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PUTRAJAYA
CARRY OUT SEMICONDUCTOR PACKAGING EQUIPMENT AND COMPONENTS MAINTENANCE USING STANDARD OPERATING PROCEDURE, EQUIPMENT MANUFACTURER SPECIFICATION, EQUIPMENT DATA BOOK, LOGBOOK, CHECKLIST, HAND TOOLS, REPORT FORMS, PERSONAL PROTECTIVE EQUIPMENT (PPE), RECORDING PROCEDURE SO THAT SEMICONDUCTOR PACKAGING EQUIPMENT RECORDED AND REPORTED, FAULTY COMPONENTS REPAIRED, FUNCTIONALITY TESTED AND MAINTENANCE ACTIVITY REPORTED IN ACCORDANCE WITH MANUFACTURER MANUAL. EE-020-2/DES4243/LE01/T
Muka : 1 Drp : 2
Tarikh:
NO KOD / CODE NO
TAJUK : TUJUAN : ARAHAN : METALLIZATION
EE-020-2/DES4243/LE01/T
Muka: 2 Drp: 2
Jawab semua soalan dengan merujuk kepada kertas penerangan EE-020-2/DES4243/LE01/P SOALAN : Jawab semua soalan.