Lineup-DDR4
MP DEVELOPING PLANNING
• All Alder Lake-S products can support Raptor Lake-S processors by updating BIOS.
8
Intel® ADL-S & RPL-S Product Lineup-DDR5
MP DEVELOPING PLANNING
DDR5 & PCIE Gen5 Support
• NEW models on this page can support DDR5 & PCIE Gen5
9
Intel® RPL-S Product Roadmap
2022 2023 MP DEVELOPING
Q3~ NUC
Q1 BOX Roadmap
Q2 Q3
IMB-1230/H610 MP IMB-1237/H610 Sample ready: Aug. 2023
IMB-1231/Q670 IMB-1238/Q670
IMB-X1231/W680 IMB-X1238/W680
◇ 2 x DDR4-3200 ◇ 2 x DDR5-4800
◇ Triple Display (H610) ◇ Triple Display (H610)
◇ Quad Display (Q670/W680) ◇ Quad Display (Q670/W680)
◇ Dual 2.5G LAN ◇ Dual LAN (2.5G+1G)
◇ Mini-ITX (High Rise I/O) ◇ Mini-ITX (High Rise I/O)
10
Intel® RPL-S Product Roadmap
2022 2023 MP DEVELOPING
Q3~ NUC
Q1 BOX Roadmap
Q2 Q3
IMB-1315/H610
◇ 2 x DDR5-4800/5600
Sample ready: Jul. 2023
◇ Triple Display
◇ Dual 1G LAN ◇ Micro-ATX
All product plans and roadmaps are subject to change without notice. 10
Mini-ITX Thin I/O Spec Comparison-DDR4
IMB-1232-WV IMB-1233-WV IMB-X1233-WV
Chipset H610 Q670 W680
Memory 2*DDR4-3200, up to 64GB
ECC support No Yes M.2
M.2
Graphics Outputs Triple-display Quad-display Key
Key M
B
- 1*HDMI2.0b, 2*DP1.4a, 1* LVDS, - 1*HDMI2.0b, 2*DP1.4a, 1* LVDS, 1*eDP1.4
1*eDP1.4
LAN 2*Intel 2.5G LAN
Expansion Slots 1 x PCIe x16 (Gen4) 1 x PCIe x16 (Gen4, supports riser card x8/x8)
M.2
1 x M.2 Key E (2230) 1 x M.2 Key E (2230)
Key M
1 x M.2 Key B (3042/3052) 1 x M.2 Key B (3042/3052)
USB Rear: Rear:
2 x USB 3.2 Gen2 4 x USB 3.2 Gen2 M.2
2 x USB 2.0 Key
E
Internal: Internal:
1 x USB 3.2 Gen1 2 x USB 3.2 Gen1
3 x USB2.0 4 x USB2.0
Storage 2 x SATA3.0 2 x SATA3.0
1 x M.2 Key M (2242/2260/2280) 1 x M.2 Key M (2242/2260/2280)
1 x M.2 Key M (2242)
Power 12~28V DC-In (Lockable DC Jack)
All product plans and roadmaps are subject to change without notice. 11
Mini-ITX High-Rise I/O Spec Comparison-DDR5
IMB-1237 IMB-1238 IMB-X1238
Chipset H610 Q670 W680
Memory 2*DDR5-4800, up to 64GB
ECC support No Yes
Graphics Outputs Triple-display Quad-display
-1*HDMI 2.0b, 1*HDMI 1.4b, -1*HDMI 2.0b, 1*HDMI 1.4b,
1*DP1.4a, 1*LVDS or eDP 1*DP1.4a, 1*LVDS or eDP
LAN 1*Intel 2.5G LAN + 1*Intel 1G LAN
Expansion Slots 1 x PCIe x16 (Gen5) 1 x PCIe x16 (Gen5, supports riser card x8/x8)
1 x M.2 Key E (2230) 1 x M.2 Key E (2230)
1 x M.2 Key B (3042/3052) 1 x M.2 Key B (3042/3052)
USB Rear: Rear:
2 x USB 3.2 Gen2 4 x USB 3.2 Gen2
4 x USB 2.0 2 x USB 2.0
Internal: Internal:
1 x USB 3.2 Gen1 2 x USB 3.2 Gen1
1 x USB 2.0 2 x USB 2.0
Storage 2 x SATA3 4 x SATA3
1 x M.2 Key M (2242/2280) 1 x M.2 Key M (2242/2280)
1 x M.2 Key M (2242)
Power ATX PWR (24+4-pin) and +12V DC-In c o-design
All product plans and roadmaps are subject to change without notice. 10
Mini-ITX Thin I/O Spec Comparison-DDR5
IMB-1239-WV IMB-1240-WV IMB-X1240-WV
Chipset H610 Q670 W680
Memory 2*DDR5-4800, up to 64GB
ECC support No Yes
Graphics Triple-display Quad-display
Outputs 2*HDMI 2.0b, 1*DP1.4a, 2*HDMI 2.0b, 1*DP1.4a,
