Heavy Copper

Design Considerations

June 2003
 Design Guidelines
Copper Nom Finish Min Plotted Copper Expected Min Plotted Min Drill Size
Weight Copper Thk Line Width Etch Loss Min FLW Spacing per Oz Wt Cu

.0039" .0045" .008" Nom

3 oz .0125" .008"
(.0035" Min ) (+/-.002" ) (.006" - .010")

.0052" .0060" .009" Nom

4 oz .015" .009"
(.0047" Min ) (+/-.0025" ) (.0065" - .0115")

.0065" .0075" .010" Nom

5 oz .0175" .010"
(.006" Min ) (+/-.0035" ) (.0065" - .0135")

.0078" .009" .012" Nom

6 oz .021" .012"
(.0073" Min ) (+/-.004" ) (.008" - .016")

.0091" .0105" .0125" Nom

7 oz .023" .014"
(.0085" Min ) (+/-.005" ) (.0075" - .0175")

Total Copper
all Layers:
16 oz .0135" diameter

24 oz .016" diameter

30 oz .020" diameter

45 oz .026" diameter

60 oz .031" diameter

80 oz .036" diameter
 Design Guidelines

Clad Nominal Nominal Minimum Maximum

Copper Thickness Thickness Thickness Thickness
Weight (as Received) (as Processed) (as processed) (as processed)
1/2 ounce 0.00068" 0.00058" .00050" .00075"
1 ounce .00135" .00120" .00106" .00149"
2 ounce .00270" .00260" .00228" .00297"
3 ounce .00405" .00400" .00350" .00446"
4 ounce .00540" .00520" .00471" .00594"
5 ounce .00675" .00650" .00593" .00743"
6 ounce .00810" .00780" .00714" .00891"
7 ounce .00945" No Data .00836" .01040"

Typ Process Values:

Ref: IPC-MF-150
See Table 1 1/2 oz copper = 80 -100 Microinch Loss in Copper thickness
All values @ +/- 10 % 1 oz copper & above = 150 Microinch Loss in Copper thickness
for ED Foil
 DFM Concerns:
Webs on Plane Layers:
• Must meet min line width criteria for oz weight copper
• Reduce clearances for surrounding holes to accommodate etch loss

Edge Distance Requirements:

• Inner & Outer Layers
• NPTHs, Cut-Outs, and Outlines

Min Line Widths & Spacings per Oz. Weight Copper:

• Run DRCs & Verify measurements against tables
• Confirm drawing & specification requirements against design

Annular Ring:
• Add “Etch Loss” to A/Ring formula to calculate required pad sizes
• Change Thermal reliefs to Direct connects on plane layers
 DFM Concerns:

• Copper Thickness to Drill Ratio:

• Min hole diameter vs Total stacked copper thickness ( see table )
• Remove Non-Functional pads from Heavy copper layers
• Weighing drill size vs thermal management of PTHs

• Area to Fill:
• Increase copper areas to balance topography
• Watch for stacked features that will cause High & Low pressure areas.
• High Resin content prepreg required against heavy copper etched
layers

• High / Low Pressure Areas:

• Lamination Issues - Resin Voids, Resin Loss, Glass stacking
• O/L Imaging Issues -- Off Contact due to uneven topography
 DFM Concerns:

• Foil Outer Layer vs Cap Core Outer Layers:

• Foil is always the preferred Outer Layer construction
• Cap cores should be avoided in a construction if possible

• Material Selection for cores:

• On Hand Inventory ( Std Materials )

• UL, CSA, & IEC requirements

• Sanmina is 94V-0 rated on High Tg FR4 to 6 oz copper
• 3 Ply min reqmnt for Pri/Sec windings ( Planar Mags-CSA )
 DFM Concerns:

• Coupon Design:
• Coupons require the same consideration as parts for all DFM concerns
• Change plane layer coupon designs to match the part
• Shift clearances and thermals / direct connects for Pwr/Gnd layers
• Drills should encounter the same amount of copper in the coupons, as they do
the part(s).

