Journal of ELECTRONIC MATERIALS, Vol. 39, No.

9, 2010
DOI: 10.1007/s11664-009-0994-x
2009 TMS

Model Building and Simulation of Thermoelectric Module

Using Matlab/Simulink

HUAN-LIANG TSAI1,3 and JIUM-MING LIN2

1.Department of Electrical Engineering, Da-Yeh University, Chang-Hua, Taiwan, ROC.

2.Mechanical Engineering Department, Chung Hua University, Hsin-Chu, Taiwan, ROC.
3.e-mail: michael@mail.dyu.edu.tw

This paper presents implementations and verification of models of thermo-

electric cooler and generator modules using Matlab/Simulink. The proposed
models are designed with a user-friendly icon and a dialog box, like Simulink
block libraries, making them easy to use for simulation, analysis, and
optimization of further applications.

Key words: Thermoelectric cooler, thermoelectric generator, thermoelectric

module

INTRODUCTION capable of cooling and refrigeration, such as in

specialized coolers for optoelectronic and electronic
Thermoelectricity was initially discovered in the
components and portable electric food coolers/heat-
early 1800s. A voltage is generated when a junction
ers. They are especially useful for precise tempera-
of two dissimilar materials is held at a different
ture control applications where accuracy, simplicity,
temperature. Thermoelectric materials began to be
reliability, and compactness are dominant concerns.
made with n-type and p-type structure in the middle
On the other hand, TEGs can be used to harness
of the 1900s due to the prevalence of semiconductor
waste heat with available temperature difference
materials. Through control of the carrier concen-
and produce electric power, such as for power gen-
tration, optimization of the bandgap can be achieved
eration in spacecraft systems and as thermocouples
for the thermoelectric couple. Many thermocouples
for temperature measurement. With the rising costs
are then interconnected electrically in series to
of fossil fuels and the innovative technologies of
increase the operating voltage and thermally in
waste-heat recovery, TEG devices are becoming
parallel to increase the thermal conductivity, form-
more prominent, especially in applications and
ing a thermoelectric module (TEM). TEM devices
markets for broader automobile systems and remote
can typically be classified into thermoelectric gen-
self-powered sensor and wireless communication
erators (TEGs) and thermoelectric coolers (TECs).
systems.
TEGs convert thermal energy from a temperature
Mathematical models of TEM for both TECs and
gradient to electrical energy (Seebeck effect),
TEGs have been well developed to simulate their
whereas TECs convert electrical energy into a
corresponding behaviors and analyze their perfor-
temperature gradient (Peltier effect). Being basi-
mance.1,2 Modeling and simulation allows for anal-
cally solid-state energy converters with no
ysis, design, and optimization of TEMs to cut down
mechanical and moving parts, TEM devices can
the design cycle. Recently, equivalent circuit models
provide the benefits of noiselessness, compactness,
of TEMs have been built using SPICE software for
reliability, and stability. However, having poor
easy module analysis and for further extraction of
energy conversion efficiency, both TECs and TEGs
model parameters from specifications in commercial
were largely considered for niche applications due to
datasheets.37 Basically, equivalent-circuit models
their unique advantages. In general, TECs are
implemented using SPICE are suitable for simula-
tion of power-electronics applications. For the con-
trol objective, it is better to build a TEM model
(Received June 4, 2009; accepted October 28, 2009;
using the Matlab/Simulink package and further to
published online November 19, 2009) use its SimPowerSystem tool, especially for the