1*LVDS, 1*eDP1.4b 1*LVDS, 1*eDP1.4b
LAN 1*Intel 2.5G LAN + 1*Intel 1G LAN
Expansion Slots 1 x PCIe x16 (Gen5) 1 x PCIe x16 (Gen5, supports riser card x8/x8)
1 x M.2 Key E (2230) 1 x M.2 Key E (2230)
1 x M.2 Key B (3042/3052) 1 x M.2 Key B (3042/3052)
USB Rear: Rear:
2 x USB 3.2 Gen2 4 x USB 3.2 Gen2
2 x USB 2.0
Internal: Internal:
1 x USB 3.2 Gen1 2 x USB 3.2 Gen1
3 x USB 2.0 4 x USB 2.0
Storage 2 x SATA3 2 x SATA3
1 x M.2 Key M (2242/2280) 1 x M.2 Key M (2242/2280)
1 x M.2 Key M (2242)
Power 12~28V DC-In (Lockable DC Jack)
All product plans and roadmaps are subject to change without notice. 11
Micro-ATX Spec Comparison-DDR4
IMB-1314 IMB-X1314
Chipset Q670 W680
Memory 4*DDR4-3200, up to 128GB
ECC support No Yes
Graphics Outputs Quad-display
- 1*HDMI2.0b, 1*DP1.4a, 1*VGA, 1*LVDS
LAN 2*Intel 2.5G LAN 3*Intel 2.5G LAN
Expansion Slots 1 x PCIe x16 (Gen4,supports riser card x8/x8)
1 x PCIe x8 (Gen4)
2 x PCIe x4 (Gen4)
1 x M.2 Key E (2230) M.2 Key M
1 x M.2 Key B (3042/3052)
M.2
USB Rear: Key B
5 x USB 3.2 Gen2 M.2 Key M
1 x USB 3.2 Gen2x2 (20G) (Type C)
Internal:
M.2
2 x USB 3.2 Gen1 Key E
4 x USB2.0
Storage 8 x SATA3.0
1 x M.2 Key M (25110)
1 x M.2 Key M (2242/2260/2280)
Power ATX PWR (8+24 Pin)
All product plans and roadmaps are subject to change without notice. 12
Micro-ATX Spec Comparison-DDR5
IMB-1315 IMB-1316 IMB-X1316 IMB-X1316-10G
Chipset H610 Q670 W680 W680
Memory 2*DDR5-5600/4800, up to 64GB 4*DDR5-4400, up to 128GB
ECC support No No Yes Yes
Graphics Outputs Triple display Quad display
1 x HDMI 1.4b, 1 x HDMI 2.0b 2 x HDMI 2.0b, 1x DP1.4a, 1 x LVDS
1x DP1.4a, 1 x LVDS or eDP
LAN 2 x Intel 1G LAN 1 x Intel 2.5G LAN 1 x Intel 2.5G LAN
1 x Intel 1G LAN 1 x Intel 1G LAN
1 x Marvell 10G LAN
All product plans and roadmaps are subject to change without notice. 13
A. Intel® IOTG Roadmap – Big Core
2. ADL-P & RPL-P Series
14
Copyright © 2023 ASRock Industrial Corp. All Rights Reserved
Intel® IOTG Roadmap – RPL-P
21
Copyright © 2023 ASRock Industrial Corp. All Rights Reserved
Intel® IOTG Roadmap – RPL-P
22
Intel® ADL-P Product Lineup
MP DEVELOPING PLANNING
23
Intel® RPL-P Product Lineup
MP DEVELOPING PLANNING
20
Intel® RPL-P MB Roadmap
2023 MP DEVELOPING
Q1 NUC
Q2 BOX Roadmap
Q3 Q4
NUC-1300/D5 Series MP
◇ 2 x DDR5-4800
◇ Quad Display
◇ Dual 2.5G LAN ◇ NUC
NUC-1300/D5
SBC-373-WT (Wide Temp Support -40° C ~ 85° C) Sample ready: Jul. 2023
◇ 2 x DDR4-3200
◇ Quad Display
◇ Dual LAN (2.5G+1G) ◇ SBC3.5”
SBC-371
SBC-371 Sample ready: Jun. 2023
◇ 2 x DDR4-3200 SBC-373-WT
◇ Quad Display
◇ Dual 2.5G LAN ◇ SBC3.5”
NUC BOX-1300/D4 MP
◇ DDR4-3200, up to 64GB
◇ Quad-Display (1x HDMI 2.0b, 3x DP 1.4a++)
◇ Dual 2.5G LAN
◇ Dual-Storage (1x SATA3.0 + 1x M.2 KeyM PCIe Gen4 x4)
NUC BOX
NUC BOX-1300/D5 MP
◇ DDR5-4800, up to 64GB
◇ Quad-Display (1x HDMI 2.0b, 3x DP 1.4a++)
◇ Dual 2.5G LAN
◇ Dual-Storage (1x SATA3.0 + 1x M.2 KeyM PCIe Gen4 x4)
26
Intel® RPL-P iBOX Roadmap
2023
Q1 NUC
Q2 BOX Roadmap
Q3 Q4
27
