Fabrication of aspheric micro-lens array by Excimer laser micromachining

1. INTRODUCTION

Excimer laser micromachining technology is well known as a powerful tool for fabrication of aspheric micro-lens array. It utilizes pulsed lasers of short wavelength such as KrF(248nm), ArF (193 nm), XeCl (308 nm), and XeF (351 nm). The laser pulses usually have high pulse energy and short pulse duration, around a few to a few tens of nano-seconds. In addition to the laser source, a typical excimer laser micromachining system usually equipped with an optical project system, which modulates the laser beam pattern with a photo-mask and then projects the pattern onto sample surface, and a servo controlled mechanical scanning stage, which synchronizes the sample motion with the laser pulse firing[1]. These additional capabilities allow an excimer laser micromachining system to carry out fabricating aspheric micro-lens array with great flexibility and machining accuracy.

Micro-lens and micro-lens array are important elements for many applications on optical data storage, digital display, and optical communication. A number of fabrication methods had been developed to fabricate these optical elements, especially for polymeric micro-lens and micro-lens arrays. Typical methods include photo resist thermal reflow, photo thermal method, photo- polymer etching, micro jet method, laser ablation, and micro-molding or hot embossing method. Although the above mentioned methods are widely used, a common problem shared by all these methods is that the micro-lens surface profile is not accurately controllable [2].

The mechanism of the material removal is based on laser-material interaction that may induce thermal ablation or photo-ablation of the material. Photo-ablation is a cold mechanism for material removal and therefore results in better surface conditions on polymer materials. By using a excimer Laser eye surgery is a treatment to correct near sightedness, far sightedness or astigmatism. The surgery may reduce or eliminate the need for contact lenses or glasses. In a normal eye, the front of the eye (cornea), the lens of the eye and the shape of the eye focus light to form an image on the back inside surface of the eye.

Fabrication of aspheric micro-lens array by Excimer laser micromachining

2. LITERATURE REVIEW

After reading and understanding this paper demonstrates the unique and exceptional capability of excimer laser micromachining in fabricating aspheric micro lenses with precise surface profile control. A newly developed laser scanning method is introduced for machining refractive types of micro lenses, which have pre-designed surface profiles aiming at minimizing the optical focal spot sizes. The machining accuracy and machined surface roughness are examined experimentally, and very good results are obtained.

A new 3D micromachining method, called Hole Area Modulation (HAM), has been introduced to enhance the current micromachining technology. In this method, information on the machining depth is converted to the sizes of holes on the mask. The machining is carried out with a simple 2D movement of the work piece or the mask. This method can be applied for machining various kinds of micro cavities in various materials. By mathematical model for excimer laser micromachining based on HAM and determination of the optimal laser ablation conditions (Hole diameter, step size, mask movement velocity, etc.) are described. The simulation and experiment of the HAM-based laser ablations were carried out successfully to create micro lens.

This method has great importance in laser eye surgery. By using laser short pulses of invisible ultraviolet light remove a small amount of tissue from the Cornea to correct the curvature. The amount removed is typically less than the thickness of a human hair. By correcting the curvature of the cornea, images are better focused on the retina and the images are clearer.

Fabrication of aspheric micro-lens array by Excimer laser micromachining

3. TECHNOLOGICAL ASPECTS OF LASER MICROMACHINING

3.1 DEFINITION
An excimer laser (sometimes more correctly called an exciplex laser) is a form of ultraviolet laser which is commonly used in the production of microelectronic devices (semiconductor integrated circuits or chips), eye surgery, and micromachining.

Fig.1 High intensity laser beam

3.2 CONSTRUCTION
An excimer laser typically uses a combination of a noble gas (argon, krypton, or xenon) and a reactive gas (fluorine or chlorine). Under the appropriate conditions of electrical stimulation and high pressure, a pseudo-molecule called an excimer (or in the case of noble gas halides, exciplex) is created, which can only exist in an energized state and can give rise to laser light in the ultra violet range.

