Asonika T.v5.0.Manual - en en

APPROVED
General Manager
ASONIKA SRI, LTD
___________ A.S. Shalumov
12.03.2013
Subsystem analysis and thermal characteristics of hardware design in ASONIKA-T

_______________________
Application description
Users Guide
Validated Page
_____________________
146 pages
2013
Letter
An Automated System for Ensuring the Reliability and Quality of Equipment

(ASONIKA)
SUBSYSTEM ANALYSIS AND THERMAL CHARACTERISTICS OF

HARDWARE DESIGN IN ASONIKA-T
APPLICATION DESCRIPTION
2013
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ANNOTATION
We review the issues of automated modeling of thermal processes with arbitrary

design of radio electronic means in models of thermal processes (MTP), built by the user.
The documents -- "Description of the subsystem", "User's Guide," and "System
Administrator's Guide" -- discuss the purpose and structure of the subsystem, the
subsystem description, use of the subsystem, the forms data input, the methodology of
thermal design models and calculations of their thermal modes of radio electronic means,
configuration, and structure and launch of ASONIKA-T subsystem.
Subsystem ASONIKA-T is used within Russian Federation Ministry of Defense for
monitoring the correct application of electronic technology in special-purpose hardware. It
is recommended for the set of standards "MOROZ-6" for use in the process of design and
replacement testing in the early stages of design. On July 1, 2000, the following document
was enacted which was developed jointly with TNIII 22 of the Defense Ministry of
Russian Federation, KGTA, and MGIEM, regulating the use of the ASONIKA system
during design: RDV 319.01.05-94 , Rev.2 -2000. Document Guide. Comprehensive
quality assurance system. Instruments, devices, and equipment for military purposes.
Principles of mathematical modeling during design / Y.N. Kofanov, A.S. Shalumov, A.I.
Andreev, V.G. Zhuravskii, V.V. Goldin, Y.I. Stepanov, A.A. Borisov. - M.: 22nd TNIII
Ministry of Defense, 2000. 57pp.
In 2007, a certificate from the Russian Federation Ministry of Defense was obtained
for ASONIKA system, according to which the system met the requirements of the RDV
319.01.09-94 (eds. 2-2000) and is suitable for the automated control of the correct
application of RFC in the development of equipment for the benefit of the Russian
Defense Ministry.
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CONTENTS
1. 1.
SUBSYSTEM DESCRIPTION .................................................................................................... 5
1.1. Use and technical specifications of the subsystem......................................................................... 5
1.2. Description of thermal models of the subsystem ......................................................................... 10
2. USER GUIDE ........................................................................................................................................ 12
2.1. Starting the subsystem and main menu items ............................................................................ 12
2.2. Forced water cooling design .......................................................................................................... 29
2.3. Natural air cooling design ............................................................................................................. 30
2.4. Modelling and simulation results interface ................................................................................. 31
2.5. Sources of influence and capacity modelling ............................................................................... 35
2.6. Demonstration of different power sources................................................................................... 64
2.7. Example of thermal modeling a floor cabinet ............................................................................ 66
2.7.1. Analysis of thermal processes ................................................................................................................................. 67
2.7.2. Simulation results .................................................................................................................................................... 71
2.7.3. Results ....................................................................................................................................................................... 73
3. SYSTEM ADMINISTRATOR'S GUIDE ........................................................................................... 74

3.1. Structure and launch of ASONIKA-T ......................................................................................... 74
3.2. Saving the project........................................................................................................................... 74
4. BASIC PRINCIPLE METHODS OF CONSTRUCTION OF THERMAL MODELS ................. 75
4.1. General information ...................................................................................................................... 76
4.2. "Heated zone" and the principle of local influence .................................................................... 78
4.3. Designation of MTP branches ...................................................................................................... 80
4.4. Properties of models in different coordinate systems ................................................................. 81
5. MODELS OF THERMAL PROCESSES FOR STANDARD DESIGNS AND REM ELEMENTS
..................................................................................................................................................................... 82
5.1. Constructing an MTP plate with a heater of P power on one of the sides ............................... 82
5.2. Thermal process model of a transistor ......................................................................................... 85
5.3. Thermal process model of a transistor mounted on the radiator .............................................. 86
5.4. Thermal process model of an air channel (air-duct) .................................................................. 88
5.5. Thermal process model of a sealed REM block ......................................................................... 90
5.6. Thermal process model of a perforated REM block .................................................................. 95
5.7. Cartridge design of an REM block as a standard design element .......................................... 100
5.7.1. Cartridge block with an air flow .............................................................................................................................. 100
5.7.2. Sealed cartridge block .............................................................................................................................................. 104
5.8. Thermal processes model of an REM rack ................................................................................ 106

APPENDINX ........................................................................................................................................... 115
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1. 1. SUBSYSTEM DESCRIPTION
1.1. Use and technical specifications of the subsystem
Subsystem ASONIKA-T is designed to automate the modeling of thermal processes

of microassemblies, radiators, heat sinks, hybrid-integrated modules, blocks and stackable
cassette design, cabinets, racks, and other non-standard (arbitrary) structures.
The subsystem allows during the design of radio electronic means (REM) to
implement the following project objectives:
determination of average temperatures of blocks, printed circuit boards, and
materials with design, as well as the volume of air within the REM;
modification to the REM design to achieve acceptable thermal conditions;
selection of the best option in terms of thermal modes of design from several
existing conceptual options;
the rationale for the necessity and evaluation of effectiveness of additional
protection of REM against thermal effects;
creating effective testing models and prototypes of REM on thermal effects (the
objective of selection of most informative influences, the selection of sensors, and
establishment of points in most thermally loaded places, etc.).
The subsystem allows simulating steady and transient thermal modes of REM
placed in air environment, both in normal and under reduced pressure and cooled by
natural or forced convection. As a result of the simulation, the average temperature values
of selected isothermal air volume are determined, as well as average temperatures of
designs at lower levels for further thermal modeling, with the implementation of the "top
down design procedure. Thus, during thermal modeling of radio-electronic cabinets, the
average temperature values of the blocks or modules are determined; then the next step is
to model these block or modules. The result is the average temperature values for printed
circuit boards.
Next, for thermal modeling of printed circuit boards, subsystem
ASONIKA-TM is used, which allows one to get the temperature field of each printed
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circuit board and each radioelement. By comparing radioelement temperature output

values with temperature limit values of these elements, we can determine compliance with
temperature margins, and thus we are able to detect overloaded radioelements. If the
requirements are met, then the temperature values of radioelements are transferred to
electrical calculation program to further confirm these calculations.
Temperatures of PCB components are required for mechanical calculations in
ASONIKA-TM.
Temperature fields along with average temperatures of standard design components
are determined in ASONIKA-T subsystem, which allow an opportunity to get a
preliminary understanding about thermal conditions and use this information in
ASONIKA-M subsystem to carry out complex mechanical modelling taking into account
temperature values.
ASONIKA-T program includes a database with reference geometrical and thermal
RFC parameters and design materials, graphical input of initial data, and graphical output
of calculated results.
To carry out simulation session using this subsystem requires the following
background information:
a sketch or drawing of the underlying REM design;
thermo-physical parameters of materials considered in REM design;
heat generation capacity in designs with a low level of hierarchy considered as
part of the design. Heat-generators, in the design, are made from mounted REM
radioelements;
cooling conditions (boundary conditions) of REM design.
The block diagram of the subsystem is shown in figure 1.1.
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Integrated database
TeRa
Dialog of input parameters for
modelling thermal process
nodes

modelling thermal process
branches

MTP of standard elements
Dialog of standard elements

coupling for the general
model of thermal processes
Library of
standard
elements
Database of
materials
Calculation module
Ac_t
Raw data files *.dat
Calculation results output

module
ShowGR
Vectorization modelling
module
Automated synthesis of
modelling standard elements
module
Results file *.rez
Information support
subsystem ASONIKA-T
Help of ASONIKA-T
subsystem
Figure 1.1: Block diagram of ASONIKA-T subsystem
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At its core lies Asonika_T, which has two main functions. Firstly, this module is a
managed wrapper for the subsystem and contains several modules and dialogs for
communication between various function subsystems while performing certain functions,
such as calculation processing, database query of materials and standard components, and
display of necessary user information. Secondly, this module is a graphical frontend for
the construction of the graph, the topological model of thermal processes. Through this
module, the user controls the entire information space of the subsystem. All control and
interaction with the user is done through the module using special dialogs.
Work with the subsystem starts with a model of thermal processes or a macromodel
of the investigated design. Each of these stages is reflected in the automated module
Asonika_T with a relevant dialog form. Construction of a model begins by defining the
nodes of topological graphs.
For this purpose, there is a dialog form which guides the
user when inputting node parameters into the model. Further, the nodes are connected with
branches to define thermal coupling between elements of the design. For this process, too,
there is a dialog that asks the user for the branch type and the necessary thermal
parameters of the given influence. Thus, the model is constructed of any complexity.
However, this process is inefficient and requires a lot of attention and labor to create the
model.
For this reason Asonika_T module has been added with newly developed
algorithms and methods for automated MTP synthesis of standard elements. Standard
types of elements were created and methods and algorithms of automated synthesis were
developed for these elements. To construct a standard element MTP, simple and
understandable dialog forms are used for input of necessary parameters. Automatically
built MTPs are parameterized.
In addition, very often, construction of a complex model necessitates a use of
standard element of MTP couplings between one another in order to create a single model.
For these situations, required information is entered with the use of dialog forms to
automatically couple necessary elements of the design. These dialog forms greatly
simplify the work of the designer.
Modelling and display of topological models of thermal processes take place at the
same time for the investigated design. For this purpose a vectorization module is provided.
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This module is built using modern technologies of object-oriented programming and

implemented, as well as the entire subsystem, high-level language Delphi.
For automated synthesis of standard MTP elements, a synthesized model module is
created which builds a model based on set parameters using developed algorithms. The
final result of Asonika_T module is a source data file. Graphical information containing
the model is stored in a file with *.spt extension.
After a model is created, next step is to carry out the calculation. For calculations,
Ac_T.ex module is provided in the subsystem. Initial data used to carry out calculations is
stored in *.dat extension files. When the calculations are complete, the results are stored in
*.rez extension files. The results files are conveniently stored in a separate Result folder
located in the root directory of the subsystem. The presence of files containing graphics
and initial data in the root directory is required to successfully carry out calculations.
Depending on calculation results, the user is able to get a variety of textual and
graphical information. For this purpose, ShowGR module was developed to display results
for steady-state calculations shown in the nodes temperature table, as well as transient
calculations shown in a plot as node temperature vs time, and the nodes temperature table
at each time interval.
In addition, the subsystem provides a clear and extensive help system which in an
intelligible form explains how to work with the subsystem and to create models of thermal
processes.
To make it more convenient working with dialog forms in ASONIKA-T subsystem,
the program provides a functional relationship with an integrated data bank. The data bank
contains a set of databases that include background information about REM materials with
all thermo-physical parameters needed to carry out calculations. In addition, there is a
database of standard elements which can be replenished with elements created by the user.
It should be noted that the database is centralized and uniform for ASONIKA-T and
ASONIKA-TM subsystems. This makes it more effective during thermal analysis of an
integrated examination of components ranging from a supporting structure to a PCB,
where the results of one analysis are boundary conditions in the other.
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1.2. Description of thermal models of the subsystem
The subsystem allows modelling of steady-state and transient thermal processes of

REM design for different cooling conditions by forming a system of nonlinear algebraic
equations (for steady-state thermal process) or a system of ordinary differential equations
(for transient thermal process) to specify geometrical and thermal parameters of the REM
design. Design nodes and elements are specified in REM as well. Boundary conditions are
set by design to solve a system of equations. Output of results is carried out in a
convenient form for further analysis.
The system of equations which is formed by the subsystem is based on the
topological model constructed by the user and displayed on the computer screen.
To solve this problem, criterial equations from similarity theory and heat transfer
equations are used which include a method of nodal potentials which form mathematical
models of thermal processes as a system of ordinary differential equations (SODE) or a
system of nonlinear algebraic equations (SNAE).
Backward differentiation method is used to solve SODE; simple iteration method is
used to solve SNAE; and LU-decomposition method with symbolic factorization
accounting for a stiffening matrix for thermal conductivity is used to solve a system of
linear algebraic equations (SLAE) which are reduced from SODE and SNAE (at each time
step and/or at each iteration by nonlinearities).
Unlike other kinds of models, topological models of thermal processes set boundary
conditions of different kinds with REM design combinations of volumes and surfaces in a
simple way with the help of appropriate graphical components (branches, specified
temperature sources, and (or) thermal input sources).
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2. USER GUIDE
2.1. Starting the subsystem and main menu items
Starting the subsystem and main menu items. The subsystem is called with the
TeRa.exe command. When the program is launched, the subsystems window appears
which can be divided into three areas: the workspace where topological model of
thermal processes (MTP) of the design is built, main menu, and the toolbar. These areas
are shown in Fig. 2.1.
Figure 2.1: Window of the subsystem
Main menu consists of the following set of commands: File, Edit, View, Design,
Analysis, Results, and Help shown in figure 2.2.
Figure 2.2: Main Menu
File menu, expanded in figure 2.3,
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Figure 2.3: File menu
provides the following features:

create a new model (item menu File/New);
load an already drawn model from the drive (item menu File/Open);
save a drawn model in a file on the disk (item menu File/Save or Save As);
finish working with the program (item menu File/Exit).
The initial data and simulation results are saved in the Data directory. No additional
directories and subdirectories for inputs and results are necessary. All files related to the
project have different extensions, but the same name.
Edit menu allows you to work with a database of thermal parameters of materials
and a database of coefficients for lubricants; save a part of a thermal model as a standard
element; load a standard element; as well as highlight an entire model.
Figure 2.4: Edit menu
View Menu causes parameter settings window to appear (figure 2.5), as well as a
display of a full model in a separate window.
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Figure 2.5: Edit menu and Options window
Design menu allows to choose a standard design shown in figure 2.6.
Figure 2.6: Design menu
Analysis menu allows to carry out calculations of the presented model, select
calculation parameters (steady-state and transient), and also enter a table of specific values
which vary according to the preset rules (figure 2.7).
Figure 2.7: Analysis menu
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Results menu allows (see figure 2.8):
Figure 2.8: Results menu
display a table of temperatures at each node of a model for a steady-state type

calculation; and display a table of temperatures at each node of a model at each time
interval for a transient type of analysis (this results table can also be saved to a text file);
display a temperature graph over time for a transient type of analysis;
display a table of temperatures at each node of a model at a given moment in time
under transient type of thermal analysis (you can also save to a file).
Help menu allows you to get help information about the program (figure 2.9).
Figure 2.9: Help menu
Before adding a thermal design model, one should be familiar with the method of
REM thermal model construction which is part of ASONIKA-T subsystem.
Toolbar consists of a set of buttons to invoke the main commands of the subsystem.
This menu is divided into three areas: Standard, Tools, and Options, each of which is
designed to perform a specific set of commands.
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Standard Toolbar (figure 2.10) contains buttons for the standard functions to work
with files, duplicates File menu item. Furthermore, it contains a button to view the original
data file
Figure 2.10: Standard Toolbar
Tools Toolbar (figure 2.11) contains buttons which are used to create and edit
topological models of thermal processes, as well as a help button. Commands contained in
this toolbar will be reviewed in more detail below.
Figure 2.11: Tools Toolbar
Options Toolbar (figure 2.12) contains buttons which are used to retrieve
additional information about nodes and branches of a topological MTP design, as well
as the use of calculation parameters.
Figure 2.12: Options Toolbar
Working with GUI mathematical thermal model input of REM design in a

topological form begins with the introduction of numbered nodes into the model. To do
this, press the
button in the toolbar. After that, set the cursor anywhere in the
workspace and press the left mouse button. You will be prompted to enter the number and
name of the node (see figure 2.13).
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Figure 2.13: Creating a topological thermal model node
Node numbering is automatic, however, the node number can be changed manually.
Nodes must be numbered sequentially and without gaps.
Removing a node. Before removing the node, we need to remove all branches
which are connected to it. After that, we press the
button in the toolbar. When the
cursor is placed on the node, press the left mouse button while holding down the Ctrl key.
The node will turn blue. Next, we click on the
button. The node will be removed.
Creating a branch for a topological thermal model is carried out between two
nodes. To do this, click on the
button in the toolbar. Select both nodes sequentially.
Next, select the branch type (figure 2.14).
Figure 2.14: Selecting branch type
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Next, enter the parameters of the corresponding branch, for example, a branch
representing radiation is shown in figure 2.15.
Figure 2.15: Branch parameters for radiation

As a result, we obtain the following pictorial representation (see. Fig. 2.16):
Figure 2.16: Representation of a radiation branch

Power Source, Temperature Source, and Heat Capacity branches are set only
for transient thermal calculations and are connected to one end of the node which has a
zero potential.
Removing a branch. To do this, click on the
button in the toolbar. Then set the
cursor on a branch which needs to be removed, and click on the left mouse button while
holding down the Ctrl key. The branch will turn blue. Next, click on the
button to
remove the branch.

