1

Chapter 1

INTRODUCTION
.1 HISTORY
Refrigeration is a process in which work is done to move heat from one location
to another. The work of heat transport is traditionally driven by mechanical work,
but can also be driven by heat, magnetism, electricity, laser, or other means.
Refrigeration

has

many

applications,

including,

but

not

limited

to:

household refrigerators, industrial freezers, cryogenics, and air conditioning. Heat

pumps may use the heat output of the refrigeration process, and also may be
designed to be reversible, but are otherwise similar to refrigeration units.
The first important discovery relating to thermoelectricity occurred in 1823 when
a German scientist, Thomas Seebeck, found that an electric current would flow
continuously in a closed circuit made up of two dissimilar metals provided that the
junctions of the metals were maintained at two different temperatures. Some 12
years later French watchmaker, Jean Charles Athanase Peltier, discovered
thermoelectric cooling effect, also known as Peltier cooling effect, Peltier
discovered that the passage of a current through a junction formed by two
dissimilar conductors caused a temperature change. The true nature of Peltier
effect was made clear by Emil Lenz in 1838, Lenz demonstrated that water could
be frozen when placed on a bismuth antimony junction by passage pf an electric
current through the junction.
He also observed that if the current was reversed the ice could be melted. In 1909
and 1911 Altenkirch give the basic theory of thermoelectric. His work explained
those thermoelectric cooling materials needed to have high Seebeck coefficients,
good electrical conductivity to minimize Joule heating, and low thermal
conductivity to reduce heat transfer from junctions to junctions. In 1949 Loffe
developed theory of semiconductors thermo elements and in 1945 Goldsmid and
Douglas demonstrated that cooling from ordinary ambient temperatures down to
below 0C was possible Rowe [1]. Shortly after the development of practical
semiconductors in 1950s, Bismuth Telluride began to be the primary material
used in the thermoelectric cooling.

Thermoelectric cooling works on the principle of Peltier effect, when a direct

current is passed two electrically dissimilar materials heat is absorbed or liberated
at the junction. The direction of the heat flow depends on the direction of applied
electric current and relative Seebeck coefficient of the two materials. A Peltier
module or thermoelectric module (Fig.1.) is a solid-state active heat pump which
consists a number of p- and n- type semiconductor couples connected electrically
in series and thermally in parallel are sandwiched between two thermally
conductive and electrically insulated substrate.
Conventional cooling systems such as those used in refrigerators utilize a
compressor and a working fluid to transfer heat. Thermal energy is absorbed and
released as the working Fluid undergoes expansion and compression and changes
phase from liquid to vapor and back respectively. Semiconductor thermoelectric
coolers (also known as Peltier coolers) offer several advantages over conventional
systems. They are entirely solid-state devices, with no moving parts; this makes
them

rugged,

reliable,

and

quiet.

They

use

no

ozone

depleting

chlorofluorocarbons, potentially offering a more environmentally responsible

alternative to conventional refrigeration. They can be extremely compact, much
more so than compressor-based systems. Precise temperature control (< 0.1 C)
can be achieved with Peltier coolers. However, their achieved with Peltier coolers.
However, their efficiency is low compared to conventional refrigerators. Thus,
they are used in niche applications where their unique advantages outweigh their
low efficiency. Although some large-scale applications have been considered (on
submarines and surface vessels), Peltier coolers are generally used in applications
where small size is needed and the cooling demands are not too great, such as for
cooling electronic components.
The thermoelectric cooling systems having advantages of lightweight, reliable,
noiseless, portable and uses electrons rather than refrigerant as a heat carrier, and
is feasible for outdoor purpose in cooperation with solar PV cells. Thermoelectric
coolers will either heat or cool depending upon the polarity of the applied DC
power. This feature eliminates the necessity of providing separate heating and
cooling functions for a given enclosed space. Xi et al. [4] presented in their study
that thermoelectric refrigeration emerges as alternative green refrigeration
technology due to no moving parts, reliable. Potable and compatible with Solar
PV cell generated DC power, making them complete environment friendly.