Fabrication of aspheric micro-lens array by Excimer laser micromachining

3.3 OPERATION

Fig2 Operation of excimer laser micromachining Laser action in an excimer molecule occurs because it has a bound (associative) excited state, but a repulsive (dissociative) ground state. This is because noble gases such as xenon and krypton are highly inert and do not usually form chemical compounds. However, when in an excited state (induced by an electrical discharge or high-energy electron beams, which produce high energy pulses), they can form temporarily bound molecules with themselves (dimers) or with halogens (complexes) such as fluorine and chlorine. The excited compound can give up its excess energy by undergoing spontaneous or stimulated emission, resulting in a strongly repulsive ground state molecule which very quickly (on the order of a picosecond) dissociates back into two unbound atoms. This forms a population inversion.

4. COMPONENTS OF TYPICAL INDUSTRIAL LASER MACHINING SYSTEM

Although laser machining systems can differ in their layout and their application, they generally share a typical component set. Laser machining system components include:

Fabrication of aspheric micro-lens array by Excimer laser micromachining

4.1 Process site

This is the enclosed area in which the material is processed.

4.2 Laser light source

The laser light source (laser head) provides photon energy with which to process materials. Selecting the appropriate laser type for your application is essential to achieving the desired results. Different types of lasers have distinct applications.

4.3 Beam delivery system

The beam delivery system (BDS) directs the laser energy to the material under process. The BDS determines laser power density on target and the size and shape of the laser beam on the target.

4.4 Part handling and motion control system

The part handling system is typically an X,Y table that positions parts beneath the laser beam. Z-axis motion is used to focus the beam at the delivery site. Rotary stages provide lathe-style operations. You can incorporate part loading systems with a part handling system to integrate robotics or conveyors. The motion control system controls the part handling system. The motion control system is sometimes used for articulated beam positioning relative to the process material.

4.5 Control electronics

The control electronics include a system CPU, the motion control electronics and the laser operator controls. The electronics control the hardware and software that allow you to automate many system functions, providing laser beam delivery and part handling system integration.

4.6 Laser support equipment

Laser support equipment includes:

Fabrication of aspheric micro-lens array by Excimer laser micromachining

The electrical distribution system supply; a multi-kilowatt supply required for high-powered lasers.

Cooling systems. Gas delivery systems to provide laser gas (in certain lasers) and purge gases to the process site.

4.7 Structure and enclosure

The laser machining system structure must mechanically integrate all of the system components. It must be designed for rigidity and thermal stability to ensure stable beam pointing. Systems range from tabletop size to footprints of many square meters. Safety enclosures and interlock systems prevent operator exposure to laser radiation.

5. COMPARING WITH DIFFERENT TYPES OF LASER

Consider the following two examples of excimer laser machining compared to CO2 and Nd:YAG. As you can see, there is a marked difference in the resolution of the cuts. The following comparison shows 300m-diameter holes drilled in 75m thick polyimide.

CO2

Excimer

Nd:YAG (IR)

CO2
Fig.3comparining different types of laser

Excimer

Fabrication of aspheric micro-lens array by Excimer laser micromachining

In both examples it is clear that the excimer laser is better suited to high-precision micromachining. CO2 and Nd:YAG lasers produce round spots suited to drilling, welding and profile cutting. While the high average power and lower feature resolution make CO2 and Nd:YAG laser systems well-suited to heavy industrial applications, excimer lasers are often the only efficient, practical and cost-effective manufacturing method available for highprecision micromachining applications. While CO2 and Nd:YAG lasers generate thermal effects that can affect surrounding materials, excimer laser beams do not generate heat. Instead, they turn materials directly into gas by breaking chemical bonds, a process called photo-chemical ablation, that provides cleaner, more precise cuts.

6. IMPORTANT PARAMETERS
6.1 ABSOLUTE ENERGY
Absolute Energy is the total energy in a laser pulse or system, unit is Joule (J), a typical value for a single laser pulse is 100 mJ.