Intel® RPL-P Performance Comparison
Alder Lake-P Raptor Lake-P Performance
Spec / Benchmark
i7-1260P i7-1360P Increase (%)
CPU Cores 12 (4P+8E) 12 (4P+8E)
CPU Threads 16 16
Base Frequency 2.5 GHz 2.61 GHz
Turbo Frequency 4.7 GHz 4.7 GHz
Intel® Smart Cache 18 MB 18 MB
DRAM Frequency DDR4-3200 DDR4-3200
GPU Frequency 1.40 GHz 1.50 GHz
Execution Units 96 EU 96 EU
Cinebench R20 3155 3753 19% ▲
All product plans and roadmaps are subject to change without notice. 29
NUCS/ NUC 1300 Spec Comparison
NUC 1300 series NUCS 1300 Series
CPU RPL-P
Memory 2*SO-DIMM DDR4-3200, Up to 64GB
Storage 1 x SATA3.0
1 x M.2 Key M 1 x M.2 Key M (2242/2280)
(2242/2260/2280) with PCIe with PCIe Gen4 x4 M.2 Key M
Gen4 x4
*M.2 Key M 2280(Supported by
bracket)
Graphics Outputs Quad-Display Quad-Display
1*HDMI 2.0b 2*HDMI 2.0b
3*DP1.4a++ (2 from Type-C) 2*DP1.4a++ (2 from Type-C)
LAN 2 x Intel 2.5G LAN 1 x Intel 2.5G LAN
Expansion Slots 1 x M.2 Key E (2230)
COM 1*COM(RS-232/422/485) N/A
USB Total 8 USB Ports Total 6 USB Ports
Front: Front:
2*USB 3.2 Gen2 (Type-A) 2*USB 3.2 Gen2 (Type-A)
1*USB 4 (Type-C) 1*USB 4 (Type-C)
1*USB 3.2 Gen2 (Type-C) 1*USB 3.2 Gen2 (Type-C)
Rear: Rear:
2*USB 3.2 Gen2 (Type-A) 2*USB 3.2 Gen2 (Type-A)
Internal:
2*USB2.0 (1*2.54 Pitch
header)
Audio 1
Power 12~19V DC-in Jack
All product plans and roadmaps are subject to change without notice. 23
NUC 1200 | 1300 Spec Comparison
NUC 1200 series NUC 1300/D4 Series NUC 1300/D5 Series
CPU ADL-P RPL-P
Memory 2*SO-DIMM DDR4-3200, Up to 64GB 2*SO-DIMM DDR5-4800, Up to
64GB
Storage 1 x SATA3.0
1 x M.2 Key M (2242/2260/2280) with PCIe Gen4 x4
*M.2 Key M 2280(Supported by bracket)
Graphics Outputs Quad-Display
1*HDMI 2.0b, 3*DP1.4a++ (2 from Type-C)
LAN 2 x Intel 2.5G LAN 2 x Intel 2.5G LAN 2 x Intel 2.5G LAN
Expansion Slots 1 x M.2 Key E (2230)
COM 1*COM(RS-232/422/485)
USB Total 8 USB Ports Total 8 USB Ports
Front: Front:
2*USB 3.2 Gen2 (Type-A) 2*USB 3.2 Gen2 (Type-A)
2*USB 3.2 Gen2 (Type-C) 1*USB 3.2 Gen2 (Type-C)
1*USB 4 (Type-C)
*USB4™ Compliance Test is pending for certification
Rear: Rear:
2*USB 3.2 Gen2 (Type-A) 2*USB 3.2 Gen2 (Type-A)
Internal: Internal:
2*USB2.0 (1*2.54 Pitch header) 2*USB2.0 (1*2.54 Pitch header)
Audio 1
Power 12~19V DC-in Jack
All product plans and roadmaps are subject to change without notice. 22
IMB-1234 | IMB-1235 Spec Comparison
IMB-1234 IMB-1235
Platform ADL-P RPL-P
Processors IMB-1234P (i7-1265UE) IMB-1235P (i7-1365UE)
IMB-1234M (i5-1245UE) IMB-1235M (i5-1335UE)
IMB-1234V (i3-1215UE) IMB-1235V (i3-1315UE)
Memory 2*DDR4-3200, up to 64GB
Graphics Quad display
Outputs 2 x HDMI 2.0b
2 x DP 1.4a (2 from Type C)
1 x LVDS
1 x eDP
LAN 2 x Intel 2.5G LAN (I225LM/I225V) 2 x Intel 2.5G LAN (I226LM/I226V)
Expansion Slots 1 x M.2 Key E (2230)
1 x M.2 Key B (3042/3052)
Vertical USB 3.2 N/A
Gen2 Type A
USB Rear:
2 x USB 2.0
2 x USB 3.2 Gen2
2 x USB4/Thunderbolt™4
Internal:
1 x USB 3.2 Gen1 and 1 x USB 2.0
Storage 2 x SATA3.0
1 x M.2 Key M (2242/2260/2280)