Editing branch parameters. To do this, click on the
button in the toolbar.
Next, set the cursor on a branch whose parameters need to be changed, and click on the
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right mouse button while holding down the Ctrl key. After that the window prompt will
appear where branch parameters can be edited.
Selecting an object. To do this, click on the
button in the toolbar. Then, press
the left mouse button and outline the object with a rectangle. After the left mouse button is
released, the object will turn blue. Thus, the object will get highlighted. After that, the
entire object can be moved or deleted.
Moving nodes and objects is accomplished when
button is selected in the
toolbar. Then, set the cursor on the thermal model node or object, which needs to be
moved, and then holding down the left mouse button, the item is moved. After the node is
moved, we first click on the
example, the
button, and then choose a different one in the toolbar, for
button.
Viewing node names and branch numbers. For this, the

the first case, and
button is selected for
button for the second.
Creating a library of standard elements. Very often in a physical thermal model

design there are standard, highly repetitive, elements. In order to avoid entering these
elements every time, we would need to save them once, and then insert them into each
new physical model when necessary. To save the newly created standard element, we first
select it (please see Selecting an object from above). Then, clicking on the right mouse
button and holding down Ctrl key select Save as a standard component from the prompt
menu. Saving the file (having uel file type) can be done in any directory which was
previously created, where all physical models of standard elements will be stored.
Reading the standard element and inserting it into a physical model is achieved by
first selecting the
button. Pressing the right mouse button while holding down Ctrl key
select To insert typical element / Load a Standard Component from the menu, and select
the uel file from the directory where models of standard elements are stored.
Physical models of standard elements are created by the program developers of
the subsystem. Currently, there are 4 types of standard REM design: plate, package,
modular design, and stack design.
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To insert a plate, select the
button in the toolbar. Then, set the cursor anywhere
in the workspace and click on the left mouse button. In the window that appears (figure
2.17), we enter plate parameters.
Figure 2.17: Parameters window for a standard element Plate
After entering appropriate parameters, the screen will display an image of the
physical model of the plate (figure 2.18a). If you move the cursor to the plate and press the
right mouse button, a menu appears, prompting you to select one of the following: unfold
a physical model of the plate into a topological model or change plates parameters. When
the physical model of the plate is unfolded, the topological model will be displayed (figure
2.18b).
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b)
Figure 2.18: Representation of a plate model:
a - physical; b - topological
The topological model of the plate can be folded by pressing the right mouse
button. To remove the plate, click on the left mouse button while holding down the Ctrl
key. The plate will turn blue, which means it is ready to be removed. Next, click on the
button. The plate will be removed.
When constructing the model of the plate, the principle of elementary zone
decomposition is used, within which the temperature distribution of the surface is
considered constant. The plate is divided into elementary provisional grid zones. Figure
2.18b shows an MTP plate taking into account heat distribution along the plate itself, as
well as convection of the environment and radiation on the adjacent elements or housing
walls of a block.
As can be seen from practice, there are two possible uses of an MTP plate. In
general, when the plate is used under normal conditions, convection and radiation
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branches are used, like the one shown in figure 2.18b. In a particular case, when a given
model describes operational conditions in a vacuum, we only show radiation.
In all of the above described cases, the use of an MTP gives the same initial
conditions. Primarily, we input the dimensions of the partition of the OX and OY axes,
that is the grid is discretized and thus we create the number of elementary zones. By
default, the temperature is the same in each zone but can be changed if necessary. Next is
given the overall size in millimeters. The second step is the selection of the number of
planes, operational conditions, namely the presence of the medium of the environment or a
vacuum, after which we set basic thermo-physical parameters: the path length of thermal
flow, thermal conductivity of the material, the emissivity of the surface, the irradiance
factor, critical size, orientation ratio, and the ambient pressure of the environment.
To input Package as a standard element, click on the
button in the toolbar.
Next, place the cursor anywhere in the workspace and press on the left mouse button. In
the window which appears (figure 2.19), we enter appropriate parameters of the package.
Figure 2.19: Parameters window of a standard element Package
After all of the appropriate parameters are entered, the representation of a physical
model of the package will appear (figure 2.20).
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b)
Figure 2.20: Representation of the package model:
- physical; b topological
If you move the cursor to the package and press the right mouse button, a menu
appears, prompting you to select one of the following: unfold a physical model of the
package into a topological model or change parameters of the package. When the physical
model of the package is unfolded, the topological model will be displayed (figure 2.20b),
which can be folded back by clicking on the right mouse button.
To remove the package, click on the left mouse button while holding down the Ctrl
key. The package will turn blue, which means it is ready to be removed. Next, click on the
button. The plate will be removed.
This model element can be used to create virtually any REM design. To construct an
MTP block design, we must, in accordance with the principles of construction of
topological models, divide the model into basic elements.
We highlight six basic
elements: front wall, back wall, upper wall, bottom wall, left wall, and right wall. But for
model construction, it is necessary to have nodes that represent the medium of the
environment and the air inside the housing. Therefore, the MTP of the package will be
represented in the form of a disconnected graph consisting of eight nodes and appropriate
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branches (figure 2.20b). As in the case of a plane design, the given model will depend on
the medium of the environment, in which the block design will operate. Figure 2.20b
shows a block model in the environment. If the package is used in the vacuum, then
convection branches will be missing in the model. In that case, the influences between the
elements of the block will only be due to radiation. Each node of the design has its own
number. Each node represents one element of the design, that is: 1 - left wall, 2 upper
wall, 3 front wall, 4 bottom wall, 5 back wall, 6 right wall, 7 medium, and 8
inside air.
A standard REM element design labeled as Modular Design is also present in
ASONIKA-T subsystem. It is a set of modules which consist of two or three layers: the
middle one is aluminum, while a circuit board is attached to both sides or just one side is
attached to aluminum layer. Fins are located along the edges of the aluminum layer.
Because the fins are tied, the package is formed automatically as a result of tightening of
modules by the bolts. We only need to fix the two lids one on top, and the other on the
bottom.
To create a standard Modular Design, select Design/Modular Design in the
main menu. Next, set the cursor anywhere in the main window of the subsystem and click
on the left mouse button. In the dialog windows which appear (figure 2.21 and 2.21b) we
enter appropriate parameters for the design of the module.
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b)
Figure 2.21: Dialog windows for entering parameters of a standard modular design
After entering all appropriate parameters, a physical model of a modular design will
appear in the main window of the subsystem in the folded form (figure 2.22). If we
move the cursor to the package and the plate, by clicking on the right mouse button we can
unfold the package and the plate or edit the parameters of the package and the plate.
When the package and the plate are unfolded, a mathematical model of the topological
form (figure 2.22b) appears, which can be folded back to the physical form by clicking on
the right mouse button.
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b)
Figure 2.22: Representation of modular design models:
physical mode; b topological model
To remove the package and the plate, click on the left mouse button while holding
down Ctrl key. The package and the plate will turn blue. This means that they are ready to
be removed. Next, click on the
button. The package and the plate will be removed.
The macromodel of the module can be represented in a simplified form as a package

model with the two inserted circuit boards (figure 2.22). In the unfolded form, the
macromodel is shown in figure 2.22b. As shown in the figure, the model consists of a
package, nodes 1, 2, 3, 4, 5, and 6. These nodes represent the walls of the housing which
interact with the medium (node 7) through radiation. Since this design is primarily used in
the space industry and is operated in a vacuum, the convective heat transfer with the
environment is not present. However, if necessary, it is easy to add appropriate branches.
The internal structure of the package module represents a layer, node 7, which is
connected to the upper, lower, front, and back walls of the package. Circuit boards are
attached on both sides of the layer which are represented as multipoles in the macromodel.
The main heat source elements are the circuit boards. For more accurate modeling, they
are represented as plates broken down into four areas. Each plate has its own heat source.
These circuit boards, nodes 8 11 and 13 16, interact with air (nodes 12 and 17) through
radiation between the walls of the package and the circuit board and through conduction
with the layer.
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The design can contain up to fifteen modules connected into one design.
The
package modules are connected with each other through conduction branches by wall
contact. Since the modules are bolted together, heat dissipation will be taken into account
due to these attachments. By increasing the number of modules in the design, conductive
branches will be added along adjacent, in direct contact with each other wall of the
modules. The rest of the parts of the macromodel will remain unchanged. In addition, you
can set radiation power for heat areas in the folded form or load directly to nodes of the
PCB in the unfolded form of the macromodel.
Lets review a standard Stack Design which is a rectangular enclosure with circuit
boards of the same dimension stacked parallel to each other.
To create the stack design, select Design/Stack Design in the main menu. Next,
set the cursor anywhere in the main window of the program and click on the left mouse
button. In the dialog window which appears (figure 2.23) we set appropriate parameters of
the stack design.
Figure 2.23: Dialog window for entering parameters of the stack design
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After all appropriate parameters are entered, an image representing a folded form of
a physical model of the stack design will appear (figure 2.24). If we set the cursor next to
the enclosure and click on the right mouse button, the window will appear that would
enable us to unfold the physical model of the stack design or change the parameters of a
standard stack design. When the enclosure is unfolded, the image of the topological model
will appear (figure 2.24b), which we can fold back by clicking on the right mouse button.
To remove the stack design, click on the left mouse button while holding down Ctrl
key. The model will turn blue, which means it is ready be removed. Next, click on the
button. The model will be removed.
b)
Figure 2.24: Representation of a standard Stack Design model:
physical model; b topological model
When working with an MTP stack design of an REM, it is necessary to consider

two cases:
forced convection cooling design (air flow between blocks circuit boards);
natural convection cooling design.
In both cases, the MTP of these designs have to let define:
29
.
the temperature of the housing of the block;

average surface temperatures of circuit boards;
air temperatures between printed circuit boards. For a natural convection cooling
design average volume temperature of each air volume. For forced convection cooling
design air temperature at the outlet of each air channel between printed circuit boards
and an average temperature of each air channel. These integral thermal condition
parameters of such designs are necessary in the future for a detailed analysis of thermal
REM characteristics, i.e. for the implementation of a hierarchical approach to modelling of
REM thermal processes.
Note that from the thermal processes perspective, both stack and cartridge designs
are virtually indistinguishable from each other. This allows for identical MTP analysis.
In ASONIKA-T 5.0 version, the user has an ability to automatically build thermal
models of standard radiators. Its functional use is described in the Appendix 2 of the
manual.
2.2. Forced water cooling design
We adopt the following idealization for the considered design in terms of heat
transfer processes:
the surface of each printed circuit board is isothermal;
the surface of the housing block is isothermal;
heat flux from printed circuit assemblies through connectors and mounting wires
is negligible.
For an idealization to become acceptable, the following types of heat transfer are
available:
thermal influences through conduction between each printed circuit assembly and
the enclosure of the block;
thermal influence through conduction between the walls of the enclosure;
30
.
radiation from the surface of the enclosure into the environment;

convective heat transfer from the surface of the printed circuit assemblies into the
airflows which pass in between;
convective heat transfer from the surface of the enclosure into the environment;
heat and mass transfer of air in the air channels between printed circuit
assemblies.
2.3. Natural air cooling design
Simplifications adopted in the idealization of heat exchange processes for the

considered designs are analogous to those listed above for a forced cooling design. The
following types of heat transfer exist for an idealized design:
radiation from each printed circuit assembly into the air between the printed
circuit assemblies;
radiation from the surface of the enclosure of the block into the environment;
convective heat transfer from the surface of each printed circuit assembly into the
air between the printed circuit assemblies;
convective heat transfer from the areas of the inside surface of the enclosure,
restricted by the printed circuit assemblies, into the air;
convection from the surface of the enclosure of the block into the environment.
thermal interaction by conduction between walls of the enclosure;
thermal interaction by conduction between printed circuit assemblies and the
walls of the enclosure;
Figure 2.24b shows the described types of heat transfer and the accepted
idealization of an MTP stack design. The following notation is used in the MTP:
- nodes 1 through 6 walls of the enclosure;
- nodes 9, 11, 13, 15 are printed circuit assemblies;
- nodes 8, 10, 12 , and 14 air volume between printed circuit assemblies;
- node 7 ambient environment.
- 1 through 4 power of the thermal radiation of printed circuit assemblies.
31
.
2.4. Modelling and simulation results interface
Once the topological model is created, it needs to be saved by clicking on the

button in the toolbar. You will be prompted to save the file with a .dat extension. Next, we
need to select the type of modelling stationary or transient. For transient type of
modelling, we need to enter the appropriate parameters by clicking on the
button (see
figure 2.25).
Figure 2.25: Modelling parameters of thermal processes

After, we can go to the Analysis in the main menu and click Run.
The source data can be reviewed in text format by clicking on the
button. If
some parameters were edited, fast recalculation is available. However, these changes
wont be saved in the original source data.
For stationary results of thermal analysis type, by selecting Results in the main
menu and then Show Temperature at the Nodes, the following will appear:
32
.
nodes temperature table of the model (figure 2.26).
Figure 2.26: Nodes temperature table of the model

If necessary, the results can be saved in the text file by clicking on the Save file
button. The dialog window for saving a file will appear. The file will be saved with a .txt
extension in the Data directory. It is only necessary to specify just the name of the file.
For transient results of thermal analysis type, selecting Results in the main menu and
then Plot Temperature vs. Time submenu, will display:
temperature graph over time under transient conditions (figure 2.27).
33
.
Figure 2.27: Temperature graph over time under transient conditions
It is possible to configure the settings of the appearance of the plot. For example, if
we need to configure the appearance for node 1, double click on the Node 1 label in the
Model Nodes Selection window (figure 2.28).
Figure 2.28: Nodes selection of the model, for which temperature plots over time under
transient conditions will be created
34
.
Next, Appearance settings configuration for Node 1 window will appear (figure
2.29), where we can select the plot color, style parameters color and background by double
clicking, select plot width, style, and height and width of the marker from the drop-down
box;
Figure 2.29: Appearance settings configuration
display nodes temperature table over a given time under transient conditions (figure
2.30).
35
.
Figure 2.30: Nodes temperature table over a given time under transient conditions
If necessary, the results can be saved in text form by clicking on the Save
button. The file will be saved with a .txt extension in the Data directory. It is only
necessary to specify the name of the file.
The method of creating thermal models is described in Appendix 1. Appendix 2 has

the types of branches and different parameters necessary for modelling.
2.5. Sources of influence and capacity modelling
36
.
1. Power sources.
1.1. A source with constant power is created in the following way:
1.1.1. A special (base) node, with a zero label, is inserted into the model.
1.1.2. Click on the
button to select a branch type (the branch type number is
101).
1.1.3. The nodes are clicked on sequentially: first, the intended power source (node
1 in figure 2.31), then the base node (node 0).
Figure 2.31: Selecting a constant power source.