Fig. 1.1 Seebeck Effect

Fig.1.2 Peltier Effect

When a Current (I) is made to flow through the circuit, heat is evolved at the
T
T
upper junction ( 2 ) and absorbed at the lower junction ( 1 ). The Peltier
heat absorbed by the lower junction per unit time is equal to
= AB I

AB

Where

is the Peltier coefficient.

.2 APPLICATIONS
Electronic
Medical
Aerospace
Telecommunications
Commercial
Military
Submarines
.3 ADVANTAGES
Eco-friendly
Compact Size
Light Weight
Lower Price
Less Consumption of Energy
-

.4 BLOCK DIAGRAM AND DESCRIPTION

Fig. 1.3 Principle of Peltier Effect

Fig. 1.4 Block Diagram of Thermoelectric Refrigeration System

Two unique semi-conductors, one n-type and one p-type, are used because they
need to have different electron densities. The semi-conductors are placed
thermally in parallel to each other and electrically in series and then joined with a
thermally conducting plate on each side. When a voltage is applied to the free
ends of the two semiconductors there is a flow of DC current across the junction
of the semi-conductors causing a temperature difference. The side with the
cooling plate absorbs heat which is then moved to the other side end of the device
where the heat sink is. TECs are typically connected side by side and sandwiched
between two ceramic plates. The cooling ability of the total unit is then
proportional to the number of TECs in it.
Thermoelectric refrigeration replaces the three main working parts with: a cold
junction, a heat sink and a DC power source. The refrigerant in both liquid and
vapor form is replaced by two dissimilar conductors. The cold junction
(evaporator surface) becomes cold through absorption of energy by the electrons
as they pass from one semiconductor to another, instead energy absorption by the
refrigerant as it changes from liquid to vapor. The compressor is replaced by a DC
power source which pumps the electrons from one semiconductor to another. A

heat sink replaces the conventional condenser fins, discharging the accumulated
heat energy from the system. The difference between two refrigeration methods,
then, is that a thermoelectric cooling system refrigerates without use of
mechanical devices, except perhaps in the auxiliary sense, and without refrigerant.

.5 THERMOELECTRIC MODULE PERFORMANCES

This section provides a basic understanding of the performance of a
thermoelectric module. Thermoelectric heat pumping (Peltier effect) at the cold
end of a thermal couple, as shown in Figure 1, is given by
Qsb

Tc

(1)

The term is the average Seebeck coefficient of the thermoelectric material. It is

seen from this relation that heat is pumped when current flows through the couple.
However, the heat pumped may include other unwanted heat sources. These heat
sources are described in the following sections.
Joule heat: Current flow generates resistive or Joule heating (QJ) in the
thermoelectric material. It can be shown that 50 per cent of the Joule heat goes to
the cold end and 50 per cent goes to the hot end. The Joule heating is given by
Qj

(2)

Where, R is the resistivity of the couple.

Conducted heat: During operation, heat is conducted from the hot end to the
cold end through the thermoelectric material. The rate of heat conduction is given
by
Qcd

K(Th - Tc)

KT

(3)

Where, K is the thermal conductivity of thermocouple.

Equation (3) shows that Qcd increases with the temperature difference across the
couple.

Combining Equations (1), (2), and (3) into an energy balance at the end of the
thermoelectric couple gives the following:
Qc = Qsb 0.5Qj Qcd = Tc - 0.5R KT

(4)

Equation (4) is the standard equation of thermal module performance. This

equation shows that a thermoelectric module no longer operates (Qc=0) when the
sum of one half the Joule heat (0.5QJ) and the conducted heat (Qcd) equals the
Peltier heat (Qsb).
The electrical energy consumption of the couple is given by
Qe

R + T

(5)

Equation (5) shows that the electrical power consumption of a thermoelectric

couple is used to generate the Joule heat and overcome the Seebeck effect, which
generates power due to the temperature difference between the two junctions of
the couple.
The COP of the thermoelectric module for cooling is given by

