Abstract

Wirelesstechnologyimprovementhasbecomefollowerin
todaysmodernlife.Oneofthegreatestimprovementsmadeon
wirelesstechnologyfieldwasinventinganewWireless
Technology(GiFi).GiFiorGigabitWirelessistheworldsfirst
transceiverintegratedonasinglechipthatoperatesat60GHzon
CMOSprocess.
GiFiisawirelesstransmissionsystemwhichistentimesfaster
thanWiFianditschipdeliversshortrangemultigigabitdata
transferinanindoorenvironment.Itwillallowwirelesstransfer
ofaudioandvideodataupto5gigabitspersecond,lowpower
consumption,usuallywithinarangeof10meters.This
technologyprovidinglowcost,highbroadbandaccess,withvery
highspeedlargefilesexchangewithinseconds.Itisrequired
thatGiFitobethepreferrednextgenerationwireless
technologyusedinhomeandoffices.
KeywordsWIFI;WirelessTechnology;GiFi;Gigabitwireless;
Bluetooth

1. INTRODUCTION
Melbourne University researchers have achieved up to 5Gbps data
transfer rates on a wireless chip. This is a lot faster than any current
Wi-Fi speeds. The world's first Gi-Fi wireless network chip
developed at Australia's peak federal technology incubator has
entered its commercialisation phase.
The NICTA (National ICT Australia Limited) Gi-Fi research team
has succeeded in taking complex 60GHz transmission technology
and shrinking it to the point where it can be built on a single silicon
chip. The NICTA teams expertise in wireless transmission
technology means this technology is now at the point where it can
have a dramatic impact on the way consumer electronic devices are
used in the home. The GiFi chip is a good news for personal area
networking because there is no internet infrastructure available to
cop it with. It can have a span of 10 meters. With the help of Gi-Fi

chips the videos sharing can be possible without any hurdles. The
Gi-Fi chip is one of Australia's most lucrative technology. Integrated
on a single chip that operates at 60GHz on the CMOS process. Gi-Fi
is a wireless transmission system which is ten times faster than WiFi and its chip delivers short-range multi-gigabit data transfer in an
indoor environment. It will allow wireless transfer of audio and
video data up to 5 gigabits per second, low power consumption,
usually within a range of 10 meters. The size of the Gi-Fi chip is 55
millimetre and can be placed in different devices such as mobile
phones. The best part about this new technology Gi-Fi is its cost
effectiveness and power consumption, it only consumes 2 watts of
power for its operation with antenna (1mm) included and the
development of Gi-Fi chip costs approximately $10 (Rs380) to
manufacture.

2. NETWORK EVOLUTION
The Fig.1 characterize the network evolution which gives the
abbreviation of the paper.

D.Bluetooth

Fig.5 Bluetooth

E.WIFI
Wi-Fi is based on the IEEE 802.11 wireless local area network
(WLAN) specification. Actually it was designed to be used indoors
at close range for example home user and office environment. The
main goal of Wi-Fi technology is to provide service for mobile
computing device like laptop.

F.WiMax
IEEE standard 802.16, also known as Wi-MAX, is a technology for
last-mile wireless broadband as an alternative to cable and DSL and
where the cost is high. Its intended to deliver high speed data
communication.

Fig7.WiMax

G.GiFi
Gi-Fi technology provides many features such as ease of
deployment, small form factor, enabling the future of information
management, high speed of data transfer, low power consumption
etc. With growing consumer adoption of High- Definition (HD)
television, low cost chip and other interesting features and benefits
of this new technology it can be predicted that the anticipated
worldwide market for this technology is vast

Fig.8 High speed data transmission through Gi-Fi

3. TECHNOLOGYUSEDBYGIFI
3.1CMOS
GiFi uses CMOS technology. Complementary metaloxide
semiconductor (CMOS) is a technology for constructing
integrated circuits. CMOS technology is used in
microprocessors, microcontrollers, static RAM, and other digital
logic circuits. CMOS technology is also used for several analog
circuits such as image sensors,data converters, and highly
integrated transceivers for many types of communication. Frank
Wanlass patented CMOS in 1967 (US patent 3,356,858).
CMOS is also sometimes referred to as complementarysymmetry metaloxidesemiconductor (or COS-MOS). The
words "complementary-symmetry" refer to the fact that the
typical digital design style with CMOS uses complementary and
symmetrical pairs of p-type and n-type metal oxide
semiconductor field effect transistors (MOSFETs) for logic
functions.
CMOS (complementary metal-oxide semiconductor) is the
semiconductortechnology used in the transistors that are
manufactured into most of today's computer microchips.
Semiconductors are made of silicon and germanium, materials
which "sort of" conduct electricity, but not enthusiastically.
Areas of these materials that are "doped" by adding impurities
become full-scale conductors of either extra electrons with a
negative charge (N-type transistors) or of positive charge
carriers (P-type transistors). In CMOS technology, both kinds of
transistors are used in a complementary way to form a current
gate that forms an effective means of electrical control. CMOS
transistors use almost no power when not needed. As the current
direction changes more rapidly, however, the transistors become
hot. This characteristic tends to limit the speed at which
microprocessors can operate
Two important characteristics of CMOS devices are high noise
immunity and low static power consumption. Significant power

