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1. INTRODUCTION

The safety of the liquid and solid food product to be produced is the most important that make a
beverages and food processing industry develop successfully. So Plate Type Heat Exchanger is
started to introduced to all industry especially food and beverage industry. Its widely used to protect
the food from microbes so that it can remain fresh and edible for a longer time span. The heat is used
to destroy the microorganisms which prolong the shelf life of food stuff. Destruction of certain
enzymes in the food material enriches the taste and aroma of the food products. This is effectually
done by this heat exchanger device.
Plate Type Heat Exchanger is a type of heat exchangers used widely in the beverages and food
processing units. The plate of heat exchanger needed because they are used to increase the odor and
taste of food products .It is also useful in improving the texture of the food because to make it look
tempting and attractive to buyer and supplier. The pathway mechanism of this equipment is very easy
and understandable. It has a thin tube on which a cooling or heating is pass over and pass by from
down side of the plate or above it or on both the sides. This brings down the heating or cooling of the
food material uniformly. That is why it becomes very important to buy a high quality one especially
when it comes to start a beverages and food processing industry.
The Plate Heat Exchangers were widely introduced and mostly used as liquid heat exchangers in
the food industries because of their ability of cleaning. Plate Heat Exchangers are designed to provide
hygienic and maintenance free operation to food and beverage manufactures. This plate also
functionally to removes the chemical laden epoxy coating or spray paints. Over the years, the
development of the Plate Heat Exchanger has generally continued towards larger capacity, as well as
higher working temperature and pressure.

Heat exchangers also used in space heating, air conditioning, waste heat recovery, power
production, chemical processes and general heating and cooling processes . Recently, plate heat
exchangers are commonly used when compared to other types of heat exchangers such as shell and
tube type in heat transfer processes because of their efficiency, sensitivity, compactness, ease of
production, low production and operational costs, and easy care after set-up.

One of the innovator introduced is a gasket sealing was replaced by a brazed material, and each
thermal plate was formed with a series of corrugations such as herringbone or chevron Some of plate
heat exchanger are made up from stainless steel and titanium to provide corrosion resistance during
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the process. By using plate heat exchanger all products likes milk, cream, whey, yoghurt, desserts,
ice cream mix, condensed milk, buttermilk, butter oil, concentrates, retention, permeates, baby food
or other milk products can be pasteurized and heated at high temperature or cooled. This because the
plate very suitable for sensitive treatment. By supply an optimal thermal rate a high degree of
efficiency can be achieved easily. At the same time, the compact construction of the plate heat
exchanger allows for an expansion in capacity without difficulty.

A photo process system for semiconductor wafers prevents air from flowing across the top of a
baking region to produce a stable downward laminar air flow in front of baking units disposed at
several levels in the baking region. The baking region is located on one side of housing, and a coating
unit for coating a wafer with a photoresist is located on the other side of the housing. The housing has
a clean air entrance and air filters at an upper portion thereof, and a clean air discharge opening at the
very bottom thereof. An air flow containment dam prevents clean air entering the housing from
flowing horizontally at the top of the baking region. Such a horizontal flow of air would otherwise
produce turbulence severely affecting the ability of the air to flow downward across the front of the
baking units and toward the discharge opening as a laminar air flow.

The laminar air flow hardly passes into the baking units and thus, hardly induces temperature
variations in the coated wafers that are being baked. Accordingly, the thickness of the photoresist film
on the wafer becomes highly uniform, as does the critical dimension of a pattern produced from the
film. Also, dust or ionic contaminants are directly discharged through the discharge opening at the
bottom of the housing by the downward laminar flow of clean air. The wafers within the baking units
are prevented from being contaminated, thereby enhancing the yield of the semiconductor products.











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2. CHARACTERISTICS OF A FLOW

2.1 Turbulent flow

The corrugated pattern on the thermal plate induces a highly turbulent fluid flow. The
high turbulence in the Plate Heat Exchanger leads to a low fouling rate, and to reduced heat
transfer area. Corrugated plate heat exchangers have larger heat transfer surface area and
increased turbulence level neither increased the wall shear stress due to the corrugations. Its also
causes the pressure and the temperature increased uniformly. Due to the unique turbulence
created by its corrugated plates, which eliminates stagnant areas in liquid flow and promotes
maximum heat transfer. This translates to a less expensive and more compact heat exchanger.

Fouling rate is defined as any deposited of materials appear upon the heat transfer surface
during the lifetime of heat exchanger. When the deposited form, an additional resistance to heat
transfer is applied and the operational capability of the heat exchanger correspondingly reduced.
In many cases, the deposited is very heavy to significantly interfere with fluid flow and increases
the pressure drop required to maintain the flow rate through the exchanger. The units velocity
profile and induced turbulence causes dirty product deposits to be continually removed from the
heat transfer surface during operation, thereby reducing fouling.

