Professional Documents
Culture Documents
Xianghe Peng
Department of Engineering Mechanics,
Chongqing University,
Chongqing, China
Introduction
Grinding is widely accepted as a productive technique to machine hard and brittle materials such as ceramics, because of its
high quality, high efficiency and reasonable cost. However, grinding can introduce damage to a workpiece that may result in
strength degradation and surface deterioration 14. Grinding
damage can be in the form of surface and subsurface cracks, microcracks, chipping, phase transformation and material pulverization 57. The prediction of grinding damage, therefore, becomes
significant to the successful use of ceramic materials for industrial
applications.
Although damage prediction for ground workpieces is greatly
demanded by the manufacturing industry, there is still a lot of
work in this area. This might be due to the fact that numerous
factors are involved in a grinding process, which adds complexity
to the prediction of grinding damage. This study intends to predict
grinding damage induced by a single grit in ceramics using a
computer model based on continuum damage mechanics CDM
and to verify the damage prediction by grinding experiments.
With the help of computer modeling and simulation, grinding
damage may be controlled or reduced by properly selecting grinding machines and process parameters. Computer modeling is an
efficient and economical way to predict grinding damage. It can
also help reveal damage mechanisms and provide a guideline to
the machining and design of ceramic components. In addition, the
computer modeling of grinding damage can easily be extended to
cutting, lapping and polishing situations.
In the past decade great progress has been made in the study of
constitutive behavior, damage and fracture of brittle materials
subjected to various loading conditions. It has been recognized
that loading induced degradation of such materials is closely related to the initiation, propagation and coalescence of microcracks. The geometric anisotropy of microcracks can induce anisotropic damage due to the highly localized microstress fields,
which results in the directional or unilateral effect of damage due
to the opening and closure of microcracks under different stress
states. Taking anisotropy of damage development and its effect
into account, many researchers developed models for damage prediction based on continuum damage mechanics 813. These
models are mainly useful for the description of the material behavior under various loading histories. Unfortunately, few models
have been successfully applied to the prediction of grinding damage induced in brittle materials, such as ceramics.
In order to study surface and subsurface grinding damage of
ceramics, such as silicon nitride, this study proposes a nonlinear
Contributed by the Manufacturing Engineering Division for publication in the
JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received
Dec. 1997; revised Jan. 1999. Associate Technical Editor: G. Sathyanarayanan.
mathematical model based on continuum damage mechanics. Although using a scalar damage variable, the CDM model considers
the evolution of grinding damage that is assumed to be related to
the current states of effective stress and damage, and the effect of
the grinding induced hydrostatic pressure on the constitutive response and damage development. A numerical algorithm together
with finite element analysis is developed for the CDM model, and
applied to the damage prediction for silicon nitride subjected to
single grit grinding. The validity of the CDM model is demonstrated by comparing the calculated results with experimental
results.
CDM Model
2.1 Constitutive Relations for Brittle Materials with Damage. In the past several years Fan and Peng 14, Peng et al.
13,15 proposed a simplistic mechanical representation to construct constitutive relations for dissipative materials under a loading condition. The model is further extended in this study to a
CDM model as shown in Fig. 1. The deviatoric strain e in the
CDM model is separated into an elastic portion ee corresponding
and an
to the response of a spring with elastic shear modulus G
inelastic portion ei corresponding to the response of the dissipative portion consisting of parallel branches. In the rth branch of
the inelastic portion, dashpot-like block a r with damping-like
r , r1,2, . . . ,n
coefficient ar and spring C r with stiffness C
are used to form the rth dissipative mechanism. The energy stored
in spring C r represents that stored in residual stress fields at a
microscopic level due to the non-homogeneous nature of ceramics. If the material subjected to loading is considered initially
isotropic and inelastically incompressible, the following relations
can be obtained under the conditions of isothermal and small
deformation,
n
(1)
r1
r: ei p r
Q r C
ei eee ,
i
r1,2, . . . ,n
(2)
1 :s
ee 2G
(3)
r1,2, . . . ,n
(r)
(4)
(r)
by the
ds2 G dedei
d
s
(11)
(12)
kk
(13)
Q r a
r :
dp r
dz
r1,2, . . . ,n
(5)
(6)
ar a r kk I4
(7)
ds
dQ
d r dC r r
Q
Q
Cr
(8)
in which
r C r kk /a r kk
(9)
d f 1 , dz D f 2 , dz H
(10)
(14)
where
(15)
f 1 1
kk
a
s
b
f 2
1
kk
2c kk
(16)
dz H 21 d kk d kk H d kk
where
H d kk
r1
dQ r C r dei r Q r dz
1 if d kk 0
0 if d kk 0.