is only drawn while the transistors in the CMOS device are

switching between on and off states. Consequently, CMOS
devices do not produce as much waste heat as other forms of
logic, for example transistor-transistor logic (TTL) or NMOS
logic, which uses all n-channel devices without p-channel
devices. CMOS also allows a high density of logic functions on
a chip. It was primarily this reason why CMOS won the race in
the eighties and became the most used technology to be
implemented in VLSI chips.
The phrase "metaloxidesemiconductor" is a reference to the
physical structure of certain field-effect transistors, having a
metal gate electrode placed on top of an oxide insulator, which
in turn is on top of a semiconductor material. Aluminum was
once used but now the material is polysilicon. Other metal gates
have made a comeback with the advent of high-k dielectric
materials in the CMOS process, as announced by IBM and Intel
for the 45 nanometer node and beyond.

2. In CMOS (Complementary Metal-Oxide Semiconductor)

technology, both N-type and P-type transistors are used to
realize logic functions. Today, CMOS technology is the
dominant semiconductor technology for microprocessors,
memories and application specific integrated circuits (ASICs).
The main advantage of CMOS over NMOS and bipolar
technology is the much smaller power dissipation. Unlike
NMOS or bipolar circuits, a CMOS circuit has almost no static

power dissipation. Power is only dissipated in case the circuit

actually switches. This allows to integrate many more CMOS
gates on an IC than in NMOS or bipolar technology, resulting in
much better performance.
The following applets demonstrate the N-type and P-type
transistors used in CMOS technology, the basic CMOS inverter,
NAND and NOR gates, and an AOI32 complex gate.Finally, it
demonstrates the CMOS transmission-gate and a transmissongate D-latch.The first applet illustrates the function of both Ntype and P-type MOS transistors.
The source and gate contacts of the transistors to toggle the
corresponding voltage levels and watch the resulting output
value on the drain contacts. The applet uses colors to display the
different voltages.
(1) A logical '1' corresponding to electrical level VCC (typical
values for current technolgies are +5Vor +3.3V) is shown in
red,
(2)A logical '0' (corresponding to 0V or GND) in blue.

(3) A floating wire (not connected to either VCC or GND) is

shown in orange.
N-type transistor is conducting when its input is '1', while the Ptype transistor is conducting when its input is '0'. The applet
displays the channel of a conducting transistor as a rectangle
filled withcolor of its source voltage. The channel of a
nonconducting transistor is shown as rectangle outline in black.
The most important CMOS gate is the CMOS inverter. It
consists of only two transistors, a pair of one N-type and one Ptype transistor. The applet demonstrates how the inverter works.
If the input voltage is '1' (VCC) the P-type transistor on top is
nonconducting, but the N-type transistor is conducting and
provides a path from GND to the output Y. The output level
therefore is '0'. On the other hand, if the input level is '0', the Ptype transistor is conducting and provides a path from VCC to
the output Y, so that the output level is '1', while the N-type

transistor is blocked. If the input is floating, both transistors may

be conducting and a short-circuit condition is possible.

3.2TransmissionofimageinGiFi
CMOS uses image sensor for transferring image and those
image sensors can have much more functionality on-chip than
CCDs. In addition to converting photons to electrons and
transferring them, the CMOS sensor might also perform image
processing, edge detection, noise reduction, and analog to digital
conversion. What's more, sensor and digital camera designers
can make the various CMOS functions programmable,
providing for a very flexible device.
This functional integration onto a single chip is CMOS' main
advantage over the CCD. It also reduces the number of external
components needed.

Fig 2. Image Sensor

Using an integrated CMOS sensor allows the digital camera to
devote less space to other chips, such as digital signal processors
(DSPs) and ADCs. In addition, because CMOS devices consume
less power than CCDs, there's less heat, so thermal noise can be
reduced.The breakthrough for CMOS sensor technology came in
the early 1990s, when Active Pixel Sensors (APS) were
successfully implemented by NASA's Jet Propulsion Laboratory
(JPL). A theoretical technology that was understood for decades

but not effectively used until 1993, APS adds a readoutamplifier

transistor to each pixel. This allows the conversion of the charge
to voltage to happen at the pixel. It also provides for random
access to the sensor's pixels, similar to the row-column memory
cell access in RAM technology.