6.2 LASER POWER

The power of a laser is the output optical power of the laser, we need to know the normal working power and its maximum allowable power. Lasers operate in either continuous wave state or pulsed state. Both operation states have lots of applications. For pulsed laser, an important parameter is the peak power. In general, CO2 lasers have relatively high continuous wave power, while Nd: YAG lasers can provide relatively high peak power for pulsed operation. Output power is closely related with processing time and operation expense. If the selected laser power is lower, the processing time will be increased, if the selected laser has too high power than necessary, the operation expense will be higher than necessary. So the proper choosing of laser power is very important.

6.3 INTENSITY
Energy Intensity is the area average of laser power, unit is W/cm2 in laser processing. When the interaction between energy field and target is not continuous, we know that energy intensity is usually the deciding factor. Intensity is closely related with laser focus spot size and pulse lasting time.
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Fabrication of aspheric micro-lens array by Excimer laser micromachining

6.4 WAVELENGTH
The Wavelength of a laser is decided by the related stimulated energy transition. Laser light is very pure, this means their wavelength vary in very small ranges when compared with normal light. Different wavelengths may have different effects when interacting with matters. The Shorter the wavelength, the higher the energy of the photon. Laser can also be divided into infrared, visible, ultraviolet lasers according to their output light wavelength. Wavelength also affects the maximum resolution and focalization, the shorter the wavelength, the higher the resolution, the better the focal property.

7. CONFIGURATIONS OF UV EXCIMER LASER

While excimer lasers are available in a variety of packages, all commercial excimer lasers employ the modules shown here. Laser light is generated in the laser cabinet. The electrical energy required by the laser to form laser pulses is generated by the high voltage supply. A gas supply and a vacuum pump are required to fill the laser with the appropriate laser gas mixture. The control computer is usually linked to the laser cabinet and high-voltage supply by a fiber optic network. The computer provides laser function user control.

Fig.4 Typical excimer laser configuration

7.1 UV EXCIMER LASER GASES

Excimer comes from the term excited dimer, which refers to a diatomic molecule, usually of an inert gas atom and a halide atom, which are bound in excited states only. The gases that JPSA excimer laser systems use include helium, neon, krypton and

Fabrication of aspheric micro-lens array by Excimer laser micromachining

fluorine (for 157nm, 193nm an 248nm systems) and xenon (for 308nm and 351nm systems). These gases must be ultra high-purity grade (UHP). A reactive gas, such as fluorine, is mixed with inert gases such as helium or krypton. When electrically stimulated, a dimer molecule is produced that, when lased, produces light in the ultraviolet range.

7.2 UV EXCIMER LASER DISCHARGE

In an excimer laser, the laser medium is excited by means of a high-speed transverse electrical discharge. DC high voltage is supplied to a pulse-forming network that consists of a high-performance thyratron switch, a magnetic pulse compression system and banks of storage capacitors. These components generate a high-speed current pulse across the electrodes. As the current pulse traverses the electrode gap, the lasant gases are ionized and form the excimer molecule. The following graphic depicts the laser discharge process.

Fig.5 discharge of laser Due to the excimer constituent relaxation times, thermal effects influence discharge and particulate formation. Laser discharge can only occur at repetition rates of less than 1Hz unless the gas between the electrodes is constantly replaced with fresh gas. The gas reservoir function is to provide a large volume of lasing gas so that gas refreshment can occur. A high-speed blower fan recirculates the laser gas at speeds of 1 to 5 meters per second so that the volume of the gap is completely refreshed between pulses at repetition rates of up to 400Hz. After discharge, the spent gas mixture flows across heat exchangers, which remove the heat that was generated during the pulse. Most lasers employ some form of particle filtration to clean the gas mixture prior to its passing again across the
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Fabrication of aspheric micro-lens array by Excimer laser micromachining

electrodes. As the gas flows around in the recirculation loop, excited gas molecules return to normal sizes.

7.3 EXTENDING LASER GAS LIFE

The following methods can help to extend the life of excimer laser gases: Choose the appropriate laser for the job Find the right combination of power and rep rate. Lasers that operate at lower pulse energy and higher rep rate deliver longer gas lifetimes than high pulse energy lasers operating at the same average power. Operating the laser at less than the maximum rated output can decrease gas consumption. Select a laser with superior laser head interior components

Laser head construction:

Material compatibility with corrosive gas mixtures, such as mechanical assemblies and o-rings.