=
=

Qc / Qe
ITck T 0.5 I R
I R +IT

(6)
It is seen that the COP is a function of the material dimension property of
thermocouple, the temperature of the hot side and cold side Th, Tc and the current
input. There exists an optimum current for maximum COP, if Th, Tc, and
thermoelectric material are fixed.
Solving the equation /I = 0, the optimum current for the maximum (optimum)
COP can be given by
I opt

T
R
( 1+ ZTm )1

(7)

(7)
Replacing I in Equation (6) by Iopt, the optimum COP can be given by

opt

Th
)
Tc
(ThTc)( 1+ZTm +1)
Tc( 1+ZTm

(8)

Where
Tm = (Th+Tc)

(9)

Z = / kR

(10)

It is seen that the optimum COP under the optimum current is a function of Th, Tc
and the figure of merit of thermoelectric material.

.6 HEAT TRANSFER MODE

The typical heat exchanger thermal resistance for a 45 45 mm square

thermoelectric module is:
1
1) Natural convection: 0.853-13.075mK k W
, depending on the fin

density and the ratio of the heat exchanger base plate area to the
thermoelectric module area. Higher ratios of the heat exchanger base plate
area to the thermoelectric module area result in a lower thermal
resistance;
1
2) Forced air convection: 0.531-5.759mK k W

, depending on the air

flow rate. Larger air flow rate result in a lower thermal resistance;
The data provided by Melcor shows the typical allowances of temperature
difference between the hot side and ambient, with respect to the heat exchange
mode. That is:
1) Natural convection: 20-40C;
2) Forced air convection: 10-15C

Chapter 2

COMPONENTS

.1 THERMOELECTRIC REFRIGERATION SYSTEM

The thermoelectric refrigerator consists of the following components:

i.

The thermoelectric module:

The thermoelectric module consists of pairs of P- type and N- type semiconductor thermo element electrically in series and thermally in parallel.
The modules are considered to be highly reliable components due to their
solid state construction. For most application they will provide long,
trouble free service. In cooling application, an electrical current is supplied
to the module, heat is pumped from one side to the other, and result is that
one side of the module becomes cold and the other side hot [6].

Fig.2.1 Peltier Module

Fig.2.2 constructional detail of Peltier Module

The properties of a 31 couple, 9A Bismuth Telluride module [8] are:

Seebeck coefficient ( m ) = 0.01229 V/k

Module thermal conductance (
Module resistance (

Rm

Km

) = 0.344

) = 0.1815 W/k

10

ii.

Heat sink:
The heat sink usually made of aluminum, is in contact with the hot side of
a thermoelectric module. When the positive and negative module leads are
connected to the respective positive and negative terminals of a Direct
Current (D. C.) power source, heat will be rejected by the modules hot
side, the heat sink expedites the removal of heat. Heat sink typically is
intermediates stages in the heat removal process whereby heat flows into a
heat sink and then is transferred to an external medium. Common heat
sinks include free convection, forced convection and fluid cooled,
depending on the size of the refrigerator.

Fig.2.3 CPU heat sink with fan attached

iii.

Cold slide:
The cold side also made of aluminum is in contact with the cold side of a
thermoelectric module, when the positive and negative module leads are
connected to the respective positive and negative terminals of a direct
current (D. C.) power source, heat will be absorbed by the modules cold
side. The hot side of a thermoelectric module is normally placed in contact
with the object being cold.

iv.

Power source:
Thermoelectric module is a Direct Current (D.C.) device. Specified
thermoelectric module performance is valid if a Direct Current (D. C.)
Power supply is used. Actual D. C. power supply has a rippled output. This
D. C. component is detrimental [7]. Degradation of thermoelectric module
performance due to the ripple can be approximately by [7]:

11

T Max
T Max

v.