3.3ColorcreationinGiFi
All image sensors are grayscale devices that record the intensity
of light from full black to white, with the appropriate
intervening gray. To add color to a digital camera image, a layer
of color filters is bonded to the silicon using a photolithography
process to apply color dyes.
3.3.1Photolithography:

Photolithography (or "optical lithography") is a process used in

micro fabrication to selectively remove parts of a thin film or
the bulk of asubstrate. It uses light to transfer a geometric
pattern from a photo mask to a light-sensitive chemical
"photoresist", or simply "resist," on the substrate. A series of
chemical treatments then either engraves the exposure pattern
into, or enables deposition of a newmaterial in the desired
pattern upon, the material underneath the photo resist. In
complex integrated circuits, for example a modern CMOS, a
wafer will go through the photolithographic cycle up to 50
times.
Photolithography shares some fundamental principles with
photography in that the pattern in the etching resist is created by
exposing it to light, either directly (without using a mask) or
with a projected image using an optical mask. This procedure is
comparable to a high precision version of the method used to
make printed circuit boards. Subsequent stages in the process
have more in common with etching than to lithographic printing.
It is used because it can create extremely small patterns (down
to a few tens of nanometers in size), it affords exact control over
the shape and size of the objects it creates, and because it can
create patterns over an entire surface cost-effectively. Its main
disadvantages are that it requires a flat substrate to start with, it

is not very effective at creating shapes that are not flat, and it
can require extremely clean operating conditions.
A single iteration of photolithography combines several steps in
sequence. Modern cleanrooms use automated, robotic wafer
track systems to coordinate the process. The procedures
followed are mentioned here :(i)Cleaning
If organic or inorganic contaminations are present on the wafer
surface, they are usually removed by wet chemical treatment,
e.g. the RCA clean procedure based on solutions containing
hydrogen peroxide
(ii)Preparation
The wafer is initially heated to a temperature sufficient to drive
off any moisture that may be present on the wafer surface.
Wafers that have been in storage must be chemically cleaned to
removecontamination. A liquid or gaseous "adhesion promoter",
such as Bis(trimethylsilyl)amine ("hexamethyldisilazane",
HMDS), is applied to promote adhesion of the photoresist to the
wafer.
(iii)Photoresist application
The wafer is covered with photoresist by spin coating. A
viscous, liquid solution of photoresist is dispensed onto the
wafer, and the wafer is spun rapidly to produce a uniformly
thick layer. The spin coating typically runs at 1200 to 4800 rpm
for 30 to 60 seconds, and produces a layer between 0.5 and 2.5
micrometres thick. The spin coating process results in a uniform
thin layer, usually with uniformity of within 5 to 10 nanometres.
(iv)Photoresist removal
After a photoresist is no longer needed, it must be removed from
the substrate. This usually requires a liquid "resist stripper",
which chemically alters the resist so that it no longer adheres to
the substrate.

(v)Etching
In etching, a liquid ("wet") or plasma ("dry") chemical agent
removes the uppermost layer of the substrate in the areas that
are not protected by photoresist. In semiconductor fabrication,
dry etching techniques are generally used, as they can be made
anisotropic, in order to avoid significant undercutting of the
photoresist pattern.
(vi)Lightsources
Photolithography has used ultraviolet light from gas-discharge
lamps using mercury, sometimes in combination with noble
gases such as xenon. These lamps produce light across a broad
spectrum with several strong peaks in the ultraviolet range. This
spectrum is filtered to select a single spectral line.

Fig 5. Color creation in image during transmission through GiFi

4.FEATURESOFGIFI
1. Multi-gigabit wireless technology that removes the need for
cables between consumer electronic devices.
2. More than 100 times faster than current short-raqnge wireless
technologies.
3. Allows wireless streaming of uncompressed high-definition
content.
4. Operates over a range of 10 metres without interference.
5. Entire transmission system can be built on a cost effective
single silicon chip.
6. Operates in the unlicensed, 57-64 GHz spectrum band.

5.BENEFITS
1. Removes need for cables to connect consumer electronics
devices
2. Low-cost chip allows technology to be readily incorporated
into multiple devices
3. Secure encryption technology ensures privacy and security of
content
4. Simple connection improves the consumer experience
5. Enhancements to next generation gaming technology

6.USESOFGIFI
(A) Wireless video transmission using GiFi chip
Electrical Engineerings Professor Stan Skafidas (BE Elec. Eng)
1993; MEngSc 1996; PhD 1998) hassuccessfully demonstrated
a transmission of wireless video using the world-first Gigabit
Wireless (GiFi) technology. The demonstration, attended by
Victorian Government Minister for Innovation, Gavin Jennings
earlier this year, was the first time it has been on public display.
The GiFi chip is the worlds first transceiver integrated on a
single chip operating at 60GHz on the CMOS (complementary
metaloxidesemiconductor) process, the most common
semiconductor technology. The breakthrough will lead to
wirelessly connected environments that will enjoy audio and
video transfer rates of up to 5 gigabits per second, ten times the
current maximum wireless transfer rate, at one-tenth the cost.
In the future, Gigabit wireless technology will be used to show
DVD movies on High Definition Digital TV without a wired
connection and for very fast downloads of content from devices
such as PDAs, games consoles and wireless digital cameras.

The Gigabit Wireless Project was recently selected as a finalist

in the INNOVIC 2009 Next Big Thing Award .

(B) For communication process

GiFi provides 5 Gbits per second it better be able to transmit 10
videos without buffer delays.

(C)GiFiwirelesschiptobring5Gbpersecondspeed
The University of Melbourne announced on Friday a new
technology they are calling GiFi, which promises some
serious game-changing wireless transfer speeds for all types of
consumer gadgets. The tiny silicon chip invented by professor
Stan Skafidas is able to move data through the air as fast as 5
gigabits per second at a distance of just over 30 feet.
This short-range wireless technology would potentially be a
competitor or more than likely a replacement for WiFi, and
things like Bluetooth might want to look out as well. The
transfer speeds combined with the constantly increased storage
capacities of small handheld devices could really take media
down some new avenues as well. The Age newspaper uses an
example of transferring a high- definition movie from a kiosk at
a store to your mobile phone in seconds. Then that same movie
can be transferred just as quickly from the phone to your home
computer or entertainment system to watch

(D) Provides high resolution

The higher megapixel count on our cameras, the increased
bitrate on our music files, the higher resolution of our video
files, and so on. We demand more than ever, but we also want
this content to be transfered in the most expedient manner
possible. 802.11g and 802.11n are fine and all, but some people
want to push the envelope even further.

(E) Provides short-range wireless

A new wireless technology has been developed that should serve
as an extremely fast replacement for technologies such as

Bluetooth and ultra-wideband (UWB), says Australian research

group NICTA. Nicknamed GiFi, the process would use a chip
(not pictured) that transmits at an extremely high 60GHz
frequency versus the 5GHz used for the fastest forms of Wi-Fi.
The sheer density of the signal would allow a chip to send as
much as five gigabits per second. While the spectrum would
limit the device to the same 33-foot range as Bluetooth or UWB,
it could theoretically transfer an HD movie to a cellphone in
seconds, the researchers claim.The technology could also be
used for beaming full HD video in real-time and could be used
by notebooks and other computers to wirelessly connect
virtually all the expansion needed for a docking station,
including a secondary display and storage.

(F) A Tiny GiFi Chip provides Big Wireless

Capabilities
The "GiFi" chip, which measures 0.2 of an inch on each side,
was developed at Melbourne University- based labs of the
National Information and Communications Technology research
center,The Age reported. The high transmission rate of the chip
would make it possible, for example, to transfer a highdefinition movie from a video kiosk to a mobile device in a few
seconds.
Skafidas and his team claim to be the first to demonstrate a
working transceiver-on-a-chip that uses CMOS, or
complementary metal oxide semiconductor. CMOS is a
particular style of digital circuitry design used in
microprocessors.The chip uses an antenna 0.04 of an inch wide,
less than two watts of power, and would cost about $9.20 U.S.
The device transmits over the 60-GHz spectrum, which the
researchers said is nearly unused. Wi-Fi technology, in contrast,
shares its spectrum with other devices such as cordless phones,
which can cause disruptions. In addition, GiFi is faster than the
average Wi-Fi device. However, Wi-Fi can transmit over longer

distances.
The chip is about a year away from being ready for market,
Skafidas told the newspaper. As to its uses, the researcher said
the processor could be used to transfer video and other dataintensive content between storage and display devices in the
home. It also could be used to turn a mobile device into a
"shopping cart" for digital movies and other content that could
be bought elsewhere and played in the home.The 27-member
team developing the new chip worked with companies such as
IBM in the research.

7.FUTUREASPECTS:
1. The GiFi team is looking for partners interested in
commercialising its 60GHz chips
2. Demonstrations of the technology can be arranged showing
the huge potential it has to change the way consumers use their
in-home electronic devices
3. With growing consumer adoption of highdefinition television,
the anticipated worldwide market for this technology is vast.