Material compatibility with high voltage environment, e.g. ceramics. Effective particle filtering of laser gas. Effective window flushing system to retard optics contamination. High quality optics selection and manufacture.

Alternate pre ionization schemes:

UV spark ionization is most common. Corona pre ionization. Microwave pre ionization; developmental.

Gas processing

Extends gas lifetime by removing impurities from gas. Effective with ArF, KrF, XeCl, and KrCl mixtures. Ineffective with XeF mixture.

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Fabrication of aspheric micro-lens array by Excimer laser micromachining

8. PHOTO ABLATION PROCESS

When matter is exposed to focus excimer light pulses, the pulse energy is absorbed in a thin layer of materials, typically less than 0.1m thick, due to the short wavelength of deep UV light. The high peak power of an excimer light pulse, when absorbed into this tiny volume, results in strong electronic bond breaking in the material. The resultant molecular fragments expand in a plasma plume that carries any thermal energy away from the work piece. As a result, there is little or no damage to the material surrounding the produced feature.

Fig.6 The photo ablation process

9. FABRICATION OF MICROLENSES

Fig.7 fabricated micro lenses [2]

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Fabrication of aspheric micro-lens array by Excimer laser micromachining

In this section, the fabricated micro lenses will be characterized in terms of machined surface profile accuracy, surface roughness, and focusing capability. First of all, the surface profiles of the fabricated micro lenses are measured by a non-contact 3D confocal surface measurement system (Nano Focus mSurf C, Nano Focus AG, Oberhausen, Germany).

Fig.8 Shows measured 3D profile of lens[3] Very good surface profile accuracy is achieved in the central region of a radius approximately 75 mm. To closely examine the profile accuracy, the deviations between the machined surface profiles and the designed ones are displayed in Fig. It is observed that the profile accuracy is much compensate this error by fine-tuning the mask probability function and the photo-mask window-opening pattern. For optical components, surface roughness is of great importance and hence needs to be characterized. The surface roughness of the six machined micro lenses is characterized with an Atomic Force Microscope (AFM) system. Finally, the focusing capability of the fabricated micro lenses is tested experimentally.

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Fabrication of aspheric micro-lens array by Excimer laser micromachining

Fig.9 experimental setup [3]

The experimental setup is shown in Fig. above, in which a 20mW HeNe laser (1101, JDS Uniphase Co., San Jose, CA) of wavelength 632.8nm is used as the light source. After adjusting its intensity by the polarizer, the laser beam is passed through a spatial filter to eliminate higher-order components. An iris allows a laser beam of diameter 200 mm and uniform intensity distribution to passes through the micro lens under evaluation. A CCD camera with a 100 x objective lens . For example, within the range of a radius of 75 mm the maximum profile error is mostly within 71 mm. On the other hand, in the areas close to the lens aperture edge, greater surface profile deviation is observed. The reason could be that for increasing machined depth, the machining surface is moving far away from the focal plane of the projection lens system, and hence the machining rate is down. This explains why the final machined depth is always less than what is room of improvement in approaching the diffraction limits if the surface profile accuracy can be further improved over the whole lens aperture.

10. APPLICATIONS OF EXCIMER LASER MACHINE

10.1 LASER EYE (OR EXCIMER LASER) SURGERY
Laser eye (excimer laser) surgery is a treatment to correct near sightedness, far sightedness or astigmatism. The surgery may reduce or eliminate the need for contact lenses or glasses. In a normal eye, the front of the eye (cornea), the lens of the eye and the shape of the eye focus light to form an image on the back inside surface of the eye (retina).

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Fabrication of aspheric micro-lens array by Excimer laser micromachining

Fig.10 concept of eye surgery

Using excimer laser short pulses of invisible ultraviolet light remove a small amount of tissue from the cornea to correct the curvature. The amount removed is typically less than the thickness of a human hair. By correcting the curvature of the cornea, images are better focused on the retina and the images are clear.

