Latch-up can occur in CMOS circuits due to the presence of parasitic transistors and diodes formed by the multiple p-well and n-well junctions. This can create a low resistance path between the power supply rails (VDD and VSS) when enough substrate current flows, turning on the parasitic transistors and risking damage to the circuit. Latch-up can be triggered by glitches or radiation and addressed by increasing substrate doping to lower resistances, reducing other resistances, or using guard rings.
Latch-up can occur in CMOS circuits due to the presence of parasitic transistors and diodes formed by the multiple p-well and n-well junctions. This can create a low resistance path between the power supply rails (VDD and VSS) when enough substrate current flows, turning on the parasitic transistors and risking damage to the circuit. Latch-up can be triggered by glitches or radiation and addressed by increasing substrate doping to lower resistances, reducing other resistances, or using guard rings.
Latch-up can occur in CMOS circuits due to the presence of parasitic transistors and diodes formed by the multiple p-well and n-well junctions. This can create a low resistance path between the power supply rails (VDD and VSS) when enough substrate current flows, turning on the parasitic transistors and risking damage to the circuit. Latch-up can be triggered by glitches or radiation and addressed by increasing substrate doping to lower resistances, reducing other resistances, or using guard rings.
well process is due to the relatively large no.of junctions.
These junctions formed the consequent presence
of parasitic transistors and diodes.
The parasitic components give rise the establishment
of low conducting path between VDD and VSS with disastr- ous results.
Latch-Up may be induced by glitches on the supply
rails or by incident radiation. VDD VSS
Latch-Up effect in n-well process
Fig shows the key parasitic components associated with n-well structure in which an inverter circuit has been formed.
Two transistors and two resistances which form a
path between VDD and VSS.
If sufficient substrate current flows to generate
enough voltage across RS to turn on transistor Q2, this will then draw current through Rn. If the voltage developed is sufficient, Q1 will also turn on , establishing a self sustaining low resistance path between the supply rails.
If the current gains of the two transistors are such
that β1 x β2 >1, latch-up may occur. Remedies for the problem include
1.an increase in substrate doping levels with a
consequent drop in the value of Rs
2. reducing Rn by control of fabrication parameters