Input PWR 12~28V DC-In (Lockable DC Jack)
Operating Temp 0ºC – 70ºC
All product plans and roadmaps are subject to change without notice. 21
SBC-370 | SBC-371 | SBC-373-WT Spec Comparison
SBC-370 SBC-371 SBC-373-WT
Platform ADL-P RPL-P
Processors Up to 15W
Memory 2*DDR4-3200, up to 64GB
Graphics Quad display
Outputs - 1 x HDMI 2.0b, 1 x LVDS or eDP, 3 x DP1.4a (2 from Type-
LAN C)
2 x Intel 2.5G LAN 1 x Intel 2.5G LAN
1 x Intel 1G LAN
Expansion 1 x PCIex1 (Gen3)
Slots 1 x M.2 Key E (2230)
1 x M.2 Key B (3042/3052)
Vertical USB 1
3.2 Gen2 Type
A
USB Rear:
2 x USB3.2 Gen2
2 x USB3.2 Gen2x2 (20G)
(Type-C, Support DP1.4a display output)
Internal:
1 x USB 3.2 Gen 2
2 x USB2.0
Storage 1 x SATA3.0
1 x M.2 Key M (2242/2260/2280)
Input PWR 12~36V DC-In
Operating 0ºC – 70ºC -40ºC – 85ºC
Temp
All product plans and roadmaps are subject to change without notice. 21
NUCS BOX-1300/D4 Series Features
All product plans and roadmaps are subject to change without notice. 24
NUCS BOX-1300/D4 Series Specification
Dimensions 110.0 x 117.5 x 38 mm (0.5L)
Support Quad-Display
Graphics Outputs 2*HDMI 2.0b
2*DP1.4a++ (from Type-C)
All product plans and roadmaps are subject to change without notice. 26
NUC BOX-1300/D5 Series Specification
Dimensions 110.0 x 117.5 x 47.85 mm (0.6L)
Support Quad-Display
Graphics Outputs 1*HDMI 2.0b
3*DP2.1/1.4a++ (2 from Type-C)
1 x SATA3.0
Storage 1 x M.2 Key M (2242/2260/2280) with PCIe Gen4 x4
*M.2 Key M 2280(Supported by bracket
All product plans and roadmaps are subject to change without notice.
Input Power 19V,120/90W adapter (12~19V DC-in) 27
Compare with others(Big Core)
Item / Model NUC BOX-1360P/D5 Competitor
Photo
Intel® 13th Gen (Raptor Lake-P) Core™ Intel® 13th Gen (Raptor Lake-P) Core™
CPU (Platform) Processors Processors
Dimension 110.0 x 117.5 x 47 mm 112.0 x 117 x 37 mm
Memory DDR5-4800, up to 64GB DDR4-3200, up to 64GB
38
A. Intel® IOTG Roadmap – Big Core
3. ADL-PS series
31
Copyright © 2023 ASRock Industrial Corp. All Rights Reserved
Intel® IOTG Roadmap – ADL-PS
40
Intel® IOTG Roadmap – ADL-PS
MP DEVELOPING PLANNING
41
Copyright © 2023 ASRock Industrial Corp. All Rights Reserved
Intel® ADL-PS Product Roadmap
2023 MP DEVELOPING
Q1 NUC
Q2 BOX Roadmap
Q3 Q4
IMB-1236
42
SBC-370 | SBC-372 SBC Spec Comparison
SBC-370 SBC-372
Platform ADL-P ADL-PS M.2
Processors Up to 15W Up to 45W Key M
Storage 2*SATA3.0
1*M.2 Key M (2242/2260/2280)
COM COM1, COM2 (RS-232/422/485)
COM3, COM4, COM5, COM6 (RS-232)
Input PWR 12~28V DC-In
All product plans and roadmaps are subject to change without notice. 44
B. Intel® IOTG Roadmap – Small Core
EHL & ADL-N Series
45
Intel® IOTG Roadmap – ADL-N
46
Copyright © 2023 ASRock Industrial Corp. All Rights Reserved
Intel® IOTG Roadmap – ADL-N
47
Intel® EHL Product Lineup
MP DEVELOPING PLANNING
48
Intel® ADL-N Product Lineup
MP DEVELOPING PLANNING
49
Intel® ADL-N MB Roadmap-DDR4
2023 MP DEVELOPING
Q1 NUC
Q2 BOX Roadmap
Q3 Q4
NUC-N97 Sample available
