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CLASSIFICATION OF ICs
Monolithic IC Hybrid IC
INTEGRATED CIRCUITS
CHIP
INTEGRATED CIRCUIT
1. Pure silicon is formed as INGOT and sliced into wafer. 2. Fabrication of Integrated circuits on the wafer surface 3. Wafer is cut into chips and is packaged.
WHY EPITAXY? To enhance the performance of discrete bipolar transisto It also offers a means of controlling the doping levels. It is generally oxygen and carbon free.
SiCl4+2H2
Si +4Hcl
STEP 3: Oxidation
SiO2 has the property of preventing diffusion of almost all impurities through it. It serves very important purposes. SiO2 is an extremely hard protective coating and is unaffected by almost all reagents except hydrofluoric acid . Thus it stands against any contamination Si +2H2O SiO2 + 2H2
LITHOGRAPHY
STEP 4: Photolithography
TYPES OF PHOTO RESIST positive resist - the portion of the photoresist that is exposed to light becomes soluble to the photoresist developer. The portion of the photoresist that is unexposed remains insoluble to the photoresist developer. negative resist - the portion of the photoresist that is exposed to light becomes insoluble to the photoresist developer. The unexposed portion of the photoresist is dissolved by the photoresist developer.
STEP 5 : DIFFUSION