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Integrated Circuit Overview and Challenges

The document is a term paper review for an integrated circuit class submitted by Sachin Gupta. It provides an introduction to integrated circuits, noting they are miniaturized electronic circuits contained on a semiconductor substrate. The paper will cover the invention and generations of integrated circuits, advances, popularity, classification, manufacturing, and references. It notes 15% of the work is completed with 85% remaining, and the student has a problem understanding power MOSFET topics.

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Kool Kaish
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50 views2 pages

Integrated Circuit Overview and Challenges

The document is a term paper review for an integrated circuit class submitted by Sachin Gupta. It provides an introduction to integrated circuits, noting they are miniaturized electronic circuits contained on a semiconductor substrate. The paper will cover the invention and generations of integrated circuits, advances, popularity, classification, manufacturing, and references. It notes 15% of the work is completed with 85% remaining, and the student has a problem understanding power MOSFET topics.

Uploaded by

Kool Kaish
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOC, PDF, TXT or read online on Scribd

TERM PAPER REVIEW TOPIC-INTEGRATED CIRCUIT

NAME-SACHIN GUPTA [Link](ECE) SECTION-E6902 ROLL NO-B47 REG. NO-10905375 SUB-ECE 201

INTRODUCTION:INTEGRATED CIRCUIT:- IN electronics an integrated circuit (also known


as IC, microcircuit, microchip, silicon chip, or chip) is a miniaturized electroni circuit ( mainly of semiconductor devices, as well as passive components) that has been manufactured in the surface of a thin substrate of semiconductor material. Integrated circuits are used in almost all electronic equipment in use today and have revolutionized the world of electronics. A hybrid integrated circuit is a miniaturized electronic circuit constructed of individual semiconductor devices, as well as passive components, bonded to a substrate or circuit board.

CONTENTS:1. introduction. 2. invention. [Link]. [Link] in integrated Circuit. 5 .popularity of ics. 6. classification. 7. manufacturing. [Link].

PROBLEM FACING:I am not able to under stand of the topics regarding Power mosfets.. I can directly copy the picture from Internet.

AMOUNT OF WORK DONE:15% of work is completed and 85% of work is Remamaing. THE END

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