1.1.4. Select Power Source constant.
1.1.5. In the dialog window which appears, we select the value of the dissipated
power source (figure 1.1.2).
Figure 2.32: Dialog window to set the value for the power source.
37
.
1.1.6. As a result, the constant power source is defined in the model (figure 2.33).
Figure 2.33: Constant power source specified at 20 W.
1.2. Time dependent power source (function).

1.2.1. Initial steps, necessary for a power source selection with a specified function,
are analogous to figures 2.31, 2.32, 2.33. However, now we select Power Source time
dependent function from the drop-down menu (figure 2.34, branch type number 103)
Figure 2.34. Time dependent power source selection specified by a function.
1.2.2. ASONIKIA-T allows for an input of several types of functions to set power
dependence on time: pulse, sinusoidal, sawtooth, and complex. Selection of an appropriate
38
.
type is done from the drop-down box by clicking on the left mouse button and choosing
the function from the Function Type list (figure 2.35).
Figure 2.35: Selection of time dependent power types.
Each function has its own set of characteristics. For convenient determination, they
are shown as either prototype graphs under the drop-down list or as a formula.
1.2.2.1. Impulse function (figure 2.36) allows you to simulate power sources with
two states. For example, on / off or open / closed, etc. Time is expressed in second,
power in watts.
Parameter t0 specifies an initial displacement of the 0th point. In the case of a
positive value, the lag in the function graph is specified. When a negative value is
specified, time duration and parameter value F2 increase.
Parameter F1 specifies minimum value of the impulse.
Parameter F2 specifies maximum value of the impulse.
Parameter t1 specifies the time when the jump occurs relative to the stationary
nought (excluding t0).
Parameter t2 specifies a full period of the impulse.
39
.
Figure 2.36: Time dependent power source set by the impulse function.
1.2.2.2. Sinusoidal function (figure 2.37).

Parameter specifies the constant component in Watts.
Parameter B specifies the amplitude of power oscillations.
Parameter W determines the frequency of oscillation, where t - time in seconds.
Parameter df phase shift.
Figure 2.37: Time dependent power source set by sinusoidal function.
1.2.2.3. Sawtooth function (figure 2.38).
40
.
Figure 2.38. Time dependent power source set by the sawtooth function.
Parameters are analogous to the impulse function, the only change is in the
characteristic of the dependent variables. The peaks and troughs occur gradually without
any sudden changes.
1.2.2.4. Complex function (figure 2.39).
Figure 2.39: Time dependent power source set by the complex function.
This function represents itself as a more complex impulse function, here the
transition from a minimum to a maximum occurs gradually and not immediately.
41
.
The initial point is specified with t0 and F1 parameters. Next, the value of the power
increase to F2 during time t0 - t1. From t1 to t2, the values stay the same and equal to F2.
From t2 to t3, the values decrease until they reach F1 and stay constant again from t3 to t4.
1.3. Time dependent power source (table).

1.3.1. Select Analysis from the main menu, and then select Table (figure 2.40).
Figure 2.40: Selecting Table from the main menu.

1.3.2. When the tables window appears, right-click and select New Table (figure
2.41).
Figure 2.41: Adding a new table.
1.3.3. In the dialog window, specify the name of the table (figure 2.42).
42
.
Figure 2.42: Specifying the name of the table.
1.3.4. Fill in the table in accordance to the appropriate functional relationship

(figure 2.43).
43
.
Figure 2.43: Filling out the table.

1.3.5. Switch to the models nodes. Initial steps necessary for power source
selection entered with the table are similar to the steps specified in figures 2.31, 2.32, 2.33.
In the drop-down window, select Power Source Time-dependent (Table) (figure 2.44,
branch type number 102).
44
.
Figure 2.44: Time dependent power source selection entered with the
table.
1.3.6. In the drop-down box, choose appropriate table number (figure 2.45).
Figure 2.45: Window for selection of a table.

1.3.7. The power source is defined (figure 2.46).
Figure 2.46: Specified power source.
45
.
2.
Temperature source.
2.1.
Constant temperature source is set in the following way:
2.1.1. A special (base) node with a zero numeral is entered into the model.
2.1.2. Click on the
button to select the appropriate branch type (branch type
number 111).
2.1.3. The nodes are clicked sequentially: the intended temperature source is
selected first (node 1 in figure 2.47), and then the base node (node 0).
Figure 2.47: Constant temperature source selection

2.1.4. Select Temperature Source - Constant.
2.1.5. In the appearing dialog window, we specify the value of the temperature
(figure 2.48).
46
.
Figure 2.48: Use of the dialog window for inputting the value of the
temperature source
2.1.6. As a result, the constant temperature source is defined in the model (figure
2.49).
Figure 2.49: Constant temperature source of 200
2.2. Time dependent temperature source (function).

2.2.1. Initial steps necessary for selecting a temperature source with a function are
analogous to the steps shown in figures 2.47, 2.48, 2.49. But now we select Temperature
Source Time-dependent (Function) from the drop-down menu (figure 2.50, branch type
number 113)
47
.
Figure 2.50: Selecting time dependent temperature source with a function.
2.2.2. ASONIKA-T lets users to input several types of functions to define

temperature dependence from time: pulse, sinusoidal, sawtooth, and complex. Selection of
an appropriate type is done by clicking on the left mouse button in the Type of function
drop-down box and choosing from the (figure 2.51).
Figure 2.51: Time dependent temperature type selection.
Each function has its own set of characteristics. For a convenient definition, they are
shown as prototype graphs under the drop-down list or as a formula.
48
.
2.2.2.1. Impulse function (figure 2.52) lets the user model temperature source with
two states.
For example, on / off, open / closed, etc. The time is in seconds, the
temperature is in degrees Centigrade.

Parameter F1 specifies minimum value of the impulse.
Parameter F2 specifies maximum value of the impulse.
Parameter t2 specifies full period of an impulse.
Figure 2.52: Time dependent temperature source with an impulse function.

Parameter specifies the constant component of the temperature in degrees
Centigrade.
Parameter B specifies the amplitude of temperature oscillations.
Parameter W defines frequency of oscillations, where t is in seconds.
49
.
Figure 2.53: Time dependent temperature source with a sinusoidal function.
Figure 2.54: Time dependent temperature source with a sawtooth function.
The parameters are analogous to the ones in the impulse function. The only change
is in the type of dependence. The function values transition from the minimum to
maximum, without sudden jumps, gradually.
2.2.2.4. Complex function (figure 2.55)
50
.
Figure 2.55: Time dependent temperature source with a complex function.
increases to F2 during time t0 - t1. From t1 to t2, the values stay the same and equal to F2.
2.3. Time dependent temperature source (table).


2.57).
51
.
Figure 2.57 Adding a new table.
2.3.3. Specify the name of the table in the dialog (figure 2.58).
52
.
Figure 2.58: Entering the name of the table.
2.3.4. Fill in the table in accordance to the appropriate functional relationship

(figure 2.59).

2.3.5. Switch to the models nodes. Initial steps necessary for temperature source
selection with a table are similar to the figures shown in 2.47, 2.48, 2.49. Select
Temperature Source Time-dependent (table) in the drop-down menu (figure 2.60,
branch type number 112).
53
.
Figure 2.60: Selection of time dependent temperature source with a table.
2.3.6. Select the table number from the dialog window (figure 2.61).
Figure 2.61: Window used for selecting the table.
2.3.7. The temperature source is defined (figure 2.62).
Figure 2.62: Defined temperature source.
54
.
3. Heat Capacity.
3.1. Constant heat capacity is set the following way:
3.1.1. A special (base) node is entered into the model.
3.1.2. Click on the
button to select the branch type (branch type number 121).
3.1.3. The nodes are selected sequentially: the expected heat capacity first (node 1
in figure 2.63), then the base node (node 0).
Figure 2.63. Constant heat capacity selection.

3.1.4. Select Heat Capacity - Constant.
3.1.5. In the dialog window, specify the value of the heat capacity (figure 2.64).
Figure 2.64: Dialog window for setting heat capacity value.
55
.
3.1.6. The heat capacity is defined in the model (figure 2.65).
Figure 2.65: Setting heat capacity to 0.01 J/K.
3.2. Time dependent heat capacity (function).

3.2.1. Initial steps necessary for heat capacity selection are analogous to the figures
shown in 2.63, 2.64, 2.65. But now, we need to select Heat Capacity Time-dependent
(Function) from the drop-down menu (figure 2.66, branch type number 123)
Figure 2.66: Time dependent heat capacity set with a function.
3.2.2. ASONIKA-T lets users set several types of functions for the definition of heat
capacity dependence from time: pulse, sinusoidal, sawtooth, and complex. To select an
56
.
appropriate type, click on the Function Type drop-down box and choose one from the
list (figure 2.67).
Figure 2.67: Time dependent heat capacity selection.
Each function has its own set of characteristics. For convenient definition, they are
shown as a prototype graph under the drop-down list or as a formula.
3.2.2.1. Pulse function (figure 2.68) lets modelling heat capacity with two states.
For example on / off, open / closed, and so on. The time is set in seconds, the heat capacity
is in Joules per Kelvin.
Parameter F1 specifies a minimum value of the impulse.
Parameter F2 specifies a maximum value of the impulse.
Parameter t2 specifies the full period of the impulse.
57
.
Figure 2.68: Time dependent heat capacity with a pulse function

Parameter sets a constant component of the heat capacity in Joules per Kelvin.
Parameter B sets an amplitude of heat capacity oscillations.
Parameter W defines frequency of oscillations, where t is in seconds.
Figure 2.69: Time dependent heat capacity with sinusoidal function
58
.
Figure 2.70: Time dependent heat capacity set with the sawtooth function.
Parameters are analogous to the pulse function. Only character dependence is

different. The function transitions from the minimum value to the maximum and vise versa
gradually and not suddenly.
3.2.2.4. Complex function (figure 2.71)
Figure 2.71: Time dependent heat capacity set with the complex function.
59
.
increases to F2 during time t0 - t1. From t1 to t2, the values stay the same and equal to F2.
3.3. Time dependent heat capacity (table).


2.73).
Figure 2.73: Adding a table.
60
.
3.3.3. Enter the name of the table in the dialog window (figure 2.74).
Figure 2.74: Entering the name of the table.
3.3.4. Fill out the table in accordance with the appropriate dependence relationship
(figure 2.75).
61
.

3.3.5. Switch to the models nodes. Initial steps necessary for heat capacity
selection are analogous to the steps shown in figures 2.63, 2.64, 2.65. In the drop-down
menu, select Heat Capacity Time-dependent (Table) (figure 2.76, branch type number
122).
62
.
Figure 2.76: Time dependent heat capacity set by a table.
3.3.6. In the dialog window, choose the number of the table (figure 2.77).
Figure 2.77: Window for table selection.
3.3.7. The heat capacity is defined (figure 2.78).
63
.
Figure 2.78: Defined heat capacity.
3.4. Calculated heat capacity.

3.4.1. Select heat capacity according to figures 2.63, 2.64, 2.65. In the drop-down
menu, select Heat Capacity - Calculated (figure 2.79, branch type number 124).
Figure 2.79: Calculated heat capacity selection

3.4.2. Fill out all necessary parameters in the dialog window which will appear. The
calculated heat capacity is specified by the discrete volume, material density, and specific
heat capacity (figure 2.80).
64
.
Figure 2.80: Entering calculated heat capacity parameters
3.4.3. The calculated heat capacity is defined (figure 2.81).
Figure 2.81: Calculated heat capacity in the model
2.6. Demonstration of different power sources
The following model will be used as the basis of the demonstration shown in figure
2.82.
65
.
Figure 2.82: Thermal processes model available for demonstration in the subsystem
Time-dependent power types in ASONIKA-T. Node 1: constant power source of

0.5W; node 3: time-dependent power source set with pulse function; node 4: timedependent power source set with sinusoidal function; node 5: time-dependent power
source set with sinusoidal function (in out-of-phase to node 4); node 6: time-dependent
power source set with sawtooth function; node 7: time-dependent power source set with
complex function.
As a result, we get power vs. time plot shown in figure 2.83.
66
.
Figure 2.83: Power vs time plot constructed in accordance with the model shown in
figure 2.82.
2.7. Example of thermal modeling a floor cabinet

Purpose to determine the average temperatures of printed circuit assemblies
(PCA) and the design of the radio-electronic cabinet as a whole.
Initial data design drawings and the bill of materials which play an important role
in thermal analysis were obtained as initial data for calculation purposes.
One-story radio-electronic cabinet consists of three blocks BP, F, and FM shown in
figure 2.84.
67
.
BP
FM
Block F
Block BP
Block FM
Figure 2.84: One-story radio-electronic cabinet design
The main heat generating components were identified, and the power source for
block F was set to the following values:
1. PCA FK 1.235W;
2. PCA ANP 0.806 W.
The power dissipated by the blocks BP and FM are 0.6 and 2 W respectively.
For calculation purposes, the ambient temperature was set to +52. The cabinet
design is surrounded by air.
2.7.1. Analysis of thermal processes
Based on the data received, the model of thermal processes (MTP) for a radioelectronic cabinet was built and is shown in figure 2.84.
The model (see figure 2.85) has the following nodes:
Block BP:
1 left wall of the enclosure;
2 right wall of the enclosure;
3 top wall of the enclosure;
4 bottom wall of the enclosure;
5 front wall of the enclosure;
68
.
6 back wall of the enclosure;

7 printed circuit assembly;
8 ambient environment;
26 air inside the block, to the left of the printed circuit assembly;
27 air inside the block, to the right of the printed circuit assembly.
b)
69
.
)
Figure 2.85: Model of thermal processes of a radio-electronic cabinet (Block F, Block
FM, Block BP)
Block F:
15 PCA ANP;
16, 17 aluminum layer between printed circuit assemblies;
18 PCA FK;
28 air inside of the block, to the left of PCA ANP;
29 air inside of the block, to the right of PCA FK.
Block FM:
70
.