◇ 1 x DDR4-3200
◇ Triple Display
◇ Dual 2.5G LAN ◇ NUC
SBC-260 Sample ready: Jun. 2023 NUC-N97 SBC-260
◇ 1 x DDR4-3200
◇ Triple Display
◇ Dual LAN (2.5G+1G) ◇ SBC3.5”
Q4 NUC
Q1 BOX Roadmap
Q2 Q3
SOM-P104 Sample available
◇ 1 x DDR5-4800
◇ Triple Display
◇ 2.5G LAN
◇ 1 x MIOe slot ◇ Pico-ITX
52
Compare with Others(Small Core)
Item / Model NUC BOX-N97 Competitor
Photo
Intel® Alder Lake-N SoC Processors Intel® Jasper Lake SoC Processors
CPU(Platform)
N97
Dimension 110.0 x 117.5 x 47 mm 135.0 x 115 x 36 mm
Triple-Display Dual-Display
Display Output
(1* DP1.4a + 2*HDMI 2.0b) (1* DP1.4 + 1*HDMI 2.0b)
Ethernet Controller Dual LAN (2.5G) Single LAN (1G)
Wireless Ethernet AC3168 (802.11ac) + BT4.2 AC9462 (802.11ac) + BT5.1
Panel USB 3*USB Type A + 2* USB Type C 6*USB Type A
DC-In Voltage 12~19V 19V Only
TPM2.0 on board Yes No
Execution Units 16 EU 24 EU
Storage 2*SATA3.0
ATX: 12V±5%/5Vsb±5%
Input Power
AT: 9~20V±5%
All product plans and roadmaps are subject to change without notice. 55
EHL|ADL-N NUC Spec Comparison
NUC 6000 series NUC-N97
CPU EHL ADL-N
NUC-J6412/NUC-J6426 NUC-N97
NUC-N6210/NUC-N6415
Memory 2*SO-DIMM DDR4-3200, Up to 32GB 1*SO-DIMM DDR4-3200, Up to 16GB
Storage 1 x SATA3.0 1 x SATA3.0
1 x M.2 Key M (2242/2260/2280) 1 x M.2 Key M (2280) with PCIe Gen3
with PCIe Gen3 x1 and SATA3 x1 or SATA3
*M.2 Key M 2280(Supported by bracket) *M.2 Key M 2280(Supported by bracket)
60
AMD Embedded APU Roadmap
61
AMD Ryzen Embedded V2000 Mini-ITX Specification
IMB-V2000P(V2748, 8C/16T, up to 4.25GHz)
CPU IMB-V2000S(V2546, 6C/12T, up to 3.95GHz)
IMB-V2000M(V2718, 8C/16T, up to 4.15GHz)
IMB-V2000V(V2516, 6C/12T, up to 3.95GHz)
Memory 2*non-ECC/ECC SO-DIMM DDR4-3200, Up to 64GB
Storage 2 x SATA3.0
1 x M.2 Key M (2242/2260/2280) with PCIe x4/SATA3
LAN 1*Realtek 2.5G LAN + 1*Realtek 1G LAN (DASH)
1*M.2 Key E 2230 with PCIe x1/USB2.0
Expansion Slots 1*M.2 (Key B, 3042/3052) with PCIe x2/USB 3.2 and SIM
All product plans and roadmaps are subject to change without notice. 62
AMD Ryzen Embedded V2000 Fanless BOX PC
iBOX-V2000M (V2718)
iBOX-V2000V (V2516)
All product plans and roadmaps are subject to change without notice. 52
AMD Ryzen 7000 Series Feature
AMD Ryzen 7000 Series CPU
◎ Up to DDR5-4800 64GB
◎ PCIe 4.0
◎ Support USB4
AMD Ryzen 5000 AMD Ryzen 7000 Advantage of Ryzen 7000
Arch. FP6 7nm Zen3 (Cezanne) FP7 6nm Zen3+ (Rembrandt R) Reduce power consumption
DRAM Freq. Up to DDR4-3200 Up to DDR5-4800
PCIe 3.0 4.0
Enhance performance
USB4 No YES
Graphics Model AMD Radeon™ Graphics AMD Radeon™ 680M
65
AMD Ryzen 4X4-7000/D5 Specification
AMD Rembrandt+ FP7r2
4X4-7735U (R7-7735U, 8C/16T, up to 4.75GHz)
CPU 4X4-7535U (R5-7535U, 6C/12T, up to 4.55GHz)
4X4-7335U (R5-7335U, 4C/8T, up to 4.3GHz)
Memory 2*SO-DIMM DDR5-4800, Up to 64GB
COM 1*COM(RS-232/422/485)
Audio 1 (Mic-in/Line-out Combo)
TPM Infineon TPM2.0 IC Onboard
Input Power 12~19V DC-in Jack
All product plans and roadmaps are subject to change without notice.