(17)
(18)
a r kk a r0 f 3 kk
r1,2, . . . ,n
(19)
as per damage definition, where function f 3 is assumed, for simplicity, to vary with volumetric stress kk as
f 3 1 kk
(20)
r C r0 /a r0
r1,2, . . . ,n
Numerical Algorithm
sAeBzX
(21)
r1
r1
Af1
kk d f 3 f 1
X 1
s
f 3 d kk 2 2 G
i
K i1
n u n P n
A 2
V j B T D i1
n B dV
j1
V j B T n1 dV
(34)
(23)
(24)
1 ei
,
2G z
(25)
1 s:ei
2 G z
(26)
Substituting Eq. 24 into Eq. 21, and using Eq. 13 and the
following relationships
dsd 31 d kk I2
(33)
f 2 H
ded 31 d kk I2 ,
(32)
(22c)
where
e
ei
f 1
,
z
z D
j1
ei
:ei A 1 : A 2 : A 3 kk
z
A 1
P n P n
(22b)
r1
(31b)
K i1
n
1
1
1
2G
x , y , z , xy , yz , zx T
(22a)
3 K d f 3
kk d f 3 f 2 H A f 2 H
Y
1
s
f 3 d kk
f 3 d kk
2 2G
(31a)
in which
x , y , z , xy , yz , zx T
(30)
(27)
ERRmax
j1
in i1
n
in
ER0
(35)
(28)
in which
I4 I2 I2
(29a)
FAI4 B A 1 X
H K
f 1 kk
I
3 2
(29b)
e
z
kk
1
A
f I A 3 BY I2
3
3 2 H 4
(29c)
(29d)
Fig. 5 Contour plots of volumetric stress kk at the 60th increment of loading: a Y 0 cross section, b X 15 m cross
section, c Z 45 m plane top surface
q t i 1 q ni q hi 2 q ni
i1,2
(36)
Fig. 6 Contour plots of von Mises equivalent stress at the 60th increment of loading: a Y 0 cross section, b X 15 m cross
section, c Z 45 m plane top surface
Fig. 7 Contour plots of grinding damage percent in HP-Si3N4 ceramics: a Y 0 cross section, b X 18 m cross section, c
Z 45 m plane top surface
cal analysis showed that the volumetric stress kk and the maximum von Mises equivalent stress were as large as 2800 MPa and
3000 MPa, respectively, which occurred at the 60th increment of
loading when the maximum load was exerted in the grinding
zone. The maximum von Mises equivalent stress was located at
the intersection of Y 0 and X15 m at the upper surface,
which was approximately 3 m in front of the center of the grinding zone. Behind the grinding zone, both the volumetric stress kk
and the von Mises equivalent stress decreased sharply with the
former even approaching a positive value of more than 200 MPa
at the surface behind the grinding zone. The positive volumetric
stress may be attributed to the existence of the frictional traction
induced by the single grit. The grinding damage fields are shown
in Figs. 7a, b and c for the cross sections of Y 0, X
18 m, and the upper surface, respectively. It was predicted
that as much as 20 percent grinding damage occurred in the surface of HP-Si3N4, which is consistent with the experimental results obtained by Mayer and Fang 2 in which damage ranging
from 3 percent to 25 percent was reported for the ground surface
of silicon nitride. Damage was more in the upper surface and
decreased rapidly in the direction of depth. The geometry of the
damage zone in Y 18 m cross section agreed well with the
experimental observations conducted by Zhang et al. 20. Comparing the distributions of the stress and damage fields, one can
find that the shape of the maximum damage zone is similar to that
of the volumetric stress kk and the maximum von Mises equivalent stress. It should be pointed out that damage is mainly induced
by the von Mises equivalent stress field, i.e., the shear stress field,
rather than the hydrostatic compressive stress field in the grinding
zone. In fact, the hydrostatic pressure makes little contribution to
damage development. In most of the observations, damage is
identified as macrocracks, microcracks and/or microvoids. The
predicted grinding damage can also be compared with the pulverization damage suggested by Zhang and Howes 7 in which the
ceramic material in the grinding zone is reportedly pulverized into
finer grains. The pulverization is the consequence of the exertion
of the von Mises equivalent stress and hydrostatic pressure that
can generate a large number of microcracks in the grinding zone,
and hence can greatly alter the properties of the material, such as
strength and hardness. Other types of damage can be identified as
scattered microcracks and/or microvoids that may be localized or
coalesced into clustered microcracks and/or microvoids under a
certain grinding condition.