Another characteristic of plates turbulence is its able to flushing water or pumping
cleaning solutions into the unit without disassembling. Plates can be electro-polished to make
cleaning easier, either manually. In addition the higher flow rate will promote and maintain the
high turbulence flow in fluid flow which desirable for enhanced heat transfer but high turbulence
is as source of structural excitation. Heat exchanger tubes will respond in a random manner to
turbulence in the flow field. But the structural excitation turbulence in the flow can affect the
existence and strength of other excitation mechanism namely vortex shedding. The vortex
shedding is an oscillating flow that takes place when a fluid such as air or water flows at certain
velocity.

The typical velocities in plate of heat exchanger used in food industry for a water like
fluids in turbulent flow is among 0.3-0.9m/s but the real velocity in certain region will be higher
by a factor of up to 4 due the effect of the geometry of the plate design. So the turbulent flow
produced low velocity keeping the plate free from scaling fouling rate than laminar flow in tube
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and shell. The turbulent flow also can minimize the risk scaling and clogging of the fluid
channels, thus enabling longer and stable operation.

2.2 Laminar flow
The present invention relates to a photo process system for use in the manufacturing of
semiconductor wafers. More particularly, the present invention relates to a photo process system
for forming a high quality photoresist film on a semiconductor wafer. The fabrication of
semiconductor devices includes a photo process comprising steps of forming a photoresist film on
a wafer, exposing the photoresist film to define a predetermined pattern thereon, and developing
the exposed photoresist to form a film of the predetermined pattern on the wafer. In clustered
systems whose use has been increasing as of recent, all of the units of equipment for performing
the photo process, for example, a coating unit, a developing unit, a baking unit, and the like, are
clustered in one place. Therefore, the distance between the units, and hence, the time required to
move a wafer from one unit to the next, is relatively short. Thus, the photo process can be
performed efficiently by such equipment.
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Figure 1: A schematic of the layout of a conventional clustered photo process system.

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3. EFFECTIVENESS OF THE FLOW
3.1 Turbulent flow in plate heat exchanger
Heat exchanger is a common device that applied the turbulent flows which is widely used
in food processing industries and producing dairy products. The turbulent flows play an important
role in heat exchanger in term of effectiveness especially for the plate heat exchanger. This type
of heat exchanger gives great turbulences flow among other types of heat exchanger and thus it
has the greatest maintenances and inspection. To conclude, the plate type heat exchanger in most
cases is the most efficient heat exchanger. It generally offers the best solution to heating and
cooling applications since it can better handle the widest pressure and temperature limits. It
consists of a number of very thin corrugated stainless steel heat transfer plates clamped together
in a frame. Heat is transferred from the warm fluid to the colder fluid via the thin stainless steel
plate. The corrugations in the channels support the plates against differential pressure and create a
turbulent flow. The turbulent flow in turn provides high heat transfer efficiency, making the plate
heat exchanger very compact compared with the traditional shell-and-tube heat exchanger
(Genemco, Inc. 2006). Because of they are compact, they only requires minimal pace and easy to
expands (IDMC Ltd., 2011).
Turbulent flow in the heat exchanger and smooth plate surface helps in avoiding fouling
and scaling and thereby ensuring longer usages (IDMC Ltd., 2011). Plate heat exchanger has a
high turbulence in the medium that in turn gives a higher convection, which results in efficient
heat transfer between the media. Only a small surface area is requires because of the consequence
of this higher heat transfer coefficient per unit area and also gives a more efficient process. The
high turbulence gives a self-cleaning effect. Therefore, the fouling of the heat transfer surfaces is
considerably reduced. This means that the plate heat exchanger can remain in service far longer
between cleaning intervals because of the turbulence flow. Since the plate heat exchanger consists
of a framework of plates, more plates can easily be added to increase the turbulence flows
capacity, and the plates can easily be spread apart for cleaning. It also utilize the thinnest material
for the heat transfer surface that in turn gives optimum heat transfer, since the heat only has to
penetrate thin material (Genemco, Inc. 2006).
Turbulent flows in heat exchanger also provide self-cleaning action. The units velocity
profile and induced high degree of turbulence causes dirty product deposits to be continually
removed from the heat transfer surface during operation, thereby lower the fouling. In addition,
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the turbulent flows provide a more uniform velocity profile and eliminating zones of low velocity
which are particularly prone to fouling. The pressed pattern on each plate surface induces
turbulence and minimizes stagnant areas. The simple turbulent flow helps to reduce deposits
which would interfere with heat transfer. The plate turbulence also improves the effectiveness of
water back flushing and cleaning in place procedures with less frequent need to uninstall the
exchanger. Hence, the flows make the cleaning easier, either manually or in place. As mentioned
before, the flow turbulence promotes maximum heat transfer. With their high efficiency, the
exchangers can handle temperature approaches of less than 1C (2F). The unit also offers overall
heat transfer coefficient, U or K value of 3 to 6 times higher than shell & tube exchangers.
3.2 Laminar flow in semiconductor industries
In the post-exposure baking (PEB) step, optically-decomposed resins are rearranged due
to thermal diffusion by heating the exposed photoresist at a predetermined temperature, thus
cleaning the profile boundary (cross section) between exposed patterns. This PEB step is
performed to prevent abnormalities from being produced in the profile of the patterns and non-
uniformity of the critical dimension of the patterns when the patterns are irradiated with
ultraviolet (UV) or deep ultraviolet (DUV) light during the exposure process. Because light
irradiating the exposed portion diffracts and produces interference according to the reflectivity
and refractivity of the wafer and the optical absorption level of the photoresist, the diffraction and
interference of the light would create the above-mentioned abnormalities and non-uniformity in
the exposed portion if the resins were not rearranged by being heated prior to exposure.
The problems posed by these optical phenomena of diffraction and interference can
alternatively be solved by coating the photoresist film with an anti-reflection film prior to
exposure. However, the PEB process is used more often.
When the exposure light in the photo process is a DUV light, a chemically-amplified resist is
used as the photoresist. A portion of the chemically-amplified resist, which is exposed by thermal
treatment, changes into an acid which is soluble in a developing solution. Also, the alteration of
the chemically-amplified resist occurs due to a chain reaction, so that the balance of heat applied
to the entire wafer in the PEB step has the greatest effect on the uniformity of the critical
dimension of a pattern.