2105
2106
development of temperature control and maximum
power point tracking (MPPT) technologies for TEC
and TEG applications.
PRINCIPLE OF THERMOELECTRIC
MODULE
The construction of both TECs and TEGs is
basically the same, and consequently the same
equivalent circuit can be used to simulate their
behavior. The basic unit of a TEM is a thermocouple
that consists of a p-type and n-type pellet couple
interconnected by metal. A TEM has the form of
thermopiles that are connected electrically in series
to increase the operating voltage and thermally in
parallel to decrease the thermal resistance, and is
sandwiched between two ceramic plates for uniform
thermal expansion. There are four main energy
processes taking place in the TEM pellets: thermal
conduction, Joule heating, the Peltier cooling/heat-
ing effect, and the Seebeck effect. The additional
Thompson effect, which is described by the
Thompson coefficient s dS=dT; is small enough to
be neglected. Both ceramic plates and intercon-
nected metals have high thermal conductivity to
ensure uniform temperature at either end.
Neglecting the contribution of the metal intercon-
nectors and ceramic plates, the analysis of a TEM
can be conducted by analyzing a single pellet or
thermocouple without loss of generality.
The phenomenon of thermal conduction is a
Fourier process that is described by the thermal
conductivity ji of the material. For a TEM with N
thermocouples, the heat transfer of thermal con-
duction in a TEM is described by
Qth DTjth ; (1)
where jth is the thermal conductivity of the TEM
and DT TE  TA : Joule heating is a physical pro-
cess of heat dissipation in a resistance element. The
flow of electric current through the TEM will addi-
tionally cause resistive heating of the thermocou-
ples. The total Joule heat dissipated in an N-couple
TEM is
QJ I 2 R; (2)
where R is its electrical resistance. Irrespective of
the temperature gradient, the Joule heat can be
considered as equally divided between the two sides
of the TEM. The Peltier cooling/heat effect is a
phenomenon of heat absorption/dissipation by a
junction between two dissimilar materials when
electrical current flows through the junction. The
absorbed/emitted heat of an N-couple TEM is
QPE=PA SITE=A ; (3)
where S is the TEMs Seebeck coefficient. When a
temperature gradient is imposed on a conductor
under an open-circuit condition, the creation of an
electrical potential difference between the hot and
Tsai and Lin
cool sides of the conductor is called the Seebeck
effect. The generated Seebeck voltage, called the
electromotive force (EMF), in a TEM is expressed
as
US SDT: (4)
Applying the concept of energy equilibrium for
steady-state analysis at both sides of the TEM, the
absorbed heat generated by the thermal load, QA,
and the liberated heat removed by the heat sink,
QE, are, respectively, given by
QA SITA  0:5I 2 R  jth DT (5)
and
QE SITE 0:5I 2 R  jth DT: (6)
The TEMs output voltage is then
V US IR: (7)
A good TEM must combine a large Seebeck coeffi-
cient S with low electrical resistance R and low
thermal conductivity jth . The figure-of-merit (FOM)
parameter is then defined as
Z S2 =Rjth : (8)
DETERMINATION OF TEM PARAMETERS
In general, TEC manufacturers provide the fol-
lowing parameters to specify their products: DTmax,
the maximal temperature difference between the
cold and hot sides of the TEC; Imax and Vmax, the
current and voltage inputs to produce DTmax for a
given level of TH. The hot-side temperature of a
working TEC is always constant and is nearly equal
to the temperature of the material used in the
cooling system. In addition, it is easier to measure
the hot-side temperature because this surface is
always outside of the TEC device. For cooling, one
can assume that TE = TH and TA TH  DT, and
QA is set to zero for thermal insolation. The tem-
perature difference can be expressed as
DT SITH  0:5I 2 R=SI jth : (9)
The maximal temperature difference can be found
by taking the derivative of DT with respect to I and
setting the result to zero. The maximal current and
temperature can be derived as
Imax jth 1 2ZTH 0:5  1=S (10)
and
DTmax TH 1  1 2ZTH 0:5 =Z: (11)
Then, the maximal voltage can be rewritten as
Vmax STH : (12)
Model Building and Simulation of Thermoelectric Module Using Matlab/Simulink 2107

(a)
DC Power
supply
Hot_Side_Temperature

Hot-side Temperature
Current Scope

Cold_Side_Temperature

Cold-side Temperature TEC Module Voltage Scope

5.1333e-002
(b)
Seeback coefficient
f(u)
2.5268e-003
Seeback Coefficient f(u)
Function
FOM Function FOM
1.1909e+000
f(u)