07/17/2023 66
AMD Ryzen 4X4 BOX-7000/D5 Features
2 x USB2.0
Dual Storage
1 x USB3.2 Gen2 +
(M.2 2280 Gen4 x4 + 2.5” SSD)
2 x USB4 Ports
All product plans and roadmaps are subject to change without notice. 55
AMD Product Lineup
MP DEVELOPING PLANNING
Fanned Fanless
CPU
Mini-ITX NUC Barebone Barebone Code Name
(Plastic Chassis) (Metal Chassis)
Ryzen R1000 IMB-R1000 4X4-R1000 iBOX-R1000
Ryzen V1000 IMB-V1000 4X4-V1000 iBOX-V1000
P: V2748 S: V2546
Ryzen V2000 IMB-V2000 4X4-V2000 iBOX-V2000
M: V2718 V: V2516
4X4-4800U* 4X4 BOX-4800U*
Ryzen 4000
4X4-4500U* 4X4 BOX-4500U*
4X4-5800U* 4X4 BOX-5800U*
Ryzen 5000 4X4-5600U* 4X4 BOX-5600U*
4X4-5400U* 4X4 BOX-5400U*
Ryzen 7000 4X4-7735U/D5* 4X4 BOX-7735U/D5*
Rembrandt+ 4X4-7535U/D5* 4X4 BOX-7535U/D5*
50
IV. Overall Product Matrix
57
Mini-ITX – SOC (Atom)
MP DEVELOPING PLANNING
CPU
Thin IO High Rise IO
Code Name
IMB-151
IMB-151D-WF IMB-150 D: J1900
Bay Trail N: N2930
IMB-1000D-WF IMB-150D-PCI L: N2807
IMB-1001D-WF
A: N3710
Braswell IMB-155 IMB-154 B: N3160
D: N4200 L: N3350
Apollo Lake IMB-157 IMB-156 J: J3455
IMB-1006 IMB-1005
Alder Lake-N J: N97
IMB-1007
58
Mini-ITX – MCP (Core I ULT)
MP DEVELOPING PLANNING
CPU
Thin IO
Code Name
P: i7-6600U
IMB-198 M: i5-6300U
Skylake ULT
IMB-199 V: i3-6100U
P: i7-8665UE
Whiskey Lake-ULT IMB-1216 M: i5-8365UE
V: i3-8145UE
P: i7-1185G7E
Tiger Lake-UP3 IMB-1224 M: i5-1145G7E
V: i3-1115G4E
P: i7-1265UE
Alder Lake-P IMB-1234 M: i5-1245UE
V: i3-1215UE
P: i7-1365UE
Raptor Lake-P IMB-1235 M: i5-1335UE
V: i3-1315UE
59
Mini-ITX – Socket Type
MP DEVELOPING PLANNING
61
3.5” SBC
MP DEVELOPING PLANNING
Fanless
3.5" SBC CPU Code
Barebone
SBC-210 IBOX-210D D: J1900 N: N2930 L: N2807
Bay Trail
SBC-211 P: E3945 M: E3826
Braswell SBC-220 B: N3160 A: N3710
SBC-230
Apollo Lake D: N4200 J: J3455 L:N3350
SBC-240
J: J6412 D: J6426
ElkHart Lake SBC-250 IBOX-250D N: N6415 L: N6210
SBC-260
Alder Lake-N J: N97
SBC-261
SBC-330 P: i7-6600U M:i5-6300U
Skylake ULT
SBC-331 V: i3-6100U
P: i7-8665UE M: i5-8365UE
Whiskey Lake ULT SBC-350 V: i3-8145UE
P: i7-1265UE M: i5-1245UE
Alder Lake-P SBC-370 V: i3-1215UE
P: i7-1365UE
SBC-371
Rapter Lake-P M: i5-1335UE
SBC-373-WT V: i3-1315UE
Alder Lake-PS SBC-372
62
NUC
Fan Barebone Fanless Barebone MP DEVELOPING PLANNING
NUC MB
(Plastic Chassis) (Metal Chassis)
N3160-NUC IPC IBOX-316
Braswell
N3710-NUC IPC
Apollo Lake J3455-NUC-DL
Elkhart Lake NUC-J6412
Alder Lake-N NUC-N97 NUC BOX-N97 IBOX-N97
NUC-8665UE
Whiskey Lake ULT NUC-8365UE
NUC-8145UE
NUC-1185G7E IBOX-1185G7E
NUC-1145G7E IBOX-1145G7E
NUC-1115G4E IBOX-1115G4E
Tiger Lake-UP3
NUC-1165G7* NUC BOX-1165G7*
NUC-1135G7* NUC BOX-1135G7*
NUC-1115G4* NUC BOX-1115G4*
NUC-1265UE IBOX-1265UE
NUC-1245UE IBOX-1245UE
NUC-1215UE IBOX-1215UE
Alder Lake-P NUC-1260P* NUC BOX-1260P*
NUC-1240P* NUC BOX-1240P*
NUC-1220P* NUC BOX-1220P*
NUC-7305*
NUCS-RPL-P/D4 NUCS BOX-RPL-P/D4
Raptor Lake-P NUC-RPL-P/D4 NUC BOX-RPL-P/D4
NUC-RPL-P/D5 NUC BOX-RPL-P/D5
* Without Longevity Support
63
Copyright © 2023 ASRock Industrial Corp. All Rights Reserved
System On Module & Small Form Factor
MP DEVELOPING PLANNING
64
STX & Networking
MP DEVELOPING PLANNING
CPU
MXM Solution Mini-STX Networking MB Barebone
Code Name
Braswell NAB-9601 / N3160 NAS-9601 / N3160
BR:J4025