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4. PROBLEMS THAT OCCUR WHEN NEGLECTING THE FLOWS
4.1 Turbulent flow in plate heat exchanger
Plate heat exchanger is a heat exchanger that designed well suited to transferring heat
between medium and low-pressure fluids (Hewitt, G (1994). Process Heat Transfer. CRC Press). .
Turbulent flow is occurs by nature chaotic and at high velocity. Turbulent flow is important in
maintenance and performances of plate heat exchanger. Heat transfer is separated in turbulent
flow fields is an attractive and important phenomenon. The separation flow generated by sudden
expansion or contraction in passage, flow over forward and backward facing step occurs in many
different practical flows like heat exchanger. Separation occurs in turbulent and laminar flows.
The turbulent flow separation has been studied to a greater extent because turbulent flows are
more frequently encountered than laminar flows. Separation is also more likely to occur when the
flow is turbulent and due to inertial effects, separation has a much greater influence in turbulent
flow( Hussein Togun, Kazi S. N, Ahmed Badaruddin. (2011).
A Review of Experimental Study of Turbulent Heat Transfer in Separated Flow. Aust. J.
Basic & Appl. Sci., 5(10): 489-505). The fluid mixes irregularly during turbulent flow and
constant changes in the flows behavior (wakes, vortexes, eddies) make flow rates difficult
impossibly to accurately measure. Turbulent flow usually occurs at high flow rates or in larger
diameter pipes and desirable when solids must remain suspended in the fluid to prevent settling or
blockages. (Alicat Scientific, Inc, 2005).
It has been found that Reynolds numbers of less than 1200 describe the condition at
which there is no breaking away from the tube wall which is termed laminar flow by
experimentation. The physical properties of the fluid are the determining factors for the heat
transfer in this area which is inefficient in heat transfer terms. Whether or not the tubes are
grooved, when operating in a laminar flow regime grooved tubes have no positive effect until the
Reynolds number is above 1000. It is classified as a zone of uncertainty when the Reynolds
number at values of between 1200 and 2000, called the transitional zone where there may or may
not be turbulence generated. As it is an area of uncertainty heat transfer, fluids flowing in this
area must be avoided. As can be seen in this case, when the tubes are corrugated, they provide a
significant enhancement when the Reynolds number is above 1000 but still below the 2000 level
required for turbulent flow with a smooth tube. The use of laminar flow will have the
disadvantage of increasing the resistance to fluid flow, the pressure loss, at a rate which increases
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more rapidly than the decrease in boundary layer resistance (Comparison of laminar and turbulent
flow.
The fouling factor represents the theoretical resistance to heat flow due to a buildup of a layer
of dirt or other fouling substance on the tube surfaces of the heat exchanger. By neglecting the
turbulent flows, an attempt to minimize the frequency of cleaning is impossible. In reality it can
lead to increased cleaning frequency. For example, in dairy industries, production of milk results
in deposit adhesion to the plate surface. This problem decrease the production rate and increase in
the intensity of cleaning procedure. The deposits must be removed by regular and intensive
cleaning procedures in order to comply with hygiene and quality regulations for the dairy industry
(Augustin et al., 2007). If not controlled carefully, deposits can cause deterioration in the product
quality because milk cannot be heated up to the required pasteurization temperature. Milk
deposits generally form so fast that heat exchangers must be cleaned regularly to maintain
production efficiency and meet strict hygiene standards and regulations (Bansal and Chen, 2006).
Energy losses, lost productivity, manpower and cleaning expenses cause large costs (Beuf et al.,
2003). In the dairy industry, fouling and the resulting cleaning of the process equipment account
for about 80% of the total production costs (Bansal and Chen, 2006).
4.2 Laminar flow in semiconductor industries
A cleanroom or clean room is an environment, typically used in manufacturing or scientific
research, with a low level of environmental pollutants such as dust,
airborne microbes, aerosol particles, and chemical vapors. More accurately, a cleanroom has
a controlled level of contamination that is specified by the number of particles per cubic meter at
a specified particle size. To give perspective, the ambient air outside in a typical urban
environment contains 35,000,000 particles per cubic meter in the size range 0.5 m and larger in
diameter, corresponding to an ISO 9 cleanroom, while an ISO 1 cleanroom allows no particles in
that size range and only 12 particles per cubic meter of 0.3 m and smaller. If we ignoring the
flow the product that we will get from the production will have contaminated material such as
dust and affect the function of the semiconductor letter on.





