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  • 785 Marketing Lead Sheet

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    Rohith Chowdary
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    Researchers at Rensselaer Polytechnic Institute have developed a wafer bonding process using BCB that allows for patterning of the adhesive layer and bulk micromachining. This new process provides greater throughput with fewer processing steps compared to traditional methods. The technology has applications in front end semiconductor processes and lithography. Rensselaer has a U.S. patent pending on this bonding and patterning technique developed by researchers B. Kang, J-Q. Lu, D. Popa, T. Hwang, and E. Leonard.

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    Researchers at Rensselaer Polytechnic Institute have developed a wafer bonding process using BCB that allows for patterning of the adhesive layer and bulk micromachining. This new process provides greater throughput with fewer processing steps compared to traditional methods. The technology has applications in front end semiconductor processes and lithography. Rensselaer has a U.S. patent pending on this bonding and patterning technique developed by researchers B. Kang, J-Q. Lu, D. Popa, T. Hwang, and E. Leonard.

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    Download as PDF, TXT or read online from Scribd
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    14 views1 page

    785 Marketing Lead Sheet

    Uploaded by

    Rohith Chowdary
    Researchers at Rensselaer Polytechnic Institute have developed a wafer bonding process using BCB that allows for patterning of the adhesive layer and bulk micromachining. This new process provides greater throughput with fewer processing steps compared to traditional methods. The technology has applications in front end semiconductor processes and lithography. Rensselaer has a U.S. patent pending on this bonding and patterning technique developed by researchers B. Kang, J-Q. Lu, D. Popa, T. Hwang, and E. Leonard.

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    OFFICE OF TECHNOLOGY

    COMMERCIALIZATION

    FORMATION OF MICRO-CHANNELS BY PATTERNING OF BCB, BULK MICROMACHINES AND


    WAFER BONDING

    Technical Description

    Researchers at Rensselaer Polytechnic Institute have developed a low-κ dielectric polymer wafer bonding process
    utilizing BCB (benzocyclobutene) that is compatible with bulk micromachining. The introduction of BCB
    dry-etchable polymers makes it possible to pattern the adhesive layer in a similar fashion as the bulk
    material and have the polymer act as both the bonding interface and the mask for bulk micromachining.

    Technology Benefits

    • Greater throughput of bulk material with less processing steps required


    • Potential for use in stacking microstructures with bulk micromachining

    The application spaces for this technology within the semiconductor business are in:
    • Front End Processes
    • Lithography

    Stage of Development

    Rensselaer has U.S. patent pending on this technology.

    Inventors

    B. Kang, J-Q. Lu, D. Popa, T. Hwang, E. Leonard

    Contact Information

    Please direct all inquiries, request for further information or general discussion on licensing terms to Director, Office
    of Technology Commercialization, Rensselaer Polytechnic Institute, Troy, New York 12180, phone number 518-276-
    6023.

    Rensselaer Polytechnic Institute


    110 8th Street | Troy, NY 12180-3590 | J Building
    Phone (518) 276-6023 | Fax (518) 276-6380 | www.rpi.edu/dept/otc

    OTC 785 Page 1 04/24/2003

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