Gemini Lake* STX-1000 JR:J4125
DR: J5040
J:J6412 D:J6426
ElkHart Lake STX-1001 N: N6415 L:
100 Series Chipset MXM IPC-H110
(Skylake/Kaby Lake) MXM IPC-Q170-Q
300 Series Chipset
MXM IPC-Q370-12V
(Coffee Lake)
400 Series Chipset
MXM IPC-Q470E
(Comet Lake)
P: i7-1185G7E
Tiger Lake-UP3 STX-1500 M: i5-1145G7E
V: i3-1115G4E
65
AMD Product Lineup
MP DEVELOPING PLANNING
Fanned Fanless
CPU
Mini-ITX NUC Barebone Barebone Code Name
(Plastic Chassis) (Metal Chassis)
Ryzen R1000 IMB-R1000 4X4-R1000 iBOX-R1000
Ryzen V1000 IMB-V1000 4X4-V1000 iBOX-V1000
P: V2748 S: V2546
Ryzen V2000 IMB-V2000 4X4-V2000 iBOX-V2000
M: V2718 V: V2516
4X4-4800U* 4X4 BOX-4800U*
Ryzen 4000
4X4-4500U* 4X4 BOX-4500U*
4X4-5800U* 4X4 BOX-5800U*
Ryzen 5000 4X4-5600U* 4X4 BOX-5600U*
4X4-5400U* 4X4 BOX-5400U*
Ryzen 7000 4X4-7735U/D5* 4X4 BOX-7735U/D5*
Rembrandt+ 4X4-7535U/D5* 4X4 BOX-7535U/D5*
66
Thank you
07/17/2023
RPL-P/Rembrandt R
Performance
NUC-1360P/D4 VS. NUC-1260P [Normal mode]
Raptor Lake-P Alder Lake-P Performance
Spec / Benchmark NUC-1360P/D4 NUC-1260P Increase (%)
l
P core: 5.0 GHz P core: 4.7 GHz
a
Turbo Freq.
r i
E core: 3.7 GHz E core: 3.4 GHz
u
DRAM Freq./ Size
d s t l
DDR4-3200 32GB*2
a
DDR4-3200 32GB*2
I n ti
GPU Frequency 1.50 GHz 1.40 GHz
o ck
BIOS Setting
AS R C o n
Cinebench R23 Multi core 9040 8088 13%▲
p an y
3DMARK Sky Diver 15897 14491 10%▲
Co m
[Normal Mode] i7-1360P vs. i7-1260P (both DDR4 design)
CPU Performance Up to 13% GPU Performance Up to 10%
NUC-1360P/D5 VS. NUC-1260P [Normal mode]
Raptor Lake-P Alder Lake-P Performance
Spec / Benchmark NUC-1360P/D5 NUC-1260P Increase (%)
l
P core: 5.0 GHz P core: 4.7 GHz
a
Turbo Freq.
r i
E core: 3.7 GHz E core: 3.4 GHz
DRAM Freq./ Size
d us t l
DDR5-4800 32GB*2
a
DDR4-3200 32GB*2
I n ti
GPU Frequency 1.50 GHz 1.40 GHz
o c k
BIOS Setting
fi d e n
Default Default Normal Mode
AS R o n
Cinebench R23 Multi core
C
10146 8008 27%▲
o m p a
C
[Normal Mode] i7-1360P/DDR5 vs. i7-1260P/DDR4
Up to 27%
CPU Performance Up to 25%
GPU Performance
NUC-1360P/D5 VS. NUC-1260P [Performance mode]
Raptor Lake-P Alder Lake-P Performance
Spec / Benchmark NUC-1360P/D5 NUC-1260P Increase (%)
l
P core: 5.0 GHz P core: 4.7 GHz
a
Turbo Freq.
r i
E core: 3.7 GHz E core: 3.4 GHz
DRAM Freq./ Size
d us t l
DDR5-4800 32GB*2
a
DDR4-3200 32GB*2
I n ti
GPU Frequency 1.50 GHz 1.40 GHz
o c k
BIOS Setting
fi d e n
Performance Mode Default Perf. vs. Normal
AS R o n
Cinebench R23 Multi core
C
12729 8008 59%▲
o m p a
C
[Performance Mode] i7-1360P/DDR5 vs. i7-1260P/DDR4
Up to 59%
CPU Performance Up to 30%
GPU Performance
Summary
i7-1360P vs. i7-1260P [Normal mode with DDR4 design]
CPU
i7-1360P +13%
i7-1260P
GPU
i7-1360P
tr i al +10%
s
i7-1260P
I n d u n ti
i7-1360P/DDR5 vs. i7-1260P/DDR4
al [Normal mode]
Ro ck
CPU i7-1360P
i7-1360P
i7-1260P
n fi d e
+27%
AS C o
i7-1360P
i7-1360P +25%
y
GPU
n
i7-1260P
m p a
i7-1360P/DDR5 vs. i7-1260P/DDR4
o
[Perf. mode vs. Normal mode]
C
i7-1360P
i7-1360P
CPU i7-1360P +59%
i7-1260P
GPU
i7-1360P
i7-1360P
i7-1360P +30%
I7-1260P
i7-1260P
Intel Performance Comparison
+27% i7-1360P/DDR5 vs. i7-1260P/DDR4
CPU Performance increase 59%
+59%
tr i al GPU Performance increase 30%
I n d us+30%
ti al
o ck fi d e n NUC-1260P
AS R C o n NUC-1360P/D4
p an y NUC-1360P/D5
NUC-1360P/D5 Perf.
