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OVERVIEW
Soldering is accomplished by quickly heating the metal parts to be joined, and
then applying a flux and a solder to the mating surfaces. The finished solder
joint bonds the parts – forming an excellent electrical connection between wires
and a strong mechanical joint between the metal parts. Heat is supplied with a
soldering iron or other means. The flux is a chemical cleaner which prepares the
hot surfaces for the molten solder. The solder is a low melting point alloy of non
ferrous metals.
SOLDER AND FLUX
What is solder?
Solder is an alloy (mixture) of tin and lead, typically 60% tin and 40% lead. It
melts at a temperature of about 200°C. Coating a surface with solder is called
'tinning' because of the tin content of solder. Lead is poisonous and you should
always wash your hands after using solder.
Solder for electronics use contains tiny cores of flux, like the wires inside a
mains flex. The flux is corrosive, like an acid, and it cleans the metal surfaces as
the solder melts. This is why you must melt the solder actually on the joint, not
on the iron tip. Without flux most joints would fail because metals quickly oxidize
and the solder itself will not flow properly onto a dirty, oxidized, metal surface.
The best size of solder for electronics is 22swg (swg = standard wire gauge).
Reels of solder
The most common alloy is some combination of tin and lead. Certain tin-lead
alloys have a lower melting point than the parent metals by themselves. The
most common alloys used for electronics work are 60/40 and 63/37. The chart
below shows the differences in melting points of some common solder alloys.
Tin/Lea
Melting Point
d
1. Soldering Iron
So this is the most basic of the soldering techniques. You use a soldering iron to
heat the component leg and the pad, then apply solder.
2. Using An Oven
We call this soldering technique reflow soldering. And basically, you bake your
board in an oven. It’s like baking bread!
It’s a very common technique for soldering surface mount components quickly.
First, you apply solder paste to the pads. Solder paste is a type of solder that
comes in paste-form. Then you place your components on the board and bake it
in an oven.
The board heats, and at a certain temperature, the solder melts. Then you cool
off the board, which makes the solder fasten. If everything went as planned you
will have nice solder joints all over the board.
The cool thing about using the reflow soldering technique is that the components
have a tendency to place themselves correctly. This is really useful for soldering
integrated circuits with very little space between the legs.
3. Hot-Air Soldering
Hot-air soldering is a way to melt the solder by blowing really hot air at an area
of your circuit board. You need a Hot Air Soldering Station to do hot-air
soldering. It looks a bit like a soldering iron. But instead of a hot iron, it blows
hot air.
This is really useful for doing circuit board rework. Which means fixing soldering
errors on a board.
It’s a hassle to desolder a chip pin-by-pin. But by heating it with hot air, the
solder on all the pins melt at the same time and you can move it into the correct
position.
Soldering Guide
Preparation
Before you start soldering, you should tin the tip of the soldering iron. This
makes the tip transfer heat faster and thereby making the soldering easier and
faster. If you get any droplets of tin on your tip, use a sponge, a copper scouring
pad or just shake it off.
TIPS: If you tin the tip before you put down the soldering iron for the day, it is
said that the tip should last longer.
Hold the soldering iron like a pen, near the base of the handle.
Imagine you are going to write your name! Remember to never touch the
hot element or tip.
Touch the soldering iron onto the joint to be made.
Make sure it touches both the component lead and the track. Hold the tip
there for a few seconds and...
Feed a little solder onto the joint.
It should flow smoothly onto the lead and track to form a volcano shape
as shown in the diagram. Apply the solder to the joint, not the iron.
Remove the solder, then the iron, while keeping the joint still.
Allow the joint a few seconds to
cool before you move the circuit
board.
Inspect the joint closely.
It should look shiny and have a
'volcano' shape. If not, you will
need to reheat it and feed in a
little more solder. This time
ensure that both the lead and
track are heated fully before
applying solder.
Start with tinning the two wires. It is useful to have something to hold one wire
for you. Place the tip of the iron on the wire and let it heat for a second or three.
Then add some solder until the wire is soaked with solder. If it is a thick wire,
you should turn up the heat on your iron (if possible) to make the wire heat up
faster. Repeat the tinning process on the other wire.
Now place the two tinned wires together and hold still while heating them with
the soldering iron so that the tin on both of the wires melt together.
Soldering on a PCB
How to solder through-hole components on a PCB starts by placing the part in its
hole. Bend the leads of the part so that it stays in its place.
Put the tip of the iron on the pad so that it heats both the lead of the part and
the pad of the circuit board. Heat them for a second or so before you apply
solder. Remove the iron and the solder wire and inspect your solder joint to see
if it looks okay.
Note: If you are soldering IC’s, it is smart to use an IC socket. Some ICs will
break if the heat from the soldering iron is too hot.
Soldering Advice for Components
Some components require special care when soldering. Many must be placed the
correct way round and a few are easily damaged by the heat from soldering.
Appropriate warnings are given in the table below, together with other advice
which may be useful when soldering.
For most projects it is best to put the components onto the board in the order
given below:
Reminders and
Components Pictures
Warnings
SMD stands for Surface Mount Device and indicates that the component is
mounted on the surface of the circuit board in contrast to through-hole
components which are mounted in holes.
Start by applying flux to one pad on the circuit board. The flux cleans the pad
and makes it easier for the solder to fasten properly.
Apply some solder to the tip of your iron and touch the circuit board pad with the
tip so that some of the solder passes on to the pad.
Place the resistor in its place an hold it there with a pair of tweezers while you
touch the soldering tip so that it heats both the component and circuit board
pad.
The resistor should now be fastened on one side. Apply solder to the soldering
tip again and touch the iron tip on the other side.
The method to solder a surface mount chip is very similar to the method for
soldering a resistor.
Hold the chip in place while touching the corner pad with the tip of the soldering
iron so that the solder melts the pin and the pad together.
Check the alignment of the chip. If it is not in its place, use your soldering iron
to loosen the pin chip and align the chip properly.
After all the pins have been soldered you should inspect the solder joints
carefully with a microscope or loupe to check for bad joints or solder bridges.
Alternative methods
Using tweezers, place the component in its correct position and hold it there.
Place the tip of the soldering iron onto each of the pads so that the solder melts
and makes good connections between the component and the board.
As usual start by applying flux to the pads on the circuit board. Fasten one of the
corner pins of the chip to its pad by using a bit of solder. Make sure the chip is
properly aligned on the pads.
Now use your soldering iron and flood the pins with solder so that all the pins
are connected. On the picture below, only a few pins are flooded, but the idea is
to flood all the pins.
Then start on one end and heat a pin so that the solder melts on the next 2-3
pins. Use a solder sucker to suck up excess solder.
Continue down the row and heat 2-3 pins at once while you suck the solder
away. After all the excess solder has been removed, check for solder bridges
with a microscope.
At some stage you will probably need to desolder a joint to remove or re-
position a wire or component. There are two ways to remove the solder:
1. With a desoldering pump
(solder sucker)
Apply both the end of the wick and the tip of your soldering iron to the
joint.
As the solder melts most of it will flow onto the wick, away from the joint.
Remove the wick first, then the soldering iron.
Cut off and discard the end of the wick coated with solder.
After removing most of the solder from the joint(s) you may be able to remove
the wire or component lead straight away (allow a few seconds for it to cool). If
the joint will not come apart easily apply your soldering iron to melt the
remaining traces of solder at the same time as pulling the joint apart, taking
care to avoid burning yourself.