25 printed circuit assembly.
The model of the cabinet enclosure is represented as follows.
The walls of the enclosure in block BP interact with each other through conductive
heat transfer, creating branches 1-3, 1-4, 1-5, 1-6, 2-3, 2-4, 2-5, 2-6, 3-5, 3-6, 4-5, 4-6. In
addition, node 7 interacts with the front, back, top, and bottom walls through conduction.
All walls of the enclosure, except for the right wall, interact with the ambient environment
through radiation and convection, creating branches 1-8, 3-8, 4-8, 5-8, 6-8. Printed circuit
assembly interacts with the left and right walls through radiation, creating branches 7-1, 72. Printed circuit assembly interacts through convection with the air inside the block,
creating branches 1-26, 3-26, 4-26, 5-26, 6-26, 7-26, and 2-27, 3-27, 4-27, 5-27, 6-27, 727.
The relevant nodes are connected with branches, representing themselves as a power
source (7-0) and a temperature source (8-0).
The walls in block F interact with each other through conductive heat transfer,
creating branches 9-11, 9-12, 9-13, 9-14, 10-11, 10-12, 10-13, 10-14, 11-13, 11-14, 12-13,
12-14. In addition, nodes 15, 16, 18 interact with the front, back, top, and bottom walls
through a conductive branch. Beside the left and the right walls, the walls of the enclosure
interact with the ambient environment through radiation and convection, creating branches
11-8, 12-8, 13-8, 14-8.
PCA ANP interacts with PCA FK through an aluminum layer with a conductive
branch, creating branches 15-16, 17-18.
PCA ANP interacts with the left wall through radiation, creating branch 9-15.
PCA ANP interacts with the air inside the block through convection, creating
branches 9-28, 11-28, 12-28, 13-28, 14-28, 15-28.
PCA FK interacts with the right wall through radiation, creating branch 18-10.
PCA FK interacts with the air inside the block through convection, creating
branches 10-29, 11-29, 12-29, 13-29, 14-29, 18-29.
71
.
The relevant nodes were connected with branches representing themselves as power
sources (15-0, 18-0).
The walls of the enclosure in block FM interact with each other through a
conductive heat transfer, creating branches 19-21, 19-22, 19-23, 19-24, 20-21, 20-22, 2023, 20-24, 21-23, 21-24, 22-23, 22-24. In addition, node 25 interacts with the left wall
through a conductive branch. All walls of the enclosure, except for the left wall, interact
with the ambient environment through radiation, creating branches 20-8, 21-8, 22-8, 23-8,
24-8. Printed circuit assembly interacts with the right wall through radiation, creating
branch 25-20.
Node 25 was connected with a branch representing itself as a power source (25-0).
The blocks are connected with each other by conductive branches: 2-9 (blocks BP
and F), 10-19 (blocks F and P12-II).
2.7.2. Simulation results

Thermal processes modeling were carried out at an ambient temperature of + 52 .
As a result of the simulation, the temperature values in the nodes of the model were
obtained:
Node number
Name
Temper
Node
ature
number
Name
Tempe
rature
deg.
deg.
BLOCK BP
1
left wall
68
right wall
69
top wall
68
bottom wall
68
front wall
68
back wall
68
printed
72
ambient
52
26
circuit
27
environment
72
.
assembly
air inside the

69
block, to the
right of the
70
printed
circuit
assembly
BLOCK F
9
left wall
69
10
right wall
69
11
top wall
69
12
bottom wall
69
13
front wall
69
14
back wall
69
15
PCA ANP
70
16
left side of
17
right side of
70
the
28
aluminum
69
aluminum
18
layer
29
PCA FK
70
layer
air inside the
air inside the
block, to the
107
block to the
right of the
70
left of the
PCA FK
PCA ANP
BLOCK P12II
left wall
71
20
wright wall
69
21
top wall
68
22
bottom wall
69
23
front wall
69
24
back wall
69
25
printed
71
19
circuit
assembly
73
.
2.7.3. Results
As a result of these calculation, the initial data (boundary conditions) were obtained
for further analysis of the temperatures of radio-frequency components as part of printed
circuit assemblies of ANP and FK: 69 and 70 deg..
Comparison with the experiment shows that the error from modelling comes withing
2 deg. or 3 % (calculated temperature of the enclosure 68 deg., experimental - 66
deg.).
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.
3. SYSTEM ADMINISTRATOR'S GUIDE
3.1. Structure and launch of ASONIKA-T
Subsystem ASONIKA-T is located in ASONIKA-T directory and can be located on

any disk. The structure of the directory is shown in figure 3.1.
Figure 3.1: Directory structure of ASONIKA-T subsystem
The source data and results are located in Data directory.

Documentation related to ASONIKA- subsystem is located in Doc subdirectory. In
subdirectory Help, we can find help files which are called within the subsystem.
To launch ASONIKA-, enter into ASONIKA- catalog and load TeRa.exe file.
3.2. Saving the project
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.
If it is necessary to save a project and transfer it to another machine, then we need to

enter into Data directory and copy 2 files with the name of the project and .dat and .spt
extensions. Lets say the project has a name Primer. Then we need to save Primer.dat and
Primer.spt files in the Data directory. The file of results will be saved with .rez extension.
4. BASIC PRINCIPLE METHODS OF CONSTRUCTION OF THERMAL

MODELS
76
.
4.1. General information

In the study of REM temperature fields1, the method of electrothermal analogy
(ETA) is considered as the most common. This is due to the fact that calculation methods
for electric circuits have been advanced the most.
The essence of the ETA method comes from the arrangement of equivalent
electrical circuits which model the effects of heat transfer2 or aerodynamics of the object
models of thermal processes [4] and models of aerodynamical processes (P) [5] of the
object, and calculations of these circuits with the methods developed for complex
electrical circuits. This method is also called a grid.
The component is conditionally broken into isothermal volumes. This form of
isothermal volumes can be represented as, for example, RFC, a design element of a
component, in which it is necessary to determine the temperature, air volume inside the
block, ambient environment, the set of elements of the component, REM block as a whole,
part of an element, and so on. The partition depends on the design of the analyzed object,
the accuracy of calculated temperatures, the assumptions made for the analysis of heat
transfer processes in the component, and so on.
The selected arbitrary isothermal volumes are represented as nodes of an electric
circuit. The greater the number of these isothermal volumes, the more accurate the model
of true temperature values will be in the component. However, this would increase the
size of the resulting electrical circuit.
Among these arbitrary isothermal volumes, we can select volumes with thermal
interactions. These include:
bordering volumes of one solid body (conduction3);
volumes, interacting through air (free convection in a confined space4) [6];
volumes in a radiant heat transfer (radiation5);
1
An REM temperature field consists of temperature values of its RFC as well as the temperature of different design
components, air inside the apparatus, and so on. The set of values of these temperatures defines a thermal condition
of an REM.
2
Heat transfer theory the science of heat propagation processes. There are three distinct types of heat transfer:
conduction, convection, and radiation.
3
Theory of heat transfer (conduction) called molecular transport of heat in a continuous medium.
4
Free convection in a confined space is usually considered by analogy with the transfer of heat by conduction.
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.
the volume of the solid body and the volume of the surrounding air
(convection6);
volumes of two solid bodies which are in contact (heat conduction through
contact) and so on.
Electrical circuit nodes which correspond with the interacting volumes, are
connected with each other with electrical resistors which represent thermal resistances that
correspond to the type of the heat exchange between these volumes.
If thermal energy is dissipated in a certain volume, then the current source is
included in the corresponding node of the electrical circuit.
For example, if a certain isothermal node has thermal dissipation power of 15 W,
then the current source of 15 A is included in the corresponding node of the electrical
circuit.
If for a certain node the temperature is given, then the voltage source is included in
the corresponding node of the electrical circuit. For example, for an isothermal volume of
the block with a 30 degree Celsius, there will be a corresponding node of the electrical
circuit with a 30 W voltage source.
The heat capacity of the selected volume is modeled using electrical capacitance.
This is how we get electrical diagrams that model thermal processes of the specific
component design.
When modeling aerodynamic processes, it is also possible to use the analogy of
aerodynamic and electrical processes.
Thus, wind resistance similar to the electrical resistance, square air flow - current
source, pressure - voltage source. Thus, it is possible to construct an aerodynamical REM
design model in the form of an electrical circuit or in the form of aerodynamic circuit,
which is more understandable for specialists working in this field.
For convenience, we represent these electrical diagrams in the topological form (as a
graph) and refer to them as model of thermal processes or model of aerodynamic
Thermal radiation the process of propagating heat with electromagnetic waves.
Convection is the type of heat transfer through the moving fluid (gas or fluid) in space. The heat exchange
between the fluid or gas and the surface of the solid body is referred as convective heat transfer or heat exchange.
5
6
78
.
processes. Meanwhile electrical resistors which represent heat exchange processes, will be
referred as thermal resistances; current sources thermal power sources; voltage sources
temperature sources; electrical resistors which represent aerodynamic processes
aerodynamic drag.
The possibility of such an interpretation follows from the analogy of thermal and
aerodynamic processes in the designs and electrical processes of the corresponding
electrical circuits.
Thus, by a thermal (aerodynamic) process we mean an undirected topological graph
whose nodes correspond to certain volumes of an REM design, while the branches of a
graph represent thermal (air) flows between these objects.
The node variables of the graph are temperature volumes (thermal models) of
elements or air and pressure at the points (aerodynamic models), while the branch
variables the magnitude of the heat flux in the design and the airflow in the REM
channels.
Branch parameters the essence of thermal and aerodynamic resistances. In other
words, MTP or MAP represents an idealized diagram of the propagation pathways of
thermal and air flows in the design. Depending on the degree of the heat exchange
processes idealization, the structure of the model can be changed.
4.2. "Heated zone" and the principle of local influence
When building MTP components, the main difficulty lies in locating points in the
component that would maintain the accuracy of modelling while keeping the complexity
of the MTP (the number of nodes) within reasonable limits. To do this, we first idealize
(simplify) heat exchange processes in the component:
we do not take into account peripheral types of heat transfer in the component
design (i.e. discard minor thermal branches between MTP nodes);
79
.
justify and provisionally accept some or the other body groups (parts, elements)
as isothermal.
In the theory of heat transfer, such provisionally isothermal volume, which includes
several bodies, is referred as the hot zone. Introduction of heat zones simplifies
construction of MTP and reduces preparation of initial data necessary for analysis.
Lets consider the cases in which it is possible and appropriate for thermal analysis
to combine elements into a heated zone provisionally homogeneous body with a defined
volume-averaged temperature.
First of all, it makes sense to do this for approximate analysis when there is no need
for a detailed picture of the temperature field on the elements of the component. Instead,
only the knowledge of average values of elements is sufficient. Most existing methods and
norms of REM thermal process analysis are built with regard to this principle.
If a portion of elements is combined into the heat zone while another portion is
modeled with the finite element method, then the validity of the use of combination of
these two methods defines the principle of local influence or stability of the heat flux
property.
According to this principle, any local redistribution pattern of the temperature field
is considered local and does not propagate to other parts of the field.
Suppose, for example, a group of parts with different configurations is located on
the printed circuit board and dissipates some power. This group of parts will cause the
same increase in temperature in separate regions of the block as an evenly distributed
power source of the same capacity. In addition, the temperature field, within the vicinity of
parts, can be strongly dependent from the dimensions and configuration of the printed
circuit board.
Specially conducted studies have shown that the configuration of the region
occupied by the energy sources practically does not influence on the temperature field in a
block away from the center of the region of the same order as the maximum size of this
region.
80
.
A region where the temperature field parameters depend on the configuration of the
region energy sources, we refer as the domain of configured influences of the power
source.
4.3. Designation of MTP branches
As was said earlier, an MTP is shown in the form of a graph. To represent MTP
elements which designate different heat exchange processes in the component design, we
will use provisional graphical representation (table ** Appendix).
To represent MTP branches, we will apply the following rules:
1. An MTP branch between nodes i and j, for example, type 16 is represented like
this:
The only exception will be made for mass transfer branches, since they describe the
direction of the process (type 71,72), for example, mass transfer from node i to node j
for the airflow inside the duct (branch type number 71) will be represented like this:
2. Sometimes, the nodes have the same numbers for different segments of the same
MTP. This means that we are talking about the same node, and the partition into segments
is done for reasons of clarity. The following three entries are equal:
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.
4.4. Properties of models in different coordinate systems
In a rectangular coordinate system (c.s.), used earlier, an isothermal volume is a

rectangular volume, the properties of which are concentrated at its center the MTP node
(figure 1.1), its coordinates (x/2, y/2, z/2), where x, y, z the size of the partition. In a
cylindrical coordinate system, the isothermal volume of a round body will be a round
hollow cylinder7 (ring) (figure 1.1b) with dimensions Dmax, Dmin, thickness z, the
properties of which are concentrated in a circumference8 of the diameter
D = (Dmax + Dmin) / 2,
(1)
i.e an MTP node will represent a circumference with a given diameter.
Figure 1.1. Forms representing isothermal volumes and MTP nodes in: a) rectangular, b)
cylindrical, c) spherical coordinate systems
In a spherical coordinate system, an isothermal volume of a round body is

represented by a round hollow ball9 (figure 1.1c). Its properties are concentrated in a
sphere10 with the diameter defined by the formula (1).
Cylinder a geometric body, formed by a revolving rectangle around one of its sides.
Circumference a closed plane curve with all of its points equidistant from its center.
9
Ball a geometric solid obtained by rotating a circle around its diameter. The ball is bounded by a sphere.
7
8
82
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5. MODELS OF THERMAL PROCESSES FOR STANDARD DESIGNS AND REM