Co m
Cinebench R23 Multi
Core
3DMARK Sky Diver 3DMARK Fire Strike
Ultra(DX11)
*Performance (%) compare with NUC-1260P
4X4-7735U/D5 VS. 4X4-5800U [Normal mode]
Rembrandt R Cezanne Performance
Spec / Benchmark
4X4-7735U/D5 4X4-5800U Increase (%)
al
Turbo Freq. Up to 4.75GHz Up to 4.4GHz
DRAM Freq./ Size
us tr i DDR5-4800 32GB*2
l
DDR4-3200 32GB*2
n d ti a
Graphics Capabilities AMD Radeon™ 680M AMD Radeon™
o ck I
BIOS Setting
R
Cinebench R23
AS
Single Core
p n y
3DMARK Fire Strike
a
Ultra (DX11) 1805 914 86% ▲
Co m
[Normal Mode] R7 7735/DDR5 vs. R7 5800U/DDR4
CPU Performance Up to 11% GPU Performance Up to 86%
4X4-7735U/D5 VS. 4X4-5800U [Performance mode]
Rembrandt R Cezanne Performance
Spec / Benchmark
4X4-7735U/D5 4X4-5800U Increase (%)
al
Turbo Freq. Up to 4.75GHz Up to 4.4GHz
DRAM Freq./ Size
us tr i DDR5-4800 32GB*2
l
DDR4-3200 32GB*2
n d ti a
Graphics Capabilities AMD Radeon™ 680M AMD Radeon™
o ck I
BIOS Setting
i d e n
Performance mode Performance mode Perf. mode
R
Cinebench R23
AS
Single Core
p n y
3DMARK Fire Strike
a
Ultra (DX11) 1805 914 98% ▲
Co m
[Performance Mode] R7 7735/DDR5 vs. R7 5800U/DDR4
CPU Performance Up to 10% GPU Performance Up to 98%
4X4-7735U/D5 VS. 4X4-4800U
Rembrandt R Renoir Performance
Spec / Benchmark
4X4-7735U/D5 4X4-4800U Increase (%)
Turbo Freq.
tr i al
Up to 4.75GHz Up to 4.2GHz
s
DRAM Freq./ Size DDR5-4800 32GB*2 DDR4-3200 32GB*2
n d u
Graphics Capabilities
I n ti al
AMD Radeon™ 680M AMD Radeon™
Ro c k
BIOS Setting
n fi d e
Performance mode Default Perf. vs. Normal
AS o
Cinebench R20 4716 4197 13% ▲
a n y C
3DMARK Fire Strike
1753 792 119% ▲
p
Ultra (DX11)
Co m
[Performance Mode] R7 7735/DDR5 vs. R7 4800U/DDR4
Up to 13%
CPU Performance Up to 119%
GPU Performance
Summary
R7 7735U vs. R7 4800U [Perf. mode vs. Normal mode]
tr i al
s
R7 4800U
I n d u n ti
R7 7735U/DDR5 vs. R7 5800U/DDR4
al [Normal mode]
Ro
CPU
ckR7 7735U
R7 5800U
n fi d e +11%
AS y C o +86%
R7 7735U
GPU
an
R7 5800U
m p
R7 7735U/DDR5 vs. R7 5800U/DDR4
o
[Performance mode]
C
R7 4800U
CPU
R7R7
7735
7735U +10%
R7 5800U
GPU
R7 7735U
R7 7735U +98%
R7 5800U
R7 5800U
AMD Performance Comparison
+63% R7 7735/DDR5 vs. R7 5800/DDR4
+97% CPU Performance increase 13%
GPU Performance increase 97%
tr i al
I n d us ti al 4X4-5800U
+13%
o ck fi d e n 4X4-7735/D5
AS R C o n 4X4-7735/D5 Perf.
p an y
Co m
Cinebench R23 3DMARK Sky Diver 3DMARK Fire Strike
Ultra(DX11)
*Performance (%) compare with 4X4-5800U
Thank You!
Legal Notices and Disclaimers INFORMATION
Information and content in this document is provided in connection with ASRock Industrial® products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document.
Except as provided in ASRock Industrial’s terms and conditions of sale for such products, ASRock Industrial assumes no liability
whatsoever, and ASRock Industrial disclaims any express or implied warranty, relating to sale and/or use of ASRock Industrial®
products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any
patent, copyright or other intellectual property right.
ASRock Industrial may make changes to specifications and product descriptions at any time, without notice.
All product and figures specified are preliminary based on current expectations, and are subject to change without notice.
Performance tests, such as Cinebench and 3DMark, are measured using specific computer systems, components, software, operations and functions.
Any change to any of those factors may cause the results to vary.
*Other names and brands may be claimed as the property of others.