VLSI Structures Lecture 7 ECE 425 Outline Overview of next few lectures Determining capacitance and resistance of CMOS structures Lecture 7 ECE 425 Upcoming Lectures Three-lecture sequence on circuit speed Determining resistances and capacitances Calculating gate speed Logical effort -- a method for estimating the speed of multi-gate structures. Lecture 7 ECE 425 Delay Estimation Computing delay exactly requires knowing L, R, C, and doing painful calculus Therefore, we make approximations that are close enough for design work Always keep in mind the inaccuracy of fabrication Typically use either capacitance-only or RC delay models depending on physical distance between structures Today, were going to focus on how to determine the capacitance and resistance of VLSI structures Next time, we talk about how to use that to estimate delay Lecture 7 ECE 425 Transistors Capacitance Care about three capacitances: source, drain, gate Resistance Approximate resistance of gate terminal as infinite (current only flows into gate to charge/discharge gate cap) Resistance from source-drain is complex function of V ds , Vgs and depends on what region the device operates in Often approximate as R eff , based on the time required to charge/discharge a unit capacitance Lecture 7 ECE 425 Transistor Capacitance Source, drain capacitances are between diffusion and bulk Gate capacitance is sum of C gs (gate-source capacitance), C gd (gate-drain capacitance), C gb (gate-bulk capacitance) Lecture 7 ECE 425 Source and Drain Capacitances Also called Diffusion capacitance (C d ) Lecture 7 ECE 425 Source, Drain Capacitance Caused by the depletion region at the diffusion-substrate junction Also occurs if you use diffusion as a wire, can use same methods to calculate. Exact value depends on the potential across the junction V j and the area of the depletion region For simplicity, we conservatively assume V j = 0, and thus C d = C d0 Lecture 7 ECE 425 Source, Drain Capacitance Under this model, two components to diffusion capacitance Area: C ja * a * b Perimeter C jp * (2a + 2b) MOSFET Capacitances: Diffusion Adapted from Digital Integrated Circuits, by Rabaeyet. al. Copyright 2003 Prentice Hall/ Pearson Bottom Side wall Side wall Channel Source Channel-stop implant Substrate W x j L S AMI 1.5um Model +CJ = 2.73 E-4 [F/ m^2] PB = 0.979 MJ = 0.54 CJ max=0.27fF/ um^2 +CJSW = 1.42 E-10 [F/ m] PBSW = 0.99 MJSW = 0.1 CJswmax=0.142fF/ um +CJSWG = 6.41E-11 [F/ m] PBSWG = 0.99 MJSWG = 0.1 CJswgmax=0.064fF/ um Lecture 7 ECE 425 Gate Capacitance is a Bit More Complex Start with idealized MOS capacitor Lecture 7 ECE 425 Ideal MOS Capacitor In accumulation, gate oxide acts as a parallel-plate capacitor In depletion, the depletion layer (non-conductive) acts as a dielectric, creating a second capacitor in series with the gate oxide D = depth of depletion layer Lecture 7 ECE 425 MOS Capacitor in Inversion Lecture 7 ECE 425 MOS Capacitor in Inversion Lecture 7 ECE 425 Combined Behavior Lecture 7 ECE 425 Back to the Transistor Lecture 7 ECE 425 Transistor In a transistor, the inversion layer is replentished by the source/drain, so transistors should always follow the slow capacitance curve, regardless of switching speed Lecture 7 ECE 425 Regions of Operation Lecture 7 ECE 425 Linear Region Continued Lecture 7 ECE 425 Saturation Lecture 7 ECE 425 Summary Lecture 7 ECE 425 More Summary Gate capacitance is approximately equal to C 0 , the gate- oxide capacitance for most regions of operation Exception is when V gs is close to V t Lecture 7 ECE 425 Well assume that the circuit switches quickly through this region and approximate (conservatively) Simpler way to express this is C ox (gate capacitance per unit area) is one of the parameters of a fab process Lecture 7 ECE 425 Example MOSFET Capacitances: Overlap Overlap capacitances are Cgsoand Cgdo Values are given by unit width: W x C C W x C C d ox GDO d ox GSO = = Adapted from Digital Integrated Circuits, by Rabaeyet. al. Copyright 2003 Prentice Hall/ Pearson * x d x d L d Polysilicon gate Top view Gate-bulk overlap Source n + Drain n + W d ox GDO gdo d ox GSO gso x C W C C x C W C C = = = = / / W x C C W x C C d ox GDO d ox GSO = = SPICE Model TSMC 0.35um +CGDO = 2.69E-10 CGSO = 2.69E-10 CGBO = 1E-12 C GDO = 0.269fF/um C GSO = 0.269fF/um C GBO = 10aF/um Lecture 7 ECE 425 Part 2: Wires Whenever two conducting layers overlap, they create a capacitor Well approximate this using parallel-plate model for the most part Lecture 7 ECE 425 Typical Parameters from CMOSN Process Lecture 7 ECE 425 Example 1 Lecture 7 ECE 425 Example 1 Lecture 7 ECE 425 Example 2 Lecture 7 ECE 425 Example 2 Lecture 7 ECE 425 Complications Lecture 7 ECE 425 Resistance Lecture 7 ECE 425 Lecture 7 ECE 425 Example Lecture 7 ECE 425 Sheet Resistivities Lecture 7 ECE 425 Contact/Via Resistance Lecture 7 ECE 425 Non-Rectangular Regions General approach is to maintain a lookup table of common shapes and their equivalent resistance in squares Parameterize by the ratio of important dimensions Lecture 7 ECE 425 Example Resistances Lecture 7 ECE 425 Finding Resistances of Wires 1. Break wires up into regions that you know how to find the resistance in squares of 2. Sum resistance in squares along appropriate paths 3. Multiply by sheet resistance For wires that split, treat each portion as a segment and do series/parallel combinations to get total resistance Lecture 7 ECE 425 Example Lecture 7 ECE 425 Example 2 Lecture 7 ECE 425 Wrapping Up Reading Section 2.6 Section 4.5 Next time: Gate-level delay estimation