10.2 BIOLOGICAL MATTER AND ORGANIC COMPOUNDS

The ultraviolet light from an excimer laser is well absorbed by biological matter and organic compounds. Rather than burning or cutting material, the excimer laser adds enough energy to disrupt the molecular bonds of the surface tissue, which effectively disintegrates into the air in a tightly controlled manner through ablation rather than burning. Thus excimer lasers have the useful property that they can remove exceptionally fine layers of surface material with almost no heating or change to the remainder of the material which is left intact. These properties make excimer lasers well suited to precision micromachining organic material (including certain polymers and plastics).

10.3 MANUFATURING OF MICRO ELECTRONIC CHIP

Excimer lasers are widely used in high-resolution photolithography machines, one of the critical technologies required for manufacturing of microelectronic chip. Current

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Fabrication of aspheric micro-lens array by Excimer laser micromachining

state-of-the-art lithography tools use deep ultraviolet (DUV) light from the KrF and ArF excimer lasers with wavelengths of 248 and 193 nano meters (the dominant lithography technology today is thus also called excimer laser lithography, which has enabled transistor feature sizes to shrink below 45 nano meters. Excimer laser lithography has thus played a critical role in the continued advance of the so-called Moores law for the last 20 years. The most widespread industrial application of excimer lasers has been in deep-ultraviolet photolithography, a critical technology used in the manufacturing of microelectronic devices.

10.4 MARKING

Fig.11 marking on ceramic chip Marking has been a standard application for both the CO2 and excimer lasers for more than 30 years. The CO2 laser's powerful beam can instantly mark a wide variety of non-metals. The UV energy from the excimer laser can produce dramatic colour changes in plastics and ceramic materials. These marks are permanent and can be used for simple identification or traceability or anti-conterfeit.

Fig.12 marking on nail polish cap The foil on this nail polish bottle cap has been removed to reveal the base plastic. The Laser Mark laser provides very sharp clear lettering required for this type of cosmetics application.

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Fabrication of aspheric micro-lens array by Excimer laser micromachining

10.5 DRILLING

Fig.13 drill holes on 75 micron thick plastic The drilling of small holes is one of the most common applications of the excimer lasers. Lasers can be focussed to very small spots, the very small holes in ink jet nozzles or the micro-vias in smart phone printed circuit boards. The clean walls created in the this fast 'cold' process have no melting or charring.

11. ADVANTAGES
In this work present a modified machining method based on the previous planetary scanning machining method and the goal is to remove the undesired outside skirt machining problem and therefore to achieve micro-lens array fabrication. Basically, we add one shading mask and one translation mechanism so that we can partially block the laser beam from undesired laser machining and in the mean time acquire array type of micro-lens fabrication. Excimer lasers bring the following advantages to micromachining applications:

11.1 Unique Properties of Excimer Laser Radiation

Short wavelength: 193nm to 351nm. High optical resolution: less than 1m. Shallow absorption depth: 0.1 to 0.5m. Small interaction volume. Energy highly absorbed by materials. Large area multi-mode beam. Uniform power density over relatively large area. High peak power: approximately 107 watts. Sufficient power to ablate materials at low beam demagnifications.

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Fabrication of aspheric micro-lens array by Excimer laser micromachining

11.2 Resulting Benefits in Materials Processing

High peak power and small interaction volume results in high-energy material ablation with little heat transfer to surrounding material.

Shallow absorption depth allows tight control of feature depth by controlling number of pulses to which the material is exposed.

Short optical wavelength provides high resolution generation (approximately 1m features in process materials).

Large beam size and high peak power allow simultaneous large area

12. DISADVANTAGES
One drawback of the planetary contour scanning method is that beside the machined micro-lens which one needs, the outside skirt region was also machined by the laser. This problem is particularly important in the laser machining of micro-lens array because it will limit the filling ratio of lenses. Like other technologies, excimer lasers are not without their disadvantages.