56 Vol. 122, FEBRUARY 2000
with fine grits will have a lower break-in pressure than that with
coarse grits. In fact, the grit-workpiece contact area is larger for a
blunt grit than for a sharp one. Due to the existence of friction
between the grit and workpiece, a larger contact area would require a higher break-in pressure because the workpiece material in
the contact region is usually confined by friction to have side
flows, which results in a contact pressure distribution with a friction hill 21. At the maximum grinding pressure of q n,max
5000 MPa, for example, 15 percent damage is induced by the
grinding process, while 5 percent damage can be expected at
q n,max3500 MPa.
Figure 9 shows the calculated correlation between the relative
depth of damage and the relative grit depth of cut for an HP-Si3N4
workpiece ground by a spherical grit with a radius R. In Fig. 9 D d
and t denote the maximum depth of damage and grit depth of cut,
respectively. It is observed that the relative damage increases with
the increase of the depth of cut at a decreasing rate. If the
HP-Si3N4 workpiece is ground by a single grit with a radius R
10 m at 1 m depth of cut, the depth of grinding induced
damage can be as large as 12 m. On the other hand, if grinding
is conducted at 0.1 m depth of cut under the same grinding
conditions, the depth of damage would be reduced to 4 m. This
result should be useful in assessing the depth of damage under
given grinding conditions or making a choice of grinding conditions for an allowable depth of damage.
A comparison between the calculated and experimental results
on the depth and semi-width of damage zone is shown in Fig. 10.
The experimental results were obtained based on the single grit
grinding with a conical shape. In the experiment, the conical grit
had an included angle of 126 degrees and a tip radius of 2.5 m.
In the numerical analysis, the grit was treated as a cone with a
zero tip radius. Additionally, the following parameters were used
( 1)
(2)
( 1)
for the numerical analysis: q n,max
4900 MPa, q n,max
:qn,max
0.8,
1 0.143 and 2 0. A characteristic cube of the dimensions of
a36 m, b30 m, and c45 m referring to Fig. 4 was
chosen for the HP-Si3N4 workpiece. The grinding was simulated
at a depth of cut of 5 m. The calculated maximum surface damage was approximately 20 percent. If grinding damage D
0.025 percent or more is considered to be of significance, the
depth and semi-width of damage zone can be calculated with respect to grit depth of cut, as shown in Fig. 10. Any damage less
than 0.025 percent is deemed to be insignificant in practical applications because such a level of damage would not cause an
obvious change in material properties. Damage zone was measured using three destructive methods and scanning electron miJournal of Manufacturing Science and Engineering
be somewhat different from those for the experiment. In the experiment, a conical grit with a tip radius of 2.5 m was used while
in the calculation, the tip radius was set to zero.
Conclusions
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6
7
16
Acknowledgments
17
18
References
1 Malkin, S., and Ritter, J. E., 1989, Grinding Mechanisms and Strength Degradation for Ceramics, ASME J. Eng. Ind., 111, pp. 167174.
2 Mayer, Jr., J. E., and Fang, G. P., 1994, Strength of Ground Silicon Nitride
Ceramic, Annals of the CIRP, 44, pp. 279282.
3 Xu, H. H. K., Jahanmir, S., and Ives, L. K., 1996, Material Removal and
Damage Formation Mechanisms in Grinding Silicon Nitride, J. Mater. Res.,
11, pp. 17171724.
4 Zhang, B., Tokura, H., and Yoshikawa, M., 1988, Study on Surface Cracking
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