• Surface Mount Pads & Discretes on Heavy Copper Outer Layers

• Global grows may be the best way to adjust tools to meet finish requirements
• Trapezoidal shape considerations per oz weight of copper
• ( See figure )
DFM / Process Concerns:

W1
W2

Heavy Copper

Dielectric Core

As Copper Weight increases, W1 > W2

( Chart Reflects “W2” - Expected Etch Loss )
 DFM Concerns:

• Soldermask considerations with Heavy Copper Outer Lyrs

• Multiple passes of LPI mask to ensure coverage of protected features
• Volts per mil ratings of LPI mask choices ( ref soldermask attribute matrix )

• Silkscreen considerations with Heavy Copper Outer Lyrs

• Place markings on TOP of large conductive features or in wide open areas.
• Keep markings bold ( Use wide fonts where possible )

• Plating Finishes
• HASL ( Hot Air Solder Level )
• OSP ( Cu 106A )
• Selective Plate Finish ( Nickel, Gold, Solder, etc )
• All holes in a selective plate area MUST be cleared from both sides of part
 DFM Concerns:

( Formula in accordance with design rules in IPC-2221 section 9.1.1)

[ Pad Size = a + 2b + c + other ]

Where:
“ a ” = Max Finish hole size
“ b ” = Min A/Ring requirement ( &/or Etchback reqmnt )
“ c ” = Fab Allowance

Fab Allowance:
Mil-Std-275 / IPC-D-275 / IPC-2221
( Prefered ) Level A = .026” / .020” / .016”
( Std ) Level B = .018” / .016” / .010”
( Reduced ) Level C = .010” / .010” / .008”

Read the fine print under Table 9-1 ( pg 70 ) in IPC-2221 !!

“Other” = .002” per oz wt copper above 1 oz + add .002” for > 8 Lyrs
( All specs agree on adding “Other” in the formula )
 Pad Size calculations

Pad Size = a + 2b + c + other

a
b
a = Max Finish hole size
c
b = Min A/Ring requirement
Other
c = Fab Allowance

Other = .002” per oz wt copper above 1 oz “Plus” add .002” for > 8 Lyrs

Ex: 10 Layers, .016” via w/ 4 oz I/L’s. << What size pad should be designed ??
Pad size = .019” + (2).001” + .010” + (3).002” + .002”
Pad Size = .039” ( Equivalent to D+23” )
 Additional Technologies associated
with Heavy Copper products

• 1. Control Depth Blind Via drilling into

Heavy Copper Inner Layers
• Thick copper allows the drill operators to stop the drill
point inside the copper layer(s) without penetrating into
the adjacent dielectrics, and still ensure adequate
electrical & mechanical integrity in the Blind Via hole.
• This is a standard process for 6 oz copper (Lyr 2 or Lyr N-1 )
• Aspect ratio considerations for CDDR PTH
 Control Depth Drilling

TOP View
* Do Not Penetrate through 2nd Lyr
Copper

Lyr 1
Fill Dielectric
* Stop
6 oz Copper .0071”-.0089”

Core - Dielectric

6 oz Copper

Control Depth Blind Via Holes

 Control Depth Drilling

TOP View
* If Drill Penetrates through 2nd Lyr
Laminate Copper

.031” drilled hole

Lyr 1
Fill Dielectric
.012”- .020”
6 oz Copper .0071”-.0089”

Core Dielectric

6 oz Copper

Control Depth Blind Via Holes

 Additional Technologies associated
with Heavy Copper products

• 2. Edge Plating
• Edge Plating when used with Heavy copper layers requires
pads on Top & Bottom Layers along with additional Inner
Layers to provide a means for plating to adhere to the
sidewalls & prevent hole wall pull-away during thermal
stress ( ie Reflow Ops ).
• Edge plate can be used with any ounce weight copper
• Edge plate is typically used in lieu of, or as an adjunct to PTHs’
 Additional Technologies associated
with Heavy Copper products

• 3. Sequential Lamination Blind Via &

Buried Via core processing
• Technologies like Planar Magnetics require the use of Heavy
Copper Inner Layers, and then subject these same layers to
Heavy Copper plating operations.
• Typical Heavy Copper plate values are:
.0015” Min or .0028” Min Copper in PTH
( This may be required for buried, blind &/or thru via PTH’s )
 Planar Magnetics

Layer #
1.
0.0045” 5 / 6 Core
2.
3.
0.0045” 6 / 6 Core
4.
5.
0.0045” 5 / 5 Core
6.
7.
0.0045” 6 / 6 Core
8.
-
9.
0.0045” 6 / 5 Core
.
10
.0260” = (4) 5 oz copper clad Layers
.0028” = (2) 1 oz Plated surfaces ( Layer 5 & 6 )
.0468” = (6) 6 oz copper clad Layers
.0756” = of total base copper ( Thru vias must drill thru )
NOTE: Verify max copper per drill size – see chart