1
N
1+
2

Thermoelectric coolers:
The thermo-electric module (40x40 mm) allows the temperature below
63C at 25 W of dissipated power and the outer temperature of 25C. It
provides the lowest temperature than alternative fans and radiators. For
normal work of this cooler it's necessary to provide 5 V and 1.5A
(maximum).The fan for this cooler require 12V and 0,1A (maximum). The
fan parameters: ball-bearing, 47,5mm, 65000 hours, 26 decibel. The whole
size of the cooler is 25x25x28,7mm.

Fig.2.4 Cooling fan

vi.

Transformer:
Two coils are wound over a Core such that they are magnetically
coupled. The two coils are known as the primary and secondary
windings.
In a Transformer, an iron core is used. The coupling between the coils
is source of making a path for the magnetic flux to link both the coils.
A core as in fig.2 is used and the coils are wound on the limbs of the
core. Because of high permeability of iron, the flux path for the flux is

12

only in the iron and hence the flux links both windings. Hence there is
very little leakage flux. This term leakage flux denotes the part of the
flux, which does not link both the coils, i.e., when coupling is not
perfect. In the high frequency transformers, ferrite core is used. The
transformers may be step-up, step-down, frequency matching, sound
output, amplifier driver etc. The basic principles of all the transformers
are same.

Fig.2.5 schematic diagram of transformer

Fig.2.6 single phase transformer

vii.

Digital temperature control device:

It displays the temperature on four 7-segment displays in the range of
-55C to +125C. At the heart of the circuit is the microcontroller AT

13

89S8252, which controls all its functions IC DS1821 is used as

temperature sensor.

Fig.2.7 digital temperature control device

viii.

Capacitor:
It is an electronic component whose function is to accumulate charges and
then release it.
To understand the concept of capacitance, consider a pair of metal plates
which all are placed near to each other without touching. If a battery is
connected to these plates the positive pole to one and the negative pole to the
other, electrons from the battery will be attracted from the plate connected to
the positive terminal of the battery. If the battery is then disconnected, one
plate will be left with an excess of electrons, the other with a shortage, and a
potential or voltage difference will exists between them. These plates will be
acting as capacitors. Capacitors are of two types: - (1) fixed type like
ceramic, polyester, electrolytic capacitors-these names refer to the material
they are made of aluminium foil. (2) Variable type like gang condenser in
radio or trimmer. In fixed type capacitors, it has two leads and its value is
written over its body and variable type has three leads. Unit of measurement

14

of a capacitor is farad denoted by the symbol F. It is a very big unit of

capacitance.

Small

unit

capacitor

are

pico-farad

denoted

by pf

(Ipf=1/1000,000,000,000 f) Above all, in case of electrolytic capacitors, it's

two terminal are marked as (-) and (+) so check it while using capacitors in
the circuit in right direction. Mistake can destroy the capacitor or entire
circuit in operational.

Fig.2.8 capacitor

.2 DEVELOPMENT IN THERMOELECTRIC COOLING SYSTEM

Min et al. [6] developed a number of prototype thermoelectric domesticrefrigerators with different heat exchanger combination and evaluated their
cooling performances in terms of the COP, heat pumping capacity, cooling down
rate and temperature stability. The COP of a thermoelectric refrigerator is found to

15

be 0.3-0.5 for a typical operating temperature of 5oC with ambient at 25oC. The
potential improvement in the cooling performance of a thermoelectric refrigerator
is also investigated employing a realistic model, with experimental data obtained
from this work. The results show that an increase in its COP is possible through
improvements in module contact resistances, thermal interfaces and the
effectiveness of heat exchangers.
Adeyanju et al. [10] carried out a theoretical and experimental analysis of a
thermoelectric beverage chiller. Comparison were also made between the
hermoelectric beverage chillers cooling time with cooling times obtained from
the freezer space and cold space of a household refrigerator. The result shows that
for the refrigerator freezer space, the temperature of the water decreased linearly
with increasing time and for thermoelectric beverage chiller the temperature of the
water decreased exponentially with increasing time.
Lertsatitthanakorn et al. [11] evaluated the cooling performance and thermal
comfort of a thermoelectric ceiling cooling panel (TE-CCP) system composed of
36 TEM. The cold side of the TEM was fixed to an aluminum ceiling panel to
cool a test chamber of 4.5 m3 volume, while a copper heat exchanger with
circulating cooling water at the hot side of the TE modules was used for heat
release. Thermal acceptability assessment was performed to find out whether the
indoor environment met the ASHRAE Standard-55s 80% acceptability criteria.
The standard was met with the TE-CCP system operating at 1 A of current flow
with a corresponding cooling capacity of 201.6 W, which gives the COP of 0.82
with an average indoor temperature of 27oC and 0.8 m/s indoor air velocity.

