There is a solder blocking defect on connector CN101 where some kind of flux stain is preventing the solder from fully covering the PCB connector pad. The positioning of the connector against the solder paste is an issue, as the solder does not spread properly on four pins in particular. Improving the stencil design and ensuring accurate dimensions can help address this problem.
There is a solder blocking defect on connector CN101 where some kind of flux stain is preventing the solder from fully covering the PCB connector pad. The positioning of the connector against the solder paste is an issue, as the solder does not spread properly on four pins in particular. Improving the stencil design and ensuring accurate dimensions can help address this problem.
There is a solder blocking defect on connector CN101 where some kind of flux stain is preventing the solder from fully covering the PCB connector pad. The positioning of the connector against the solder paste is an issue, as the solder does not spread properly on four pins in particular. Improving the stencil design and ensuring accurate dimensions can help address this problem.
pad ?? B5452 Connector CN101 solder blocking defects 1 2 CN101 placement offset ~ front to back Stencil design. But need to get the dimension for accuracy. I think positioning of connector against the solder paste Solder paste Copper pattern connector Solder does not spread Solder spread Good condition NG condition Sharing common pattern > most probably not enough temperature causing solder not melt properly. Happen at these four pins only 1.2mm 0.4mm 0.4mm 0.2mm 0.3mm % solder paste/area = 16/36=44% 0.2mm 0.4mm 0.4mm 0.2mm 0.2mm % solder paste/area = 20/36=50% 0.18mm Stencil opening copper land