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I. INTRODUCTION
Fig. 1. (a) Schematic of a p n diode device under proton irradiation. The total
SWNT length is between 6 and 10 m and the junction region varies from 0.3
to 2 m. (b) I V curves of as grown (open circles) and post-irradiation with a
fluence of 10 protons/cm (filled circles) are shown. A large increase for the
p n configuration after irradiation can be seen. The fits to the diode equation
are shown as solid lines. Before irradiation, the fitting parameters are I = 0:35
pA, n = 1:12, and R = 2:8 and 4.7 M
for the n p and p n configurations,
respectively. After irradiation, I = 0:63 pA, n = 1:2 and R = 10 M
for
the n p configuration, while the p n configuration can no longer be fit to the
diode equation.
carbon nanotube are created using 100 nm of deposited polysilicon, which is made highly conductive through phosphorous implantation and an activation anneal. The polysilicon gates are
defined using photolithography and reactive ion etching (RIE).
To electrically isolate the gates from the SWNT, SiO is deposited and planarized using chemical mechanical planarization to a final thickness of approximately 20 nm above the split
gates. Bondpads to the polysilicon are etched into the SiO , and
a 50 nm thick film of TiN is sputtered onto the wafer and patterned. TiN is chosen as it is compatible with the high temperature growth process of SWNTs. To suspend the SWNT, a trench
between the two split gates is defined and etched into the SiO
to a depth of
nm. PMMA is then spun onto the wafer
and patterned to define the SWNT catalyst. Finally, the PMMA
is lifted off in acetone, and SWNTs are grown using a catalytic
chemical vapor deposition process that is known to grow a wide
range of SWNT chiralities [15]. As our devices will encompass
many different chirality SWNTs, we note here that there is unlikely to be a chirality dependence to our results.
radiation source was used in our experiments.
A 2 MeV
Because an
ion dissociates into two protons upon impinging
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electrically. Devices exposed to a low fluence showed no sigbehavior and form the baseline
nificant degradation in the
for comparing to diodes exposed to a higher fluence, as summarized in Fig. 2. Only devices irradiated with fluences of
protons/cm or greater were observed to have an increase in ,
although not all were affected equally. Fig. 1(b) also shows the
curves after irradiation at a fluence of
protons/cm ,
configuration,
the highest fluence used in our study. In the
increases to 10 pA, more than ten times the initial value, and
the diode characteristics can no longer be reasonably fit to (1) for
configuration, on the other
any value of . The for the
hand, represents only a small change compared to the unirradiated case. The asymmetry shown in Fig. 1(b) is characteristic
of devices that showed degradation following irradiation, and is
used to carry-out our analysis for the type of defects being generated, discussed below. We note that the asymmetry between the
two diode configurations is in contrast to what we often observe
as SWNT diodes degrade over time with exposure to ambient
conditions, which always results in a symmetric increase in
for both configurations, presumably due to a relatively uniform
coverage of adsorbates onto the SWNT surface [18].
for the irradiated diodes
To explain the asymmetry in
we assert that a small number of defects are formed along
and values of 2 or
the SWNT, which can lead to increased
higher for [19][21]. Additionally, the inability of the
behavior to be fit to the ideal diode equation reflects a difference
in the recombination and generation processes following the
introduction of a defect. In this work, we choose to focus on
the effects of the defects on the generation process to describe
the increase in reverse bias current. Moreover, we later show
that the defects enhance the generation of only one minority
carrier type, which can be inferred from the asymmetry seen in
characteristics.
the
These conclusions are further supported by our results shown
in Fig. 2, which summarizes all of the devices and fluences
of
meV [24], [25] and show stronger oscillator strength
than band-to-band transitions. The lowest optical transition is
referred to as the E exciton, the second the E exciton, etc.
When the energy of the photon is in resonance with an exciton
transition, a strong peak in the photocurrent is seen. The photocurrent spectra for the device in Fig. 1(b), both before and
after irradiation, are shown in Fig. 3(b). The photocurrent peaks
at 0.65 eV and 1.22 eV correspond to E and E transitions,
respectively. The spectra are normalized to photon flux and the
response after irradiation is offset for clarity. We can readily see
that no new features emerge after irradiation. Similar to Raman
spectroscopy, photoresponse is strongest in the region between
the split gates [3]. Because of the large binding energies of excitons in SWNTs, the spectra between exciton resonances probe
a significant portion of the band gap. Thus, the absence of any
new features after irradiation is another indication that the suspended portion of the SWNT remains undamaged.
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(2)
=0
( )
( )
( (
))
(3)
can be found by solving the diffusion current at the edge of
the field region, given as
(4)
Remarkably, the diffusion current from a point source in a 1-D
system is independent of and is weakly dependent on for
most values. The weak dependence on the location of the defect
is reflected in the linear carrier concentration profile we find for
away from . In calculating
, we can simplify the
. The reverse bias current for this
sum by assuming
. Equating this to the leakage curcase is given as
rent, we arrive at the minority carrier lifetime of
ns. We
constrained
note that for this value of and for values of
within the doped region of our device, the minority carrier density where the defect is located can be at least an order of magnitude larger than the background minority carrier density for the
device in Fig. 1(b), validating the use of (2) [29]. The weak sento defect location can be further illustrated using
sitivity of
the value of calculated for the device in Fig. 1(a). Using this
value of , we calculate the change in for other defect locations. We find the ratio of
and
, indicating the
weak dependence of on . This weak dependence of
on
also shows that the asymmetry in the diode I-V characteristics cannot be explained simply by an asymmetric placement of
defects on both sides of the doped regions, again confirming the
single defect origin for the observed behavior. Finally, in the
absence of a detailed microscopic theory on the origin of our
defects, we only provide a qualitative explanation for the differ.) for the two diode configurations.
ence in the lifetimes (
The near absence of enhanced generation from the point source
for one of the diode configurations suggests that the defect is
charged. When a doped region is of the same charge type as
that of the defect, the free carriers screen the Coulomb potential
of the defect, but the defect still remains active as a generation
IV. CONCLUSION
We studied the fundamental response of SWNTs to radiadiodes exposed to 2 MeV
tion using reconfigurable SWNT
ion radiation over a wide range of fluences. We used current-voltage characteristics and Raman and photocurrent spectroscopy to show that SWNTs are robust up to fluences of
protons/cm . For SWNTs damaged by radiation, we conclude
that as few as a single defect can describe many of the properties
of our diodes. The defect enhances the minority carrier generation rate of one type, and explains the characteristic asymmetry
characteristics. Defects are likely the result of
in the diode
substrate interactions with the SWNT. Based on this conclusion,
we believe future device applications for SWNTs in high radiation environments will require further study of substrate-nanotube interactions.
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