12.1 Discharge Circuit

High performance discharge circuit is required to generate laser light. High speed switches and pulse compression electronics are required. High performance electronics require frequent maintenance.

12.2 Toxic Laser Gas

Laser gas mixture is toxic and corrosive. Reactivity of lasant mixtures result in impurities formation during laser operation. The laser must be refilled with fresh gas regularly. A computer control system is required to maintain stable laser light output.

12.3 Managing high-power UV

High power ultraviolet beams are difficult to handle optically. Advanced optical materials are required to efficiently transmit the beam. Optic transmissivity degrades over long-term exposure to high-power UV beams.

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Fabrication of aspheric micro-lens array by Excimer laser micromachining

13. FUTURE TECHNOLOGY

In future the thermal side effects of carbon dioxide and neodymium: yttrium aluminium-garnet lasers limit their clinical applications. These high-powered, infrared lasers result in zones of charring and carbonization even in soft tissues and the bone. In contrast, the pulsed, ultraviolet radiation emitted by excimer lasers causes limited thermal, denaturative damage to surrounding tissues. Therefore, treatment of dental tissues with the non thermal process of photo ablation with excimer lasers may present alternatives to traditional dental practice. Possible future applications of the excimer laser include selective caries removal, the conditioning of tooth surfaces, and cleaning of root surfaces; the zones of necrosis are small, so that there is no residual debris.

In future work, the proposed laser machining method can be in conjunction with several low-cost micro-manufacturing methods including micro- electroforming and micro-injection molding. Such a LIGA-like micro-fabrication process is completed and the laser fabricated micro-lens array can be replicated in a fast and inexpensive way

In future the new Wave front technology can measure and correct the unique imperfections of each individuals vision and most often this provides them with the potential to experience better vision than is possible with glasses or contact lenses. This technology was originally developed for use in high powered telescopes to reduce distortions when viewing distant objects in space. Now, surgeons can identify, measure and correct imperfections in an individuals eyes 25 times more precisely t han with conventional methods used for glasses and contact lenses.

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Fabrication of aspheric micro-lens array by Excimer laser micromachining

14. CONCLUSIONS

In this paper , I demonstrate the fabrication of an array of aspheric micro-lens based on an improved excimer laser machining method. According to this newly developed planetary scanning method it can fabricate circular symmetrical 3D microstructures with an arbitrary profile based on the sample rotation and revolution approaches. The planetary contour scanning method combined the metal mask screen and an xy movable stage solve the problem of outskirt laser machining and allow complete micro-lens array fabrication.

A 4x4 aspheric micro-lens array with a high-quality controllable surface profile had been experimentally demonstrated. This method brings a new chance to expand more future optical applications in using the planetary contour scanning method. The method proposed in this work is far superior to other currently existing micro machining or micro fabricating methods in terms of profile flexibility, versatility, and profile accuracy.

In future work, the proposed laser machining method can be in conjunction with several low-cost micro-manufacturing methods including micro- electro forming and micro-injection molding .Such as LIGA-like micro-fabrication process is completed and the laser fabricated micro-lens array can be replicated in a fast and in expensive way.

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Fabrication of aspheric micro-lens array by Excimer laser micromachining

REFERENCES

1. Chi-Cheng Chiu, Fabricating of aspheric micro-lens array by excimer laser micro machining
,optics and Lasers in Engineering 49 (2011) 12321237. 2. Yung-Chun Lee, Excimer laser micromachining of aspheric micro lenses with precise surface profile control and optimal focusing capability ,Optics and Lasers in Engineering 45 (2007) 116125.

3. Kyung Hyun Choi , Johan Meijer, Excimer laser micromachining for 3D microstructure, Journal of Materials Processing Technology 149 (2004) 561566. 4. Chun-Ming Chena, A new excimer laser micromachining method for axially symmetric 3D microstructures with continuous surface profiles, Sensors and Actuators A 117 (2005) 349355. 5. Jean-Philippe Desbiens,ArF excimer laser micromachining of Pyrex, SiC and PZT for rapid prototyping of MEMS components, Sensors and Actuators A 136 (2007) 554563.

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