Chapter 3

PROJECT

.1 HEAT SINK DESIGN

16

In order to visualize the energy flow in the entire system, a thermal circuit is
constructed, which is schematically shown in Figure 2. Rc and Rh and are the
overall thermal resistances for the internal heat sink and external heat sink,
respectively. The components of the air cooler are an internal heat sink, a
thermoelectric module, and an external heat sink as shown in Figure 2 is the
amount of heat transported at the internal heat sink, which is actually the design
requirement (33 Watts).

Fig.3.1 prototype of thermoelectric cooling system

Fig.3.2 heat sink

17

Fig.3.3 circuit diagram of TEC

Fig.3.4 Common heat exchanger designs: (a) natural air convection, (b) forced
air convection.

.2 GEOMETRY
Two main geometries were considered for the device the first was a rectangle. The
advantage of rectangle is its simplicity to build and insulate. A door can easily be
attached to one of the sides. Finally any insulation, thermoelectric modules or heat
sinks are easily fastened to the sides. The second choice for cooler geometry was a
cylinder. The advantage found with this shape is that it has the largest volume to
surface area ratio of the two designs considered. This is a good property when the
objective is to minimize heat loss. But considering the simplicity to build and
insulate rectangle box is considered.
The geometry of the project is given below:
Outer dimension = 30 cm 27 cm 38 cm
Internal dimension = 28.5 cm 25.5 cm36.5 cm

18

.3 MATERIAL
We explored three different materials for the construction of the cooling box and
frame of the device. These were aluminum, wood and thermacol. High impact
polystyrene is desirable as it has a low thermal conductivity. Building the device
out of would make it very light, portable while maintaining rigidity is readily
available and reasonably priced, is easy to cut and drill. The outer casing and
container would be made by first making a positive mold and applying a cloth
coated with resin.

Fig.3.5 Schematic description of an experimental thermoelectric refrigeration

system.

Chapter 4

ANALYSIS
.1 EXPERIMENTAL SETUP
The experimental setup of the given project is shown below. It is a protype of
thermoelectric refrigeration system.

19

Fig.4.1.Internal View of Prototype TERS

20

Fig.4.2. Back View of Prototype TERS

21

Fig.4.3. Side View with digital thermometer attached of Prototype TERS

.2 EXPERIMENTAL ANALYSIS
Experimental analysis was done in three stages. This helps to know about the
detailed information about the instruments, working procedure and operating
parameters of the thermoelectric cooling system. They are as follows:

1) COP :
It is seen that the COP is a function of the material dimension property of
thermocouple, the temperature of the hot side and cold side Th, Tc and the
current input. There exists an optimum current for maximum COP, if Th, Tc,
and thermoelectric material are fixed.
So analysis of COP is done by varying the various parameters such as input
current, voltage and temperature difference and their effect on COP is study
for fix geometric parameters.

a) Influence of Current (I) on COP:

The expression for the coefficient of performance is defined in equation
(6).Fig. 4 is a simulation of coefficient of performance against input current at
20C temperature differences.

22

COP vs I
1.5
1
0.5
0
0

10

12

-0.5
-1

Fig.4.4. COP vs. Current Graph

Where,
x-axis = current (I)
y-axis = COP
It can be seen that from the plot that the C. O. P. increases with an increase in
input current, gets to a peak value and then begins to decrease at various
temperature differences. The unique feature of the graph is with the DT = 20,
the smallest temperature differences, it shows that the C. O. P is maximum
with the smaller temperature difference between the source and sink.
Therefore, for optimum performance of the thermoelectric cooler, the
temperature difference between the source and sink should be kept as low as
possible. C. O. P is a measure of modules efficiency and it is always desirable
to maximize C. O. P.