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5. CONCLUSION

5.1 Turbulent flow

As conclusion, the plates of heat exchanger give more benefit to food industry and other
industry. The most valuable advantages is the plate in heat exchanger more efficient, occupy less
space, lighter and do not need to be cleaned as often as shell and tube heat exchangers. Other than
that, the plate heat exchanger over conventional heat exchanger are as superior thermal
performance, availability of wide variety of corrosion resistance alloys, ease of maintenance,
expendability and multiphase capability, compact design and high heat transfer area.

When the material is high cost, the cost is less than for traditional shell and tube due to
lower heat transfer area requirements therefore costs are reduced where corrosive fluids are
present. These special advantages of plate heat exchanger over conventional heat exchanger make
them perfect for the application of heat transfer in the chemical processes industries. Based on
experiments have been performed the most suitable material to built up plate of heat exchanger is
stainless steel because of its ability to withstand high temperatures, its strength, and its corrosion
resistance.

All plate heat exchanger look similar inside and outside. The difference lies on the inside,
in the details of the plate design and the sealing technologies used. Hence, when evaluating a
plate of heat exchanger, it is very important to explore about the detail of the products being
supplied, but also analyze the level of research and development. An important aspect to take
when evaluating a heat exchanger are the forms of corrugation within the heat exchanger.

5.2 Laminar flow
In the photo process system according to the present invention as described above, a
downward laminar flow of clean air is effectively and stably produced within the housing,
thereby suppressing the flow of clean air into the baking shelf unit. Furthermore, the cooling
water lines within the baking shelf unit are prevented from exerting a thermal influence on a
wafer in the baking chamber of the unit. Accordingly, the temperature across the wafer can be
kept uniform. Therefore, the photo process system of the present invention can produce a
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photoresist film on the wafer having a highly uniform thickness and a photoresist pattern having a
highly uniform critical dimension.
Also, clean air within the housing is directly discharged through the grating at the bottom
of the housing due to the laminar characteristic of the air flow. Thus, the interior of the housing is
kept quite clean and wafers within the housing are prevented from being contaminated by dust or
the like. Therefore, the present invention contributes to increasing the yield of the semiconductor
products.
Although the present invention has been described above with respect to particular
embodiments thereof, many modifications thereof will become readily apparent to those of
ordinary skill in the art. Thus, all such modifications are seen to be within the true spirit and
scope of the invention as defined by the appended claims.





















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List of references

1. Eric. G. G., Handbook of Thermal Design. (pg 3-37). (1989).
2. Kuppan. T., Heat Exchanger Design Handbook. (pg 435 436). (2000).
3. Anonymous, http://www.tranter.com/Pages/products/plate-heat-exchanger/discription-
benifits,2000. Retrieved March 21, 2014.
4. Lamb. B., Plate and Frame Heat Exchangers. (February 2, 2011). http://www.thermopedia.com.
Retrieved March 21, 2014.
5. Comparison of Laminar and Turbulent Flow. http://www.hrs-
heatexchangers.com/en/resources/comparison-of-laminar-and-turbulent-flow.aspx. Retrieved
March 21, 2014.
6. US 6372042 B1. Woo-dong Sung, Sam-soon Han, Chang-wook Oh and Jeong-lim Nam. System
for Processing Semiconductor Wafers Producing a Downward Laminar Flow of Clean Air in
Front of Baking Units. (April 16, 2002). http://www.google.st/patents/US6372042. Retrieved
March 20, 2014.