ELEMENTS
5.1. Constructing an MTP plate with a heater of P power on one of the sides
Lets consider the construction of an MTP as a plate example with the heater of
power P on one of the sides (right), located in air with T temperature (figure 2.1).
Figure 2.1: A plate with a P power heater located in the ambient environment of
temperature
Such an element can be reduced to a PCA with RFCs located on one of the sides
which dissipate the total power .
10
Sphere a closed surface with all points equidistant from one point the center of the sphere.
83
.
We partition this solid body into four volumes of an orthogonal grid with the
number of squares 2, 1, and 2 respectively along the , Y, and Z axes (figure 2.2).
Figure 2.2: A plate, partitioned with a 2*1*2 grid along the , Y, and Z axes respectively
When choosing the number of grid partition lines, we did not take into account the
accuracy of the thermal process modelling in the plate.
In accordance with the accepted discretization, four nodes are defined in the
constructed MTP: 1, 2, 3, and 4, modelling the center of lower-left, upper-left, upper-right,
and lower-right quarter of the plate respectively.
The interacting volumes (nodes) 1 and 2, 2 and 3, 3 and 4, 1 and 4 are connected
with thermal resistances. These branches model conductive heat transfer (thermal
resistance of a conductive heat transfer) between corresponding volumes of the plate (they
are represented as number 2 in figure 2.3).
Figure 2.3: MTP of a plate placed in the air (stationary mode)
84
.
The right side of the plate dissipates power . Since nodes 3 and 4 reside on this
plane, then thermal power sources depicted in figure 2.3 will be attached to these nodes in
the form of branches which are numbered as 101.
Four faces of each volume interact with an embient environment, transferring heat
through convection and radiation. Therefore, four pairs of branches numbered 16 and 26
are added to the MTP. These branches model convective and radiattive heat transfer from
the surface of corresponding volumes to the surrounding environment (node 5). The given
temperature of the ambient environment is modeled by adding a temperature source to
node 5 shown in figure 2.3 in the form of a branch with type number 111.
If we change the number of selected arbitrarily isothermal volumes of the analysed
plate by splitting the grid into 2*1*1 along the X, Y, and Z axes, then we get a simplified
MTP of a plate (figure 2.4)
Figure 2.4: Simplified MTP of a plate placed in the air (stationary mode)
In the figure:
node 1 left half of the plate;
node 2 right half of the plate;
node 3 ambient environment with a given temperature .
For a transient analysis of a thermal process1, branch 121 is added to nodes 1 and 2
which represents heat capacity of corresponding node volumes (figure 2.5).
Transient thermal process - unsteady, changes with time.
85
.
26
16
3
2
2
121
26
16
101 121
3
T
111
Figure 2.5: Simplified MTP of a plate placed in air (transient mode)
5.2. Thermal process model of a transistor

We construct an MTP of a transistor place in air with temperature of 250C. The
transistor output power of 1 W.
Idealize the heat transfer processes in the body:
assume the crystal of the transistor is isothermal;
assume the enclosure of the transistor is isothermal.
When constructing an MTP of a transistor, we divide into 2 arbitrary isothermal
volumes: the crystal of the transistor (node 1 in MTP) and the enclosure of the transistor
(node 2 in MTP). The ambient environment will be represented as node 3.
Thermal energy, dissipated in the crystal of the transistor (node 1), through an
internal thermal resistance (branch 1-2 type 01) of a transistor is transferred to the
enclosure of the transistor (node 2).
Thermal resistance for a transistor of this type of heat transfer is given in the
reference literature as an internal thermal resistance from junction to case. Next, the part of
the thermal energy with an open surface of an enclosure of a transistor is transferred to the
ambient environment (node 3) through convection (branch 2-3 type 26) and radiation
(branch 2-3 type 16). In the example file, the input data whose dimensions are equal to the
area of the radiating surface and the area of the heat transfer surface, enveloped with air,
the lateral surface of the transistors enclosure is not considered due to small size. In
addition, branch 2-3 with type 26 is entered twice and models convection from the upper
and lower surface of the transistors enclosure. Since thermal energy is emitted from the
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.
crystal of the transistor, we add a thermal power source of 1 W to node 1 of an MTP. We

add a given temperature source of 250C to node 3 corresponding to the ambient
environment. As a result, we get an MTP of a transistor which is placed in air (stationary
mode) (figure 2.6).
1
26
16
101
111
Figure 2.6: MTP of a transistor placed in the ambient environment (stationary mode)
If we want to conduct transient thermal analysis, then we add branches which model
heat capacity of the transistors enclosure and the p-n junction (branches 1 - 0, 2 - 0 type
121). As a result, an MTP of a transistor placed in air (transient mode) is shown in figure
2.8.
2
1
101 121
26
16
121
111
Figure 2.8: MTP of a transistor placed in ambient environment (transient mode)
5.3. Thermal process model of a transistor mounted on the radiator
We construct an MTP of a transistor mounted on a plate radiator. The radiator, with

a one-sided fin, is placed on the side where there is no fin. The radiator is placed in the
ambient environment with temperature of 350C. The transistor emits thermal power of 8
W.
87
.
We idealize the heat transfer process of the design:

assume the crystal of a transistor is isothermal;
assume the enclosure of the transistor is isothermal;
assume the radiator of the transistor is isothermal.
When idealized, heat transfer processes can be represented the following way.
Thermal energy dissipated by the crystal of the transistor (node 1), through internal
thermal resistance (branch 1-2 type 01) of the transistor, is transferred to the enclosure of
the transistor (node 2). Then, the part of thermal energy with an open surface of the
transistors enclosure is transferred into the ambient environment through convection
(branch 2-3 type 26) and radiation (branch 2-3 type 16). Another part of thermal energy
with the transistors enclosure is transferred to the transistors radiator (node 4) through
contact thermal resistance between the enclosure of the transistor and the radiator (branch
2-4 type 11). With a smooth surface of the radiator, thermal energy is transferred to the
ambient environment through convection (branch 4-3 type 26) and radiation (branch 4-3
type 16). In the example file, the input data whose dimensions are equal to the area of the
radiating surface and the area of the heat transfer surface, enveloped with air, the lateral
surface of the transistors enclosure is not considered due to small size. With fins placed
on the surface, the thermal energy is transferred to the ambient environment through a
convective-radiative heat transfer (branch 4-3 type 36). As a result, thermal interaction of
four arbitrary isothermal volumes is shown: the crystal of a transistor, the enclosure of the
transistor, the radiator, and the ambient environment.
Since the crystal of the transistor emits thermal energy, we add a thermal power
source of 8 W to node 1 of the MTP. For node 3, which corresponds to the ambient
environment, we add a temperature source of 350C. As a result, we get an MTP of a
transistor mounted on a radiator (stationary mode) (figure 2.9).
88
.
3
26
1
111
16
26
16
11
101
36
Figure 2.9: MTP of a transistor mounted on a radiator (stationary thermal mode)
If we want to conduct analysis for transient thermal type, then we add branches
which model thermal capacity of the radiator, the enclosure of the transistor, and the p-n
junction - branches 1 - 0, 2 - 0 type 121 and 4 - 0 type 124 (figure 2.10).
3
26
1
121 101
121
111
16
26
16
11
4
124
36
Figure 2.10: MTP of a transistor mounted on a radiator (transient thermal mode)
In the example file, the source data for transient mode has four 4-0 branches type
124, modeling thermal capacity of each fin of the radiator, and one 4-0 branch type 124,
modeling thermal capacity of the radiators base.
5.4. Thermal process model of an air channel (air-duct)

Lets construct an MTP of an air channel (air-duct) (figure 2.11).
89
.
Figure 2.11: Air channel with a mounted thermal source element - SPS
A secondary power supply (SPS) with a power source of 10 W (thermal source

element) is mounted with a heat-removing layer on one of the walls of the channel. The
temperature of the air at the inlet of the channel is 200C, average velocity of the airflow
1 m/s.
We idealize the process of heat transfer of the design:
assume each wall of the channel to be isothermal along the length as well as the
width;
assume the thermal source element is isothermal;
thermal energy is emitted on the enclosure of SPS, i.e. internal thermal resistance
is 0;
the air along the length of the channel will be split into two isothermal volumes
with air temperature of the inlet channel and the air temperature of the outlet.
When idealized, heat transfer processes can be presented in the form of a model
(figure 2.12, table 2.1).
Table 2.1
MTP of an air-duct nodes
#
Element
Element
lower wall of the channel
upper wall of the channel
Ambient environment, air at the
right side wall of the channel
90
.
inlet of the channel

3
air at the outlet of the channel
left side wall of the channel
7
2
11
2
3
71
101
6
2
1
26
61
61
thermal source element
16
1,4,5,6,7
111
1,4,5,6
Figure 2.12: MTP of an air channel (air-duct)
The process of a mass transfer in the channel is modeled with branch 2-3 type 71.
Thermal energy is transferred in the channel from the walls of the channel to the airflow
through forced convection, thus increasing its thermal content.
To account for this process, we assume that the forced convection occurs in the first
half of the area from the walls of the channel to the second node (branches 1-2,4-2,5-2,6-2
type 61), and from the second half to the third node (branches 1-3,4-3,5-3,6-3 type 61).
Thermal energy is emitted from the thermal source element. Therefore we add
thermal power source of 10 W to node 7. For node 2, which corresponds to the ambient
environment, we add temperature source of 200C.
In addition, each wall of the channel (nodes 1, 4, 5, 6), as well as the thermal source
element (node 7) interacts with the ambient environment (node 2) through natural
convection and radiation (branches 1-2, 4-2, 5-2, 6-2, 7-2 type 16 and type 26).
5.5. Thermal process model of a sealed REM block
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.
Consider construction of an MTP of a sealed REM block (figure 2.13).
Figure 2.13: Drawing of an REM block

Dimensions of the block: length 250 mm, width 200 mm, height 300 mm. The
thickness of the block 4 mm. Thermal conductivity of the block enclosure 121
W/m*K, emissivity coefficient 0.4. Irradiation coefficient will be 0.8 everywhere.
A printed circuit board with radio-elements placed on its right side is attached inside
the metal enclosure. Thermal power of 7 W is uniformly dissipated by radio-elements
along the area of the printed circuit board. Distance from the left side of the housing block
to the printed circuit board is 5 mm. The dimensions of the printed circuit board are such
that the air volumes inside the blocks left and right sides do not touch each other. The
emissivity coefficient of the printed circuit board 0.76. The thickness of the printed
circuit board 2 mm.
A transformer dissipating thermal power of 4W is placed on the right side of the
block and is attached to the blocks base. The dimensions of the transformer: length - 30
mm, width 30 mm, height 50 mm. The emissivity coefficient for the transformer
0.78. KPT-8 lubricant is used to attach the transformer.
The block is placed in the ambient environment with temperature of 300C. We need
to construct an MTP to be able to conduct analysis of overall temperatures for a printed
circuit assembly and a transformer.
92
.
Since the distance from the left side of the housing block to the printed circuit board
is 5 mm, we conclude that the air convection does not develop in such gaps with closed
vertical interlayers. Therefore, this air volume can be considered as a thin air gap.
We idealize thermal transfer processes of the block:
assume each housing wall of the block to be isothermal;
assume air volume inside the block and to the right of the circuit board to be
isothermal;
the printed circuit assembly and the transformer are within the zone of a
configurational influence from each other due to a small distance between one another;
since the thermal power of a printed circuit assembly is uniformly dissipated along the
area and a detailed temperature field is not necessary, to simplify the process of
constructing an MTP, we represent the printed circuit assembly in the form of a heated
zone;
we do not take into account thermal transfer from the printed circuit assembly to
the enclosure of the block through the mounting elements of the printed circuit assembly.
Taking into account such idealizations of thermal processes of an REM block, we
arbitrarily divide into 10 isothermal volumes which correspond to 10 nodes of MTP (see
table 2.2).
Table 2.2
MTP nodes of a sealed REM block
#
Element
Element
Housing wall: left
right side
side
2
upper side
printed circuit assembly
front side
Transformer
bottom side
air to the right of a printed

circuit assembly
back side
10 ambient environment
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.
Since the resulting MTP of an REM block is quite complicated, we represent the
model in fragments.
Each face of the housing interacts with four neighboring faces (branches: 1-2, 1-3,
1-4, 1-5, 2-6, 3-6, 4-6, 5-6, 2-3, 3-4, 4-5, 5-2 type 02) (figure 2.13). An outer surface of
each face interacts with the ambient environment through convection and radiation (pairs
of branches 1-10, 2-10, 3-10, 4-10, 5-10, 6-10 types 26 and 16) (figure 2.14).
Figure 2.14: MTP of a sealed REM block
Since the representation of these pairs of branches is identical, for simplification we

only show a part of them in the figure. The inner surfaces for right, upper, front, back, and
bottom faces of the block interact with air inside the block (branches: 2-9, 3-9, 4-9, 5-9, 69 type 26) (figure 2.14).
The printed circuit assembly interacts with the left face of the blocks housing
through a thin air gap (branch 7-1 type 41), convection with air inside the block (branch 79 type 26), radiation with a transformer (branch 7-8 type 16) (figure 2.14). In addition, the
printed circuit assembly interacts with all faces of the block housing through radiation
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.
(branches: 7-1, 7-2, 7-3, 7-4, 7-5, 7-6 type 16) (figure 2.14). The transformer interacts with
the air inside the block through convection (branch 8-9 type 26, we take the dimensions
for the equivalent total area of the horizontal plate 100 mm x 69 mm), with lower face of
blocks housing through contact resistance (branch 8-4 type 11, the contact area through 4
legs equals 4 5 mm 5 mm = 100 mm) (figure 2.14), with upper, front, lower, back, and
right faces of the blocks housing through radiation (branches: 8-2, 8-3, 8-4, 8-5, 8-6 type
16) (figure 2.14).
The emission of thermal energy by the elements of the printed circuit assembly and
the transformer is modeled by adding thermal energy sources to the corresponding nodes 7
and 8 (figure 2.14). The temperature of the ambient environment is modelled by adding a
temperature source to node 10 (figure 2.14).
Recommendations when entering parameters with the graphical user interface.
1. Since node 10 needs to be added right after node 6 (ambient environment), while
the program wont allow skipping models nodes, we need to add nodes 7, 8, 9 and place
them below for further use.
2. In order to add a thin air gap (branch 7-1 type 41), we need to select Complex
Heat Transfer (Heatsink) Convective-conductive Flat Air Layer.
Below, we show results for a stationary mode:
Table 2.3
Table of temperatures of MTP nodes
Node number
Node name
Temeprature
left
36.7
upper
35.3
front
35.7
bottom
37.5
95
.
back
35.7
right
36
PCA
42.9
transformer
39.2
air to the right of the PCA 37.8
10
ambient environment
30
5.6. Thermal process model of a perforated REM block
Consider an MTP of a perforated REM block. The lower and upper faces of the
blocks housing are perforated. The air is blown with the speed of 1 m/s. The rest of the
design is unchanged (figure 2.13). We construct an MTP of a block with natural
ventilation.
Thermal processes of a perforated block differ from the block which is sealed.
When perforation is present, the cold air enters through the lower perforated holes of the
block. Receiving thermal energy, dissipated by the elements of the block, the air increases
its enthalpy. Its density decreases, and under the influence of a forced load the air is
carried through the upper perforated holes of the blocks housing. In its place, cold air
enters from the ambient environment and receives thermal energy from the elements of the
block and then again leaves through the upper holes and so on. As a result, due to the
leakage of air, thermal energy will leave the block. In an MTP, this process is modelled
with the direction to the MTP node, corresponding to air inside the block, by the branches
that model the exit of thermal energy in the airflow of the channel (type 71).
The quantity of thermal energy leaving the block depends on the temperature
increase of the air that is passed through the corresponding part of the block. Therefore,
when referring to this branch, we indicate the number of an MTP node which modeled the
previous air volume. The previous, for the one which is considered from the rest of the
provisionally isothermal volumes, is the one which flows into the current volume. In our
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.
case, for the volume of air inside the block, the previous volume is the air of the ambient
environment which enters the block.
We idealize thermal processes of the block:
assume each face of the blocks housing to be isothermal;
assume the printed circuit assembly to be isothermal;
assume the transformer to be isothermal;
we dont take into account the heat transfer from the printed circuit assembly to
the housing of the block through mounting elements;
the air passing through the part of the block from the right and the left from the
printed circuit assembly will be assumed to be isothermal within the lower half of the
block with temperature equal to the temperature of the previous air volume (i.e. ambient
environment) and assumed to be isothermal within the upper half of the block with
temperature equal to the temperature of the air exiting from this part of the block.
The MTP of a perforated REM block is presented with separate fragments. Figure
2.15 depicts interactions of housing faces with each other (analogous to an example shown
in figure 2.14). Figure 2.15 shows interaction of each housing face with the ambient
environment through convection and radiation (analogous to an example presented in
figure 2.14).
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Figure 2.15: MTP of a perforated REM block
The transformer is connected with every wall (with the exception of the left wall)
through radiation as well as with the printed circuit assembly (branches 8-2,3,4,5,6,7 type
16) (figure 2.15) and through contact resistance with the base (branch 8-4 type 11, where
the area of contact through 4 legs equals 4 5 mm 5 mm = 100 mm) (figure 2.15). The
printed circuit assembly interacts with all faces of the blocks housing (branches: 7-1, 7-2,
7-3, 7-4, 7-5, 7-6 type 16) (figure 2.14). Branch 71 which is between the air at the blocks
inlet and outlet to the right and left of the printed circuit board models the heat transfer
inside the perforated block (branches 11-9 and 11-10 type 72) (figure 2.15). The left wall
of the block and the left part of the printed circuit assembly interact with the air in the
lower part of the block through the forced convection in the air channel (branches 11-1,117 type 61) (figure 2.15). The right side of the printed circuit assembly and the transformer
interact with the air in the lower part of the block through forced convection with the flat
(undeveloped) surface in the ambient environment (branches 11-7, 11-8 type 51) (figure
2.15). The left side of the block and the left part of the printed circuit assembly interact
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with the air at the outlet to the left through forced convection in the air channel (branches
10-1,10-7 type 61) (figure 2.15). The right part of the printed circuit assembly interacts
with the air at the outlet to the right through forced convection with the flat (undeveloped)
surface in the ambient environment (branch 7-9 type 51) (figure 2.14).
Table 2.4
MTP nodes of the perforated REM block
#
Element
Element
Housing: left face
upper face
Transformer
front face
air at the outlet, to the right of the