2) Time vs temperature :
The experimental result (Fig.4.) shows that at input electrical current condition
0.5Imaxi and at forced air convection condition the temperature reduction at
cold side of module with respect to ambient at 30oC was maximum.
With these optimized operating condition (I=0.5Imaxi and at forced air
convection) experiments were conducted for performance evaluation of

23

developed experimental thermoelectric refrigeration cabinet without any heat

load inside cabinet and results shown in fig. below.

time vs temp.
30
25
20
15
10
5
0
0

10

20

30

40

50

60

70

80

Fig.4.5.Time vs. Temp. Graph without load

Where,
x-axis = time in min.
y-axix = temperature in C

3) Cooling temperature of Fruit (Orange):

The orange directly on surface of cooling chamber and measuring temperature
by thermocouple for analyzing the cooling effect on fruit(orange) and reading
is taken by inserting thermocouple rod in orange and then take reading after
one minute time interval and measure temperature reading.

24

time vs temp.
30
25
20
15
10
5
0
0

10

20

30

40

50

60

70

80

Fig.4.6. Time vs. Temp. Graph with load

In analysis of orange fruit, the graphical representation figure 3 shows
initially fruit cooled fastly. The temperature decreases from 28C to
22C.within 20 minutes and then taken 80 minutes to decrease another
4C. The cooling rate for Orange is (28-22)/20=0.3

.3 COST ANALYSIS
The cost analysis of the project is given below:
S. No.
1
2
3
4
5
6
7
8
9

Items
Thermoelectric module
Wood
Aluminium foil
Thermocol
Transformer
Capacitor
Switch
Digital Temp. Control
Device
Extra

Cost (in Rs.)

5000
200
500
100
500
100
150
1200
750

25

Chapter 5

RESULT

.1 RESULT AND DISCUSSION

To verify the above system design analysis, we have designed and built a
prototype thermoelectric refrigeration system and perform an experiment. The
picture built of the thermoelectric refrigeration system is shown in figure 4.1 to
4.3. The thermoelectric module is used for the experiment.

Cooling Rate Test Data:

The test was conducted at 25-30C represented in figure 4.4-4.6. The temperature
vary from 25C to 6C with temperature variation within the TEC is less than 1C
as this was the prototyping we can achieve even lower temperature.

26

27

28

Fig.5.1. Readings

TEC Retention:
The retention time is calculated as per test procedure. As the current carrying
capacity of Peltier cell is high as 9 Amp the battery to be used will be 12 V.
Therefore different method has to be employed to achieve the desired temperature.
All this method was mentioned above.

.2 CONCLUSION
The research effort made by different researchers for design and development of
novel thermoelectric refrigeration and space conditioning systems has been
thoroughly reviewed in this paper. Also the advantages and cost-effectiveness
offered by thermoelectric cooling system over conventional cooling system have
been explained. A temperature reduction of 11C without any heat load at 30C
ambient temperature in first 20 minutes has been experimentally found at
optimized operating conditions. The calculated COP of developed experimental
thermoelectric refrigeration cabinet was 0.1. The available literature shows that
thermoelectric cooling systems are generally only around 515% as efficient
compared to 4060% achieved by conventional compression cooling system. This
is basically limited by figure of merit of thermoelectric material and efficiency of
heat exchange system. Continuous efforts are given by researchers for
development of higher figure of merit thermoelectric materials may provide a
potential commercial use of thermoelectric refrigeration and space conditioning
system. Also compatibility of thermoelectric cooling systems with solar energy
made them more useful and appropriate for environment protection.