Resistance Function Resistance

8.7569e-001
f(u)

Thermal Conductivity Thermal Conductivity

Function

f(u) 1
Current Scope
Current Function
1
Hot-side Temperature
2
Cold-side Temperature

f(u) 2
Voltage Scope
Voltage Function

(c)

Fig. 1. TEC module: (a) masked implementation, (b) subsystem implementation, and (c) dialog box.
2108 Tsai and Lin

Therefore, given the emitting temperature TE = TH, mopt DT gmax max

th TC =DT  gth TH ; (23)
the parameters of the proposed model can be
calculated by and then the FOM of the TEG can be found as
S Vmax =TH ; (13) Z m2opt  1=Tave : (24)

The thermal conductivity of a TEG can be calculated

R Vmax 1  DTmax =TH =Imax ; (14) by

and jth S2 =RZ: (25)

Rth Vmax Imax TH  DTmax =2TH DTmax : (15) Some manufacturers give the efficiency for the
matched load gth,m. Since the matched load resis-
On the other hand, the regular parameters in the tance is matched to the internal resistance, i.e.,
datasheet of commercial TEGs include: TA = TH and RL = R, the current at the matched load is found to
TE = TC, the hot-side and cold-side temperatures; be
Wm, the power at the load matched to the internal
resistance (RL = R); Vm (=VR), the load voltage at Im SDT=2R; (26)
the matched load; and gmax
th ; the maximum thermal and the efficiency at the matched load is expressed
efficiency. Obviously, one can easily calculate the as
electrical parameters of the equivalent circuit di-
rectly from the datasheet. The electrical resistance gth;m ZDT=4 Z1:5TH 0:5TC : (27)
R and the Seebeck coefficient S of a TEG can be
expressed as The FOM of the TEG is then calculated by
2 Z 4gm m
TEG =DT  gTEG 1:5TH 0:5TC : (28)
R RL V m =Wm ; (16)
Finally, the thermal resistance can be obtained.
and
S 2Vm =DT: (17) MODEL BUILDING AND SIMULATION
Given the fundamental specifications of a TEC
In fact, the efficiency of a TEG is a function of the
directly from the manufacturers datasheets, the
load. Assume that the load resistance is defined as
parameters of the proposed model can be calculated
RL = mR, where m is the resistance ratio between
by Eqs. 1820. For a cooling application, the cold-
the load and internal resistance. The current can be
side temperature of the TEC, TC, is a desired input
expressed as
and then the temperature difference can be
I SDT=1 mR: (18) obtained for a given hot-side temperature TH, i.e.,
DT TH  TC . This temperature difference can be
The thermal efficiency of a TEG is defined as the ratio
of the electric power output to the thermal power
input to the hot side, which can be expressed as

gth I 2 RL =QH : (19) 16 16

Given the FOM, the TEGs thermal efficiency can be 14

: Current (A)
14
reformulated as : Voltage (V)

gth mZDT=f1 m2 Zm 0:5TH 0:5TC g: 12 12

(20) 10 10
Current (A)

Voltage (V)

Obviously, the TEGs efficiency is a function of the

resistance ratio m. The maximal efficiency can be 8 8
given as
6 6
gmax
th mopt  1DT=TH =mopt TC =TH ; (21)
where mopt is the value of resistance ratio m that 4 4
maximizes the efficiency of the TEG, which is
2 2
mopt 1 ZTave 0:5 ; (22)
0 0
where Tave 0:5TH TC . Given the parameters of 230 240 250 260 270 280 290 300
a commercial TEG, the resistance ratio m can be Temperature (K)
obtained as Fig. 2. TCI and TCV output characteristics.
Model Building and Simulation of Thermoelectric Module Using Matlab/Simulink 2109

(a)

Hot_Side_Temperature QH

Hot-side Temperature Current Scