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Hun Nee Chen/MY/Asia/Celestica

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Sook Leong Loo/MY/Asia/Celestica@Celestica, Ang Chee
Keong/MY/Asia/Celestica@Celestica
cc
Yen Ching Tan/MY/Asia/Celestica@Celestica, Wen Chong
Yeow/MY/Asia/Celestica@Celestica, Sang Thai
Ong/MY/Asia/Celestica@Celestica, Mark Dharmendran
Vasudavan/MY/Asia/Celestica@Celestica, Suhaini
Sudin/MY/Asia/Celestica@Celestica
bcc

Subject
03HAT00055AAP - First Volume Build

Loo/ CK,

Our first volume build after NPI for 03HAT00055AAP, SMT yield is very low,
are we ready for volume?

Major issue:
Missing component and tombstone. Pls see attached file for details.

Pls review the defects in the file and I would like call a meeting to
review and discuss on what we need to do further to reduce the fallout.
Pls meet tomorrow, 21 Jul 06, at 11.00am, Avaya Corner.

Regards,
Hun Nee, Chen
Customer Quality Engineering
DID: +6-04-4093547
HP: +6-019-4126621
Email: hnchen@celestica.com

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