IPC-M-107

Standards for Printed Board Materials Manual

VOLUME 1

IPC-T-50F
IPC-T-50F Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-L-125A Specification for Plastic Substrates Clad or Unclad for High Speed/High Frequency
IPC-L-125A
Interconnections

IPC-EG-140
IPC-EG-140 Specification for Finished Fabric Woven from “E” Glass for Printed Boards

IPC-SG-141
IPC-SG-141 Specification for Finished Fabric Woven from “S” Glass for Printed Boards

IPC-A-142
IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards

IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed
IPC-QF-143 Boards

IPC-CF-148A
IPC-CF-148A Resin Coated Metal for Printed Boards

VOLUME 2

IPC-CF-152B
IPC-CF-152B Composite Metallic Material Specification for Printed Wiring Board

IPC-4101
IPC-4101 Laminate/Prepreg Materials Standard for Printed Boards

IPC/JPCA 4104 Specification for High Density Interconnect (HDI) and Microvia Materials
IPC/JPCA-4104

IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for
IPC-4110 Printed Boards

IPC-4130
IPC-4130 Specification and Characterization Methods for Nonwoven "E" Glass Mat

IPC-4121 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board
IPC-4121 Applications (supersedes IPC-CC-110A)

IPC-4411
IPC-4411 Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

IPC-4562
IPC-4562 Metal Foil for Printed Wiring Applications