Disassembly HP 430 Notebook

Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs

Marketing Name / Model
[List multiple models if applicable.]
HP 430 Notebook PC
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
Item Description
Notes
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Batteries
All types including standard alkaline and lithium coin

or button style batteries
Mercury-containing components
For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm
Includes background illuminated displays with gas

discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent

chambers, and service stations.
Components and waste containing asbestos

EL-MF877-00
Template Revision B
0
0
Page 1
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing

refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Automatic crossing screw driver
Philip #1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Remove the Battery,and loosen screws on logic lower.

Get HDD, ODD and memory.
Remove KB,Pull out connecter.
Remove C cover
Pull out the DC IN cable, HDD connecter,ODD connecter,and USB Board cable,Remove Speaker cable from MB.
Loosen screw on WLAN and remove antenna.
Remove the MB,take down the thermal module and the CPU.
Remove LCD module, tear down LCD Cover.
Remove panel and camera
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
Page 2
PSG instructions for this template are available at EL-MF877-01

Tabulator:WingsYi
WorkInstructs
Step:1
DocumentNo.:DisassemblyWI
Date:2011113
Name:GetBattery
Step:
BatterySwitch
1. PushtheBatteryswitchand
takeoffthebattery.(Fig.1)
2. LooseneightscrewsonBattery

houseandtakeoffMemory
Fig.1

Door.(Fig.2)

Fig.2
Fixturelist(Fixturestandard)
CrossHeadofScrewsDriver
Qty
1
Qty
Pointforattention:Iffindingsomedefects,noticethegafferandassess.

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Tabulator:WingsYi
WorkInstructs
Step:2
Date:2011113
Name:GetHDD/Memory/ODD
ODDlock
Step:
1.Loosenfourscrewsandpullout
theWLANcableandpower

cable.(Fig.1)

Fig.1

2.TakeoffMemoryWLAN
HDDdoorandODD.(Fig.1)
3.Loosenfourscrewsandpullout
HDDcablefromMB.(Fig.2)

Fig.2
Qty
1
Qty

(/0)

Tabulator:WingsYi
WorkInstructs
Step:3
Date:2011113
Name:GetKB
Step:
1.LoosenfourscrewsonHDD
door.(Fig.1)
2.Loosentenscrews.(Fig.2)

Fig.1
3.Takeoffthekeyboardfromtop
side,setatanangleof45
degrees.(Fig.3)

Fig.2
Fig.3
Qty
1
Qty

(/0)

Tabulator:WingsYi
WorkInstructs
Step:4
Name:RemoveCcover
Date:2011113

Step:
Fig.2
Fig.1
1.PulloutthePOWERBUTTON
BOARDCable.(Fig.1)
2.RemovetheTBCable.(Fig.2)
3.Loosenthescrewsand
breakawaythelogicupperalong
thearrowhead.(Fig.3)

Fig.3
Qty
1
Qty

(/0)

Tabulator:WingsYi
WorkInstructs
Step:5
Date:2011113
Name:DisassembleCcover

Step:
1.PullouttheTPcable.(Fig.1)
2.Loosentwoscrewstheandtake
offthePOWERBUTTON
BOARD.(Fig.2)
3.Loosensevenscrewsand
removetheTPbracket.(Fig.3)
Fig.1

Fig.3
Fig.2
Qty
1
Qty

(/0)

Tabulator:WingsYi
WorkInstructs
Step:6
Date:2011113
Name:GetMotherBoard

Step:

1.TakeoffRTC
battery.(Fig.1)
2.PulloutLVDS/FAN
cable/Speaker
cable/HDDcable/USB
Boardcablefrom
MB.(Fig.1)
3.Loosenthescrewand
removeUSBBoard.
(Fig.2)
RTCbattery
4.Loosenfourscrewsand
takeoffSpeaker.(Fig.3)
Fig.1
5.Loosenthescrewand
TakeofftheMB.(Fig.1)
Fig.2
Fig.3

Qty
1
Qty

(/0)

Tabulator:WingsYi
WorkInstructs
Step:7
Name:RemoveThermalModuleandCPU Date:2011113

Step:
1.Loosensixscrewsandremove
theThermalModule.(Fig.1)
Fig.1
2.TurntheCPUlock90degree
andgettheCPU.(Fig.2)
Fig.2
Qty
1
Qty

(/0)

Tabulator:WingsYi
WorkInstructs
Step:8
Name:RemoveDcover
Date:2011113

Step:
1.Loosenfourscrewsand
takeoffthepanelfromD
cover.(Fig.1)
2.Loosentwoscrewsand
removeHDDcable.(Fig.2)
Fig.1
3.Loosentwoscrewsand
takeoffPowercable.
(Fig.3)
Fig.2
Fig.3
Qty
1
Qty

(/0)

Tabulator:WingsYi
WorkInstructs
Step:9
Date:2011113
Name:GetLCDpanel

Step:
1.UncovertwohornedMylar
thenloosentwoscrews.(Fig.1)
Fig.1
2.BreakawaytheLCDbezelalong
thearrowhead.(Fig.2)
3.Loosentwoscrewsandremove
theHingeCaps.(Fig.3)

Fig.2
Fig.3
Qty
1
Qty

(/0)

Tabulator:WingsYi
WorkInstructs
Step:9
Date:2011113
Name:GetLCDpanel

Step:
4.Loosensixscrews.(Fig.1)
5.TurnoverLCDandpullout
theLVDSconnecter.(Fig.2)
6.Loosensixscrewsand
removetheHinges.(Fig.3)
Fig.1
LVDSconnecter
Fig.2
Fig.3
Qty
1
Qty

(/0)

Tabulator:WingsYi
WorkInstructs
Step:10
Name:Removecamera
Date:2011113

Fig.1
Step:
1.PullouttheLVDSformcamera
andtearuptheLVDScable
alongthearrowhead.(Fig.1)
2.TearupthecamerafromA
coveralongthe
arrowhead.(Fig.2)

Qty
1
Qty

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Disassembly HP 430 Notebook

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Disassembly HP 430 Notebook

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Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

With a surface greater than 10 sq cm

All types including standard alkaline and lithium coin

For example, mercury in lamps, display backlights,

Liquid Crystal Displays (LCD) with a surface greater

Includes background illuminated displays with gas

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Components and parts containing toner and ink,

Include the cartridges, print heads, tubes, vent

Components and waste containing asbestos

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

Remove the Battery,and loosen screws on logic lower.

PSG instructions for this template are available at EL-MF877-01

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