Peter Van Zant, “Microchip Fabrication”, McGraw-Hill Publishers, 1997

1. With relevant sketches explain the different stages of manufacturing.

2. Explain CZ method of crystal growth with relevant figures.
3. a) Briefly give the basic structure of Amorphous materials, Polycrystals and
Single crystals.
b) Write short notes on Crystal defects.
4. Explain the possible crystal defects and their effects after the crystal is grown.
5. With the relevant figures explain the different steps in raw wafer preparation.
6. Explain N-well process with neat diagrams.
7. Explain P-well process with neat diagrams.
8. Explain twin tub process with neat diagrams.
9. Explain SOI process with neat diagrams.
10. What are the uses of SiO2 layer?
11. Explain the thermal oxidation mechanism.
12. Explain, with a neat diagram, horizontal tube furnace system and its various sections
used in thermal oxidation method.
13. Explain the ten-step photomasking process.
14. Explain the concept of holes and islands in patterning. What are the basic photoresist
components and their roles in the process?
15. Describe the various photoresist performance factors.
16. Compare positive and negative photoresists.
17. Explain various surface preparation steps in pattering process.
18. What are the different ways of photoresist dispensing?
19. Write short notes on a) Soft bake and b) Exposure sources.
20. Write a note on: a) Spray development and b) Puddle development
21. Write notes on a) Development inspection and b) Hard bake process.
22. Explain the deposition process steps.
23. Explain the concept of diffusion. Write a note on dopant sources.
24. Explain drive-in oxidation and oxidation effects
25. Compare thermal diffusion and ion implantation. Explain annealing and channeling in ion
implantation.
26. Explain an ion implantation setup with the relevant diagrams.