29

.3 FUTURE SCOPE
With recent development taking place in field of thermoelectric and nano science
different thermoelectric material with figure of merit ZT more than 1 with high
temperature difference to be explored this will further help to reduce the
temperature, current below and can also perform better at higher ambient
conditions. To improve the power retention in this thermoelectric cooler sandwich
heater needs to be explored with quick switching mechanism from thermoelectric
cell off state of heater to on state, so that temperature drop in thermoelectric cell
can be reduced.

.4 REFERENCES
1. Rowe D. M., 1995, CRC handbook of Thermoelectrics
2. Huang B.J., Chin C.J. & Duang C.L., 2000, A design method of
thermoelectric cooler, International Journal of Refrigeration, 23: 208-218.
3. Rowe D. M., 2006, Thermoelectrics handbook: Macro to Nano, CRC,
Taylor & Francis
4. Xi Hongxia, Luo Lingai and Fraisse Gilles, 2007, Development and
applications of solar-based thermoelectric technologies, Renewable and
Sustainable Energy Reviews, 11(5): 923-936.
5. Dai Y. J., Wang R. Z. and L. Ni, 2003, Experimental investigation and
analysis on a thermoelectric refrigerator driven by solar cells, Solar
energy material and solar cells 77:377-391.
6. Gao Min and Rowe D.M., 2006, Experimental evaluation of prototype
thermoelectric domestic-refrigerators, Applied Energy, 83 (2): 133-152.
7. Sabah A. Abdul-Wahab, Ali Elkamel, Ali M. Al-Damkhi, Is'haq A. AlHabsi, Hilal S. Al-Rubai'ey', Abdulaziz K. Al-Battashi, Ali R. Al-Tamimi,
Khamis H. Al-Mamari and Muhammad U. Chutani, 2009, Design and
experimental investigation of portable solar thermoelectric refrigerator,
Renewable Energy, 34 (1): 30-34.
8. Abdullah M. O., J. L. Ngui, K. Abd. Hamid, S. L. Leo, and S. H. Tie,
2009, Cooling Performance of a Combined Solar ThermoelectricAdsorption Cooling System: An Experimental Study, Energy Fuels, 23:
56775683.
9. Putra N., 2009, Design, manufacturing and testing of a portable vaccine
carrier box employing thermoelectric module and heat pipe, Journal of
Medical Engineering & Technology, 33 (3): 232-237.

30

10. Adeyanju A.A., E. Ekwue and W. Compton, 2010, Experimental and

Theoretical Analysis of a Beverage Chiller, Research Journal of Applied
Science, 5 (3): 195-203.
11. Lertsatitthanakorn C., Lamul Wiset, and S. Atthajariyakul, 2009,
Evaluation of the Thermal Comfort of a Thermoelectric Ceiling Cooling
Panel (TE-CCP), System Journal of Electronic Materials, 38: (7) 14721477
12. Gillott Mark, Liben Jiang and Saffa Riffat, 2010, An investigation of
thermoelectric cooling devices for small-scale space conditioning
applications in buildings, International Journal of Energy Research, 34:
776786.
13. Bansal P. K. and Martin A., 2000, Comparative study of vapour
compression, thermoelectric and absorption refrigerators, International
Journal of Energy Research, 24: 93-107.

.5 INDEX
The tables for different data are given below:
1. COP vs. Current (I) at 20C temperature difference.
S. No.

I (in Ampere)

C.O.P

-0.6743

1.3336

1.3135

1.1153

0.9250

0.7651

0.6337

0.5252

0.4348

10

10

0.3585

11

11

0.2934

31

2. Time vs. Temperature without any load.

S. No.

Time (in minute)

Temperature in C

28

25

10

22

20

19

25

17

30

15

35

13

40

11

45

10

10

50

11

55

12

60

13

65

14

70

15

75

16

80

3. Time vs. Temperature with load.

S. NO.

Time (in minute)

Temperature in C

28

27

10

26

15

25

20

24

32

25

23

30

22

35

22

40

22

10

45

21

11

50

21

12

55

21

13

60

21

14

65

20

15

70

20

16

75

20