lower face
10
air at the outlet of the channel
back face
11
ambient environment, air in the lower

part of the block to the right and left of
the PCA
6 right face
Recommendations when working with the model using graphical user interface
1. Since node 11 (ambient environment) needs to be added after node 6 and you
cannot skip node numbers, we need to add nodes 7, 8, 9, 10 and place them below for
further use.
2. To add a vertical air channel (branch 7-1 type 48), select Natural Convection
Between Two Undeveloped Surfaces Vertical.
3. To add a forced convection inside the air channel (the channel can be partitioned
into parts) (branches 11-1, 11-7, 1-10 7-10 type 61), select Convection Inside Duct
Air Duct, Partitioned.
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.
4. To enter a forced convection with a flat (undeveloped) surface with the ambient
environment (branches 11-7, 11-8, and 7-9 type 51), select Air Cooling Undeveloped
Flat Surface.
Below, we give results for a steady-state mode:
Table 2.5
Temperature table in MTP nodes
Node number
Node name
Temperature
left
32.6
upper
32.4
front
32.7
bottom
34.4
back
32.7
right
36.9
PCA
35.4
transformer
36.1
air at the outlet to the 35.4

right of the PCA
10
air at the outlet of the 34

channel
11
ambient environment
30
100
.
5.7. Cartridge design of an REM block as a standard design element
We will assume that one of the main features of the cartridge design will be the
presence of PCAs or what are sometimes called cartridges which are inserted vertically
and parallel to each other inside the blocks housing (figure 2.16).
Figure 2.16: REM block (the front wall provisionally not shown) a) cartridge design, b)
stack design
A stack design is a form of a cartridge design which is placed on a lateral side, i.e.
the PCAs are placed horizontally (figure 2.16b), where an REM block is shown with three
printed circuit assemblies PCA1, PCA2, PCA3 with thermal power on each PCA and
temperature of the ambient environment a. In terms of the flow of thermal processes of
an MTP block, the cartridge and the stack designs are considered the same.
In terms of a design, the block contains repetitive and regular elements PCAs
parallel to each other, which create a basis for automating the process of an MTP
construction used in ASONIKA-T subsystem, an analysis program for thermal conditions
of block with cartridge and stack design.
5.7.1. Cartridge block with an air flow
Construct an MTP for a block with a cartridge design (figure 2.16) with the
dimensions of 200 x 200 x 200 mm with an internal forced air. The distance from the left
101
.
wall of the block to PCA1 as well as from PCA3 to the right wall is 20 mm. The distance
between PCA1 and PCA2, PCA2 and PCA3 is 77 mm.
the housing of the block is isothermal, unlike the previous examples;
each PCA is isothermal;
conductive thermal transfer from the PCA to the housing through mounting
elements is neglected;
radiation between circuit boards in the presence of forced convection is
neglected;
the air in each volume between circuit boards is divided into two volumes: air at
the inlet and air at the outlet.
Thermal energy from the PCA is transferred through the forced convection
(branches 3-7 and analogous type 51) blown by air which carries out the energy from the
heated zone (branches 1- 7 and analogous type 71), increasing its enthalpy. At the surface
of the housing, the energy is transferred to the ambient environment (figure 2.17) through
radiation and convection (branches 2-1).
Figure 2.17: MTP of a cartridge block with an air flow

Table 2.6
102
.
MTP nodes of the cartridge block with air flow

#
Element
ambient environment, air at
6,7,8, air
the inlet
corresponding volumes
housing
(10)
air from the external cooling
Element
at
the
outlet
with
system
3,4,5 printed circuit assemblies
PCA1, PCA2, PCA3
In the case where the cooling air intake occurs from the central cooling system with
temperature Tc which differs from the ambient temperature Ta, we add node 10 to the
MTP. We also need to replace MTP node numbers in those places where they are in
parenthesis from 1 to 10.
Below, we present analysis of results for a steady-state condition:
Table 2.7
Temperature table of MTP nodes
Node number
Node name
Temperature
ambient environment
20
housing
20.5
PCA1
24.2
PCA2
24.9
PCA3
24.2
air at housings outlet
22.4
air at the outlet of PCA1
24.6
24.6
22.4
103
.
In the case where the cooling air intake occurs from the central cooling system with
temperature Tc which differs from the temperature of the ambient environment Ta, we add
node 10 in MTP. We also need to replace MTP node numbers in those places where they
are in parenthesis from 1 to 10.
Below, we present the model constructed with the graphical user interface of
ASONIKA-T subsystem (figure 2.17b), as well as analysis for a steady-state condition.
The temperature of the cooling system is taken as +100.
Figure 2.17b: MTP of a cartridge design with air flow
Table 2.8
Node number
Node name
Temperature
ambient environment
20
housing
18.4
PCA1
16.4
PCA2
16.0
104
.
PCA3
16.4
air at housing outlet
17.4
air at PCA1 outlet
16.2
air at PCA2 outlet
16.2
air at PCA3 outlet
17.4
10
cooling system
10.0
5.7.2. Sealed cartridge block

Construct an MTP for a sealed cartridge design block (figure 2.16).
the housing of the block is isothermal;
every PCA is isothermal;
conductive heat transfer from PCA to the housing through mounting elements is
neglected;
the air between circuit boards forms closed volumes.
Thermal energy is partially transferred from the PCA to the closed air volumes
(transparent to radiation) through convection (branches 3-7 and similar). Then, the energy
is transferred to the housing block through convection and partially transferred to an
adjacent PCA as well as the housing block through radiation (branch 3-4 and similar). The
energy will dissipate from the housings surface to the ambient environment through
radiation and convection (figure 2.18).
Table 2.9
MTP nodes of a sealed cartridge block
#
1
Element
Ambient environment
#
3,4,5
Element
printed
circuit
assemblies
PCA1, PCA2, PCA3

2
blocks housing
6,7,8, closed air volumes between

9
circuit boards
105
.
Figure 2.18: MTP of a sealed cartridge block
Below, we present results of analysis for a steady-state mode.
Table 2.10
Temperature table for MTP nodes
Node number
Node name
Temperature
ambient environment
20
housing
22.4
PCA1
28.7
PCA2
30.5
PCA3
28.7
air at the housing outlet
25.6
air at PCA1 outlet
27.9
air at PCA2 outlet
27.9
air at PCA3 outlet
25.6
106
.
Structural symmetry is clearly seen in repetitive fragments of an MTP block in both

cooling types, facilitating automatic MTP construction for a particular kind of design. In
the present case, there is a clearly visible compromise between the natural tendency for
calculation accuracy and a simplified MTP. A given MTP is characterized by an
unchanging MTP structure in which only the number of branches and MTP nodes will
change as well as the qualitative composition of heat transfer types when the number of
PCAs changes.
5.8. Thermal processes model of an REM rack
Construct an MTP for analysis of overall temperatures of printed circuit assemblies,

transformer, and air at the outlet of a forced ventilated REM rack (figure 2.19).
Figure 2.19: Design drawing of a radio-electronic device with forced cooling

The air in the cooling system with temperature of 200C flows through the rack from
the bottom to the top. The racks first floor contains a printed circuit assembly and a
transformer analogous to the example of an REM block (figure 2.13). The second floor
107
.
contains a second printed circuit assembly. Its arrangement is such that the air flowing
through the channel formed by the lower printed circuit assembly and the left face of the
racks housing is wholly captured in the structural volume of the second floor to the left of
the upper printed circuit assembly. Also, there we have part of the air flowing through the
first floor of the rack to the right of the lower printed circuit assembly. The other part of
air flowing through the racks first floor to the right of the lower printed circuit assembly
gets caught by the structural volume of the second floor to the right of the upper printed
circuit assembly.
Geometric and thermal parameters of each floor is analogous to the example 2.5.
The distance from the left face of blocks housing to PCA2 is 15 mm.
Radio-elements are located on the right side of the circuit boards and uniformly
dissipate thermal power of 10 W along the area of the circuit boards. The transformer
dissipates thermal power of 7 W. The rack is placed in the ambient environment with
temperature of 400C. The air enters from the cooling system with velocity of 1 m/s.
The following idealizations of thermal processes in the rack are assumed:
each face of racks housing is isothermal within the lower and upper floors of the
rack;
the printed circuit assembly located on the first floor is isothermal;
the printed circuit assembly located on the second floor is isothermal;
the transformer is isothermal;
heat transfer through mounting elements of printed circuit boards in the rack are
not taken into account;
the air flowing through the lower floor of the rack to the right of the printed
circuit assembly is isothermal within the lower half of this racks floor with the
temperature equal to the temperature of the previous air volume (i.e. ambient
environment), and the upper half of this racks floor is isothermal with the temperature
equal to the air temperature exiting from this part of the racks lower floor;
the air flowing through the air channel of the racks first floor to the left of the
printed circuit assembly is isothermal within the lower half of the channel with
temperature equal to the temperature of the previous air volume (i.e. ambient
108
.
environment), and is isothermal within the upper half of the channel with temperature
equal to the temperature of air exiting this channel;
the air flowing through the racks upper floor to the right of the printed circuit
assembly is isothermal within the lower half of this racks floor with the temperature equal
to the temperature of the previous air volume (i.e. air at the outlet from the part of the
lower floor to the right of the printed circuit assembly), and is isothermal within the upper
half of this racks floor with temperature equal to the temperature of air exiting this part of
the racks upper floor;
the air flowing through the upper floor of the rack located to the left of the printed
circuit assembly is isothermal within the lower part of this racks floor with temperature
equal to the weighted average (taking into account air mass entering from the air channel
of the racks lower floor and a part of air flowing through the racks first floor located to
the right of the printed circuit assembly) temperature of previous air volumes (i.e. air at the
outlet of the air channel and the outlet of the part of the racks lower floor located to the
right of the printed circuit assembly), and is isothermal within the upper half of this racks
floor with temperature equal to the air temperature exiting from this part of the racks
upper floor;
the air exiting the racks second floor is isothermal with temperature equal to the
weighted average (taking into account air mass entering from the parts of the racks
second floor located to the left and right of the printed circuit assembly PCA2)
temperature of the previous air volumes;
heat transfer by radiation inside the rack is neglected.
In figure 2.20, the presented MTP consists of several parts. Figure 2.20 shows
thermal interaction of corresponding selected areas of the racks housing (branches 1-5, 12, 1-3, 1-4, 2-3, 3-4, 4-5, 5-2, 2-6, 3-7, 4-8, 5-9, 6-7, 7-8, 8-9, 9-6, 6-10, 7-10, 8-10, 9-10
type 02) .
109
.
a)
110
.
b)
Figure 2.20: Model of thermal processes of a forced ventilated REM rack
Figure 2.20b shows interactions of corresponding selected areas of the racks
housing with the ambient environment through convection and radiation (pairs of branches
1-11, 2-11, 3-11, 4-11, 5-11, 6-11, 7- 11, 8-11, 9-11, 10-11 type 26 and 16). The given
temperature of the ambient environment is modelled by adding a temperature source of
400C to MTP node 11.
The inside surface faces of the housing interact with the air inside the block.
Moreover, in accordance with the adopted idealization of thermal transfer processes of the
rack, the air in the lower part of the first floor interacts with the lower half of the vertical
faces of the housing and the lower face (branches 1-14, 3-14, 4-14, 5-14, type 51) with the
air in the upper part of the first floor interacts with the upper half of vertical faces
(branches 3-15, 4-15, 5-15 type 51) (figure 2.20).
The left wall of the air channel (the left face of the racks first floor housing) and the
right wall of the air channel (the left surface of the printed circuit assembly PCA1) interact
111
.
with the air in the lower part of the channel through the lower halves (branches 2-14, 1214 type 61), and the upper halves with the air in the upper part of the channel (branches
2-16, 12-16 type 61) (figure 2.20). The right surface of the printed circuit assembly PCA1
interacts with the air in the lower and upper parts of the floor (branches 12-14, 12-15 type
51), and the transformer with the air in the lower part of the floor (branch 13-14 type 51)
(figure 2.20). The transformer also interacts with the racks bottom through contact
resistance (branch 13-1 type 11) (figure 2.20).
Table 2.11
MTP nodes of a rack
#
Element
Housing: bottom
Element
14
The air at the bottom left and right of the

PCA1 from the cooling system
lower and upper:
15
The air at the upper right of the PCA1 or

bottom right of the PCA2
2,6 left wall
16
Air at the outlet to the left of PCA1
3,7 back wall
17
Air at the bottom of the second floor from

PCA1
4,8 right wall
18
PCA2
5,9 front wall
19
Air at the top of the second floor to the

right of PCA2
10
upper wall
20
Air at the upper left of PCA2
11
Ambient environment
21
Air at the racks outlet
12
PCA1
13
Transformer
Thermal energy emitted by the elements of the printed circuit assembly PCA1 and
the transformer is modeled with thermal sources added to MTP nodes 12 and 13. The
target temperature of cooled air is modelled by adding temperature source of 200C to node
14 (figure 2.20). Thermal energy carried out with air, flown through the racks first floor is
112
.
modelled by branches 14-15 and 14-16 type 71 (figure 2.20), where the previous air
volume for both branches is air from the cooling system (node 14).
As was said earlier, the air from the air channel and the air from the part of the
racks first floor to the right of the printed circuit assembly PCA1 enter the racks second
floor to the left of the printed circuit assembly PCA2. We add 2 heat energy removing
branches in order to set such weighted average temperature for the air of the lower half of
the racks second floor located to the left of the printed circuit assembly PCA2 (figure
2.20) branches 16-17,15-17 type 71.
The printed circuit assembly PCA2 interacts with air in the lower and upper parts of
the racks second floor located to the left of the printed circuit assembly (branch 18-17,
18-20 type 51) and the air of the lower and upper parts of the racks second floor located
to the right of the printed circuit board (branch 18-15, 18-19 type 51) (figure 2.20).
Thermal energy emitted by the printed circuit assembly PCA2 is modelled with a
temperature source added to node 18. The heat energy carried by air, flown through the
racks second floor is modelled with branches 15-19 and 17-20 type 71 (figure 2.20).
Figure 2.20 presents thermal interaction of lower halves of vertical edges of the
housings second floor with the corresponding air volumes (branches 6-17, 7-17, 9-17, 715, 8-15, 9-15 type 51) and the upper halves of the vertical edges and upper edges of the
racks second floor housing with corresponding air volumes (branches 6-20, 7-20, 9-20, 10
-20, 7-19, 8-19, 9-19, 10-19 type 51).
As was accepted under idealization of heat transfer processes of the rack, the air at
the outlet of the second floor has an air mass weighted average at the outlet of the parts of
the racks second floor located to the left and to the right of the printed circuit assembly
PCA2. To enter such weighted average temperature to MTP node 21, corresponding to air
at the outlet of the racks second floor, we add two mass transfer branches (figure 2.20)
20-21 and 19-21 type 71 between corresponding nodes.
At this point the construction of an MTP has ended. In this example, node 14 has the
same temperature as the ambient environment, node 11, otherwise it can model the
temperature of air cooling from the external cooling system.
Below, we show results of analysis for a steady-state regime:
113
.
Table 2.12
Node number
Node name
Temperature
bottom
34.2
left-1
33
back-1
34.5
right-1
34.5
front-1
34.5
left-1
39.3
back-2
38.8
right-2
38.7
front-2
38.8
10
top
39.4
11
ambient environment
40
12
PCA1
34
13
transformer
36.5
14
air_1_below
20
15
air_1_above_right
39.8
16
air_1_above_left
35.3
17
air_2_below_left
42.6
18
PCA2
47.7
19
air_2_above_right
40.2
20
air_2_above_left
42
21
air at the outlet
40
This method was published in the book Kofanov U.N., Manohin A.I., Uvaisova S.U.
Modelling thermal processes during design, testing, and inspection of radio-electric
means (Textbook / MGIEM., M.:, year 1998., p. 140).
114
.
In the above examples, most of the branches used, are shown in table 2 of Appendix
2. In Appendix 2, we also show different parameters necessary for modelling.
115
.
APPENDINX
116
.
APPENDIX 1
REFERENCE DATA IN ASONIKA-T SUBSYSTEM
Table A1.1
Size definition and orientation coefficients of various surfaces
Surface type
Size definition
Coefficient of
orientation
Balls, horizontal cylinders
Diameter
1.0
Vertical plates and cylinders
Height
1.0
Horizontal plates, dissipating

thermal flux:
Minimal plate size
- up
- down
1.3
0.7
Table A1.2
Branch types
Branch
Graphical
type
1
Characteristic description or branch type
representation
2
Initial conditions
0
Initial condition (initial approximation of the

solution) in node i
Conduction
1
Specified thermal resistance
Cartesian (rectangular) coordinate

Calculated
system
117
.
thermal resistance
3
Radial
(in
different
coordinate systems)
Cylindrical Normal
Transverse
11
Direction
Sperical (normal direction)
Direct contact heat transfer
Rectangular patch
with a patch of different forms

(with a possible presence of
12
lubrication)
Circular patch
Radiation
16
Radiation with a flat (undeveloped) surface
Natural convection (NC)

26
27
NC with a flat (undeveloped) surface in the ambient

environment
NC with an undeveloped Horizontal

surface of different forms in
28
29
the ambient environment
Vertical
Spherical
Cylindrical
118
.
36
Convective-conductiveradiative
heat
Plate
transfer
Fin type
(CCRHT) with a developed

37
Pin
(with fins) surface
41
Flat
Conductive-convective
mass
transfer
through thin air layers of different types

42
Cylindrical
46
Hot top
NC between two Horizontal
47
flat
(undeveloped)
Hot bottom
surfaces
48
Vertical (air channel)
Forced convection (FC)

51
52
FC with a flat (undeveloped) surface in the ambient

environment
Air cooling with a
Plate
developed (with fins)

53
61
surface
FC in an air channel
(the air channel can be
Pins
Fin type
119
.
split into parts)

62
Bent
Mass transfer
71
Mass transfer in a ventilated air channel
72
Mass transfer inside a perforated block
Sources of influences and thermal capacities

101
102
103
111
112
113
121
122
Constant power source
Time-dependent power source (the dependence is set in the

form of a table)
Time-dependent power source (the dependence is set in the
form of a function)
Constant temperature source
Time-dependent temperature soure (the dependence is set in

the form of a table)
Time-dependent temperature source (the dependence is set
in the form of a function)
Constant thermal capacity
Time-dependent thermal capacity (the dependence is set in

the form of a table)
120
.
Time-dependent thermal capacity (the dependence is set in
123
the form of a function)
124
125
Calculated thermal capacity
127
Table A1.3
Branch parameters in MTs
Branc
h type
1
n
pai
Dime
Parameter name
r
2
Allowed values
nsion
Initial conditions (first approximation of the solution)

0
Deg.
Initial temperature
-273...10000
Conduction
1
Specified thermal resistance
Dimensions of the heat flow cross-
2
2
3
4
sectional area
The length of heat flow path
the material
Inner
Length of the cylinder
0.1...10000
mm
0.1...10000
*K
Outer
mm
Coefficient of thermal conductivity of W/m
K/W 0.01...10000
Ring
diameter
hollow cylinder
of
the
mm

the material
Outer
*K
Sphere diameter
0.01...1000
mm
0.1...10000
0.1...10000
0.1...1000
121
.
2
3
11
Inner
the material
*K
Dimensions of the heat flow cross-
sectional area
mm
0.1...10000
0.1...1000
relati
3
Lubrication factor (table 6)
ve
0.01... 1.0
units
12
Contact patch diameter
mm
1...1000
relati
2
Lubrication factor (table 6)
ve
0.01... 1.0
units
Radiation
1
2
16
19
Dimensions of the heat flow crosssectional area
mm
Emissivity coefficient
Irradiation coefficient
Diameter of a cylinder
Height of a cylinder
relative
Irradiation coefficient
units
0.1...10000
relati
ve
0.01...1
units
mm
0.1...10000
0.01...1
Natural convection
26
Surface length
Surface width (height)
mm
0.1...10000
Vertical
Surface orientation
Horizontal, up
Horizontal, down
Ambient pressure
mmHg
20... 7600
122
.
27
28
Diameter
Height
Ambient pressure
cylinder
Thickness
36
or
37
41
mmHg
20... 7600
1.0...1000
fin(s) or mm
Placement step
1.0...100
pin(s)
Height
1.0...1000
Quantity
psc.
1.0...1000
Lenth of a fin or pin surface
mm
1.0...1000
Material thermal conductivity
W/m*K
0.01...1000
relative units
0.01...1.0
Ambient pressure
Layer length
Layer width
Layer thickness
mmHg
Outer
Inner
Cylinder height
46
Length
47
Width
48
Distance between surfaces
42
0.1...10000
or
diameter
2
mm
Ring
diameter
hollow cylinder
surface
of
20... 7600
mm
1.0...10000
mm
0.1... 10
a
mm
1.0...10000
mm
1.0...10000
mm
1.0...10000
m/s
0.01... 10
mmHg
20... 7600
Forced convection
51
Surface length
Surface width
Airflow rate
Ambient pressure
123
.
Thickness
or
diameter
2
Step location grid
fin(s) or pin(s)
mm
1.0...1000
52
Height
or
Quantity
psc.
1.0...1000
53
Fin or finned surface lenth
mm
1.0...10000
Material thermal conductivity
W/m*K 1...1000
Airflow speed
m/s
0.01...1.0
mmHg
20... 7600
mm
1.0...10000
m/s
0.01... 10
8
(7)
61
or
62
Ambient pressure
Height
Length
Distance between airduct walls
Airflow speed
Number of sections
of airduct
1... 100
20... 7600,
Air pressure
mmHg
Bend radius
mm
1.0...10000
mm
1.0...1000
m/s
0.01... 10
Mass transfer
71
Dimensions of the airduct
Cross-sectional area:
airflow rate
72
airduct fill factor
Dimensions of the block:
Cross-sectional area
rel.
units
mm
0.1... 1.0
1.0...1000
Thermal power and thermal capacity sources

101
Thermal power source
0.001-10000
124
.
102
Table number used to specify thermal
1-5
power
Function type used to specify thermal
power:
1 rectangular pulse sequence
2 harmonic function (sinusoidal)
1-2
the rest of the parameters depend on
103
the type of function:

Function type - 1:
2
Pulse amplitude
0.001 - 10000
Pulse duration
0.001 - 10000
Pulse repetition frequency
Hz
0.001 10000
Initial pulse delay
0.001 10000
Power value outside of pulse
0.001 10000
Function type 2:
2
Harmonic amplitude
0.001 10000
Harmonic frequency
Hz
0.001 10000
Initial phase
rad
0.001 - 10000
Dimensions of a discrete volume
mm
0.001 10000
Material density
kg/m3
1.0... 10000
Specific heat capacity
J/kg/K
1.0... 10000
111
Analogous to branches 101 - 103,
112
except instead of power we specify
113
temperature source (deg. Cel.)
121
Analogous to branches 101 - 103,
122
except instead of power we specify heat
123
capacity ( J / deg. Cel.)

1
2
124
125
.
Table A1.4
Thermal parameters of materials
Thermal
Material
Density
conductivity
Specific heat
capacity
kg/m3
W/(m*K)
J/kg/K
Aluminum alloys:
Technical
236
2710
AD, AD1
220
2710
AMC
180
2730
1090-1300
AL2
175
2650
837
AL9
151
2660
879
D16M
192
2780
920-1170
D16T
121
2780
920-1170
Duralumin
169
2790
920-1050
Copper
386
8930
391
Siluminium
162
2660
Beryllium
219
1850
1770
Germanium
15-30
5320
314
Silicon
23.3
2300
733
Brass
109
8440
376
L96
247
8850
Titanium
22
4500
Mica
0.45
2600-3200
879
Magnesium
156
1730
1047
Alloy -1
116
1700-1800
65
124
109
-3
-8
VL4 65-1
920
126
.
Bronze
25
8800
381
Composite epoxy material 0.23-0.34
1300-1400
1400
Flame Resistant 2
0.15-0.18
1215
50-1
1.5
2500-2700
Polycor
30-40
Glass-ceramic
Table A1.5
Emissivity surfaces of various materials
Material and surface condition
Emissivity
Temperature
coefficient
Aluminum
Highly polished
227
0.039
Grinded
100
0.095
Sheet, commercial grade
100
0.09
Strongly oxidized
93
0.2
Duralumin D16
50-350
0.37-0.41
Highly polished
243
0.028
Dim
350
0.22
Grinded, commercial grade
20
0.03
Highly polished
80
0.018
Grinded
100
0.052
Strongly oxidized
25
0.78
Grinded iron
427
0.14
Iron sheet, highly oxidized
25
0.69
Brass
Copper
Iron and steel
127
.
Steel sheet, cold rolled
93
0.075-0.085
Steel sheet, rough
350
0.96
Tin, shiny
50
0.06
Black
28
0.8
Black
93
0.95
Reflective
100
0.77
Paint
Table A1.6
Lubrication factor values for different contact gap fillers
Gap filler
Lubrication factor [rel. units]
Aluminum powder
0.7
Graphite powder
Glycerol
0.4
PPMS
0.35
A mixture of (80% glycerol, 20%
0.25
0.3-0.5
graphite)
6
KPT-8
0.2
Sial
0.15
Dry contact
1.0
128
.
Appendix 2
Automated construction of thermal models of standard radiators in ASONIKA-T
Construction of standard radiators in ASONIKA-T happens in two stages. During
the first stage, the user fills out appropriate tables. The tables can be filled out manually
through ASONIKA-BD interface (see Appendix 2, Filling out the database through
ASONIKA-BD interface). The construction of the model itself in ASONIKA-T takes
place during the second stage (see Appendix 2 Creating a thermal model of a standard
radiator in ASONIKA-T).
A2.1. Filling out the database through ASONIKA-BD interface.
The basic principles of working with ASONIKA-BD module are described in the
Asonika_BD.v5.0.Manual.ru-EN.pdf manual, which can be accessed through the
Windows menu ASONIKA 5.0 > Documentation > ASONIKA-BD.Manual. Next we
will only consider part of ASONIKA-BD interface used for entering a standard radiator in
the database, which is available after selecting
Radiators from the main menu of
ASONIKA-BD (figure A2.1)
Figure A2.1: Main menu item Radiators from ASONIKA-BD.

When we choose the Radiators button, the main dialog window will appear,
where standard radiators can be entered, which contains a Reference database of
radiators:
129
.
Figure A2.2: Main dialog window used for entering standard radiators in Reference
database of radiators.
The main dialog window contains the following controls:
1. Field display of names and designations of the standard document.
2. Button which navigates to the reference database of standard documents.
3. Button which navigates to the reference database of standard sizes of standard
radiators.
4. Field display of the full designation of the size standard.
5. Table of dimensions (basic geometrical parameters) of standard radiators
identified by a symbolic representation.
6. Add Radiator Instance button to add a radiator model with a new designation
and a new set of dimensional sizes of a standard radiator.
7. Remove Radiator Instance button to remove a radiator model.
8. Change Radiator Instance Geometric Parameters button to modify dimensional
parameters already entered into radiator models.
9. Input field for a keyword search of radiator models in the reference database of
cooling radiators table.
10. Close button to close main dialog window used to input standard radiators.
130
.
All radiator instances, entered in area 5, are grouped within a single standard
document with a given size standard, i.e. in order to insert a standard radiator instance you
must specify the document in which it is described as well as its size standard. The
package in ASONIKA contains an example of a completed database in accordance to
OST5.8794-88 Cooling radiators of semiconductor devices. The design, size, and thermal
characteristics.
A.2.1.1. Working with standard documents.
Working with standard documents is done through the Reference of standard
documents:
Figure A2.3: Reference of Standard Documents dialog window used for standard
documents.
To navigate to this window, click on button 2 (see Figure A2.2).
The Reference of Standard Documents contains the following control elements:
1. The table used in the standard documents with column Standard document
name and Standard document title. The name of the standard document must be unique
in the reference.
131
.
2. Add standard document button is used for adding a new document to the
reference. Pressing this button will display a dialog window of the following type:
Figure A2.4: Dialog window used for adding a standard document to the reference.
After all appropriate fields are entered, the change to the database is saved by
pressing the Add button. To cancel the changes, press the Cancel button.
3. Remove standard document button is used to remove documents from the
reference.
4. Rename standard document button. Clicking this button displays a dialog box
similar to the following:
132
.
Figure A2.5: Dialog window used for renaming a standard document.

To save changes into the database, click on Change button. To cancel changes,
click on Cancel button.
Functionality of this button is also available when you double-click a row in the
table.
5. An input field for a keyword search for a specific row in the table of a standard
document.
6. Apply button is used to select a specific standard document from the main
dialog window used for entering standard radiators (Figure A2.2.).
7. Close button closes the reference of standard documents dialog window, and
navigates to the main dialog window used for entering standard radiators, without
introducing any changes.
It should be noted that the field groups of the auxiliary dialogs correspond to field
tables of dialog windows, from which they were called. All auxiliary dialogs provide a
similar set of control elements with the exception of group lists; therefore, will not be
considered further.
A2.1.2: Working with standard sizes.
Input and modifications of standard sizes (blanks) of standard radiators are done
through Radiator Standard Size (Blank) dialog window and looks as follows:
133
.
Figure A2.6: Dialog window used for standard sizes (blanks) of standard radiators of
Radiator Standard Size (Blank).
This dialog window contains the following control elements:
1. A table of standard sizes for a selected standard radiator from the main dialog
window (Figure A2.2) of a standard document. Initially, the table of standard sizes does
not contain any data. In order to determine a specific standard size (blank) of a radiator, it
is necessary to add a corresponding row in the table.
2. Add Radiator Standard Size (Blank) button is used to add a new standard size
into the database. The designation of the standard size must be unique.
3. Remove Radiator Standard Size (Blank) button is used to remove an existing
standard size. It should be noted that if radiator instances exist, its removal will not be
successful; i.e. it is first necessary to remove all instances of the specified standard size
and then the standard size itself.
4. Rename Radiator Standard Size (Blank) button is used for renaming the
standard size (blanks) of a radiator.
5. Radiator Standard Size (Blank) Properties button is of a specific interest in this
dialog window, as it allows you to set specific geometric parameters for a currently
134
.
selected standard size. Clicking on this button will display a dialog window with its name
containing the designation of the edited standard size. It looks as follows:
Figure A2.7: Dialog window used for determining standard size parameters.
The dialog window for determining standard size parameters contains the following
control elements:
5.1 Full designation of a standard size (blanks) of a standard radiator determined in
the previous dialog.
5.2. Field display name and heading of a standard document contains the name and
heading of the standard document for which the edited standard size is referred to.
5.3. Button used for selecting a standard document allows you to tie the edited
standard size to another standard document; however, the designation of the standard size
is not guaranteed to be unique.
5.4. Load sketch from file button allows you to load a sketch of a radiator from a
file. Pictures with *.bmp format are guaranteed to work.
5.5. Clear sketch button removes the picture.
135
.
5.6. Standard Size / Radiator switchgroup allows you to choose the geometric
shape of the fins. Plate-type finning is used for finned radiators, and needle-pin finning is
used for pinned radiators.
5.7. Standard Size / Fin switchgroup allows you to choose whether the radiator
has fins (pins) only on one or both sides of the base.
5.8. Standard Size / Cooling switchgroups allows you to choose the type of
cooling for the current standard size (blank) radiator free for radiators with natural
cooling, forced for radiators with forces cooling (air fan).
5.9. Fin thickness (pin radius), [mm] input field allows you to set the thickness of
the fin for a standard size (blank) finned radiator or the radius of the pin for a standard size
(blank) pinned radiator.
5.10. Fin (pin) step, [mm] input field allows you to set the distance between the
centers of the fins (step) of the standard size (blank) finned radiator or between the centers
of the pins (step) of the standard size (blank) pinned radiator.
5.11. Apply button saves changes in the database.
5.12. Close button navigates back to the previous dialog window (Figure A2.6).
6. Keyword input field (or a combination of letters) used for searching of a specific
standard size (blank).
7. Apply button selects the current standard size and navigates back to the main
dialog window editor of standard radiators (Figure A2.2.), where a specific instance of a
standard size can be set with the help of buttons 6, 7, 8.
After filling in all the necessary information in the reference database of radiators,
we can proceed with thermal modeling in ASONIKA-T.
A2.2. Creating a thermal model of a standard radiator in ASONIKA-T.
Automatic construction of a thermal model of a standard radiator in ASONIKA-T is
carried out similarly to other automatic constructions of thermal models (plate, package,
etc.) with the only exception that the standard-reference information on standard radiators
needs to be prepared in advance with the help of ASONIKA-BD module (see Appendix
A2.1).
136
.
To create a thermal model of a standard radiator, select Design / Radiator in the

main menu, or click on the
Radiator button in the toolbar. The cursor will change to
a crosshair with arrows
. Then select any free space in the working area of
ASONIKA-T and click on the left mouse button. A dialog window will appear for
selecting radiator parameters:
Figure A2.8. Dialog window used for selection of standard radiator parameters.
The dialog window allows you to specify necessary design parameters used for
simulating thermal conditions. They are divided into several groups.
Standard document group.
In the drop-down box of this group select a standard document describing different
radiators which were entered previously into the database with ASONIKA-BD.
Blank type group.
In this group you select the blank type for a radiator. There are two blank types
one for a fin type and the other for a pin type radiator.
Finning type group.
Finning type allows you to select the number of sides on which radiator fins or pins
are placed. There are two options a one two sided finning.
Cooling group.
137
.
In this group you can select the type of cooling designed for the radiator a radiator
for natural or forced cooling.
Groups listed above with the exception of the standard document, represent a set of
standard size parameters of a radiator, or a radiator blank and basically perform navigation
tasks according to the previously entered information in the database.
Blank material group.
This group is used to enter the necessary thermal properties of a material used in a
simulation. It should be noted that these properties come from the database. Therefore, it is
possible to fill out the database with the help of ASONIKA-BD and select the material
from the previously prepared database. The selection from the database is made by
clicking on the Material Database button. This function coincides with the function from
the menu item Edit / Material Database.
Ambient group.
In this group, characteristics of the ambient environment are specified necessary for
conducting simulation analysis of thermal conditions, namely pressure and airflow
velocity for radiators with forced cooling.
Geometric parameters group.
This group lists a line by line characteristics of specific radiator instances of the
selected standard size in table format.
After the instance of the modeled standard radiator was selected, click on the OK
button and a thermal model of a radiator will appear in the workspace of ASONIKA-T
(initially as a schematic representation of a radiator):
Figure A2.9. Schematic representation of a standard radiator in ASONIKA-T

workspace.
138
.
To get access to branches generated from the model, select Fold / Unfold radiator
from the context menu (available when you click right mouse button on the image of the
radiator) item Fold / Unfold radiator which unfolds the image as follows:
Figure A2.10: Unfolded model of a standard radiator in ASONIKA-T workspace.

To fold the model to its original state, you must call the context menu of a standard
radiator by clicking on the right mouse button on the highlighted part of the workspace
and select the same menu item as the one used for the unfolded model.
When constructing a model of a standard radiator in a transient mode, branches with
the specific heat nodes are automatically added to the model:
139
.
Figure A2.11: Unfolded model of a standard radiator, constructed with a selected

transient mode of analysis.
A2.3: Examples of use.
A2.3.1: Basic principles for generating thermal models of a standard radiator.
The principle used for generating a thermal model of a standard finned radiator is
based on the introduction of additional nodes that represent provisional isothermal
volumes of air between fins. Under the influence of this supplement, the model of a
standard radiator is broken down into nodes as follows: fin 1 (including the base of the
radiator) base 1 of the radiator air in the groove between the fins base 2 of the
radiator fin 2, etc.(Figures A2.11, A2.10). When generating a pinned radiator, the
volume around the pin is considered isothermal and the break-down occurs as follows: the
base is divided into equal cubes (about equal), a pin is mounted to each base, and a
provisional isothermal air volume is around each pin:
140
.
Figure A2.12: Unfolded model of a standard pinned radiator.

A2.3.2. Construction of a standard finned radiator (FR) model and its thermal mode
analysis with the following initial data:
1. Power source (transistor 5 W - presumably 2N107 with approximately 11 mm
diameter) mounted on a copper FR.
2. Length of FR 36 mm;
3. Width of FR 32 mm;
4. Height of FR 17.5 mm;
5. Height of FR fin 12.5 mm;
6. The parameters of the ambient environment are standard (25 deg. C., 760 mm
Hg).
With the help of automated construction of a standard radiator, we build its model in
the workspace. We introduce an additional node to model the transistor. Lets assume that
the transistor will be mounted in the center of the radiator. In A2.3.1, a couple of words
were mentioned about basic principles of standard radiator model construction. Thus,
when attaching the transistor to the radiator, we must remember that finned radiators are
broken down into nodes with parallel planes, formed by the fins of the radiator, and the
power of the transistor must be distributed as follows. Virtually the entire transistor will
heat the base in the center, but some of its power will go into heating of two central fins
connected with the base. We assume that the contact between the transistor and the
radiator will be a circular spot with the diameter of about 11 mm, and the width of the
central base of 9 mm. That is, the area of the circular spot section interacting with one fin
is about 4.3 mm2, and the area of a circular spot interacting with the base between fins is
about 86.43 mm2. We conclude that one part of the total thermal power goes into heating
the base between the fins, and the other goes equally to heat the adjacent fins. Next, we
input a temperature source (temperature of the ambient environment is constant at 25 deg.
C). The transistor, itself, interacts with the environment through convection and radiation.
Lets assume that radiation from the transistor to the radiator is minimal. As a result we
get the following model:
141
.
Figure A2.13: Graphical representation of a thermal model of a transistor mounted on the

radiator.
142
.
Figure A2.14: Text representation of the thermal model of the transistor.

Analysis of thermal modes of the modeled design will give the following results:
Calculation Results
Node number
1
2
3
4
5
6
7
8
9
10
11
12
Node name
ambient environment
Fin 1
Fin 2
Base 12
Air 12
Fin 3
Base 23
Air 23
Fin 4
Base 34
Air 34
transistor
Temperature, C
25
73.8
74.2
73.9
25
74.2
74.5
25
73.8
73.9
25
77.7
Figure A2.15: Calculation results.
143
.
APPENDIX 3
Calculation of irradiation coefficients in ASONIKA-T
1. Calculation of irradiation coefficient in subsystem ASONIKA-T can be done as follows:
the heat radiation will be provided between the nodes that are added to the model.
2. Click on
button to select branch type (type number 16 or 19).
3. The radiation is added between the nodes which are clicked consecutively (Figure A3.1.).
Figure A3.1: Selection of radiation type.

4. Select Thermal Radiation Undeveloped Surface or Thermal Radiation
Undeveloped Cylindrical Surface branch.
5. In the dialog box which appears, enter necessary dimensions of the surface and the
emissivity coefficient, then click on the
button next to the Irradiation Coefficient
column (Figure A3.2.).
Figure A3.2: Setting the parameters of thermal radiation and navigating to the
configuration of irradiation coefficient menu.
144
.
6. The left part of the new dialog window will contain a tree menu in which all available
options of geometric arrangements of interacting surfaces in space are divided into two
groups (Figure A3.3).
Figure A3.3: Window used for selecting the desired surface position.
7. From the tree menu, select the desired option of a geometric surface position (Figure
A3.4).
145
.
Figure A3.4: Selection of the desired option of a surface position.

8. In the right part of the window, enter necessary parameters (Figure A3.5).
Figure A3.5: Input data for calculation.

9. Irradiation coefficient is set in the model (Figure A3.5.6).
146
.
Figure A3.6: Branch parameters with the set irradiation coefficient.

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Subsystem analysis and thermal characteristics of hardware design in ASONIKA-T

An Automated System for Ensuring the Reliability and Quality of Equipment

SUBSYSTEM ANALYSIS AND THERMAL CHARACTERISTICS OF

We review the issues of automated modeling of thermal processes with arbitrary

3. SYSTEM ADMINISTRATOR'S GUIDE ........................................................................................... 74

5.8. Thermal processes model of an REM rack ................................................................................ 106

1.1. Use and technical specifications of the subsystem

Subsystem ASONIKA-T is designed to automate the modeling of thermal processes

Next, for thermal modeling of printed circuit boards, subsystem

circuit board and each radioelement. By comparing radioelement temperature output

Dialog of input parameters for

Dialog of input parameters for

Dialog of standard elements

Raw data files *.dat

Calculation results output

Results file *.rez

Figure 1.1: Block diagram of ASONIKA-T subsystem

For this purpose, there is a dialog form which guides the

This module is built using modern technologies of object-oriented programming and

1.2. Description of thermal models of the subsystem

The subsystem allows modelling of steady-state and transient thermal processes of

2.1. Starting the subsystem and main menu items

Figure 2.1: Window of the subsystem

Figure 2.2: Main Menu

File menu, expanded in figure 2.3,

Figure 2.3: File menu

provides the following features:

Figure 2.4: Edit menu

Figure 2.5: Edit menu and Options window

Design menu allows to choose a standard design shown in figure 2.6.

Figure 2.6: Design menu

Figure 2.7: Analysis menu

Results menu allows (see figure 2.8):

Figure 2.8: Results menu

display a table of temperatures at each node of a model for a steady-state type

Figure 2.9: Help menu

Figure 2.10: Standard Toolbar

Figure 2.11: Tools Toolbar

Figure 2.12: Options Toolbar

Working with GUI mathematical thermal model input of REM design in a

Figure 2.13: Creating a topological thermal model node

button in the toolbar. When the

button. The node will be removed.

button in the toolbar. Select both nodes sequentially.

Next, select the branch type (figure 2.14).

Figure 2.14: Selecting branch type

Figure 2.15: Branch parameters for radiation

Figure 2.16: Representation of a radiation branch

button in the toolbar. Then set the

remove the branch.

button in the toolbar.

button in the toolbar. Then, press

button is selected in the

button, and then choose a different one in the toolbar, for

Viewing node names and branch numbers. For this, the

button is selected for

button for the second.

Creating a library of standard elements. Very often in a physical thermal model

To insert a plate, select the

button in the toolbar. Then, set the cursor anywhere

Figure 2.17: Parameters window for a standard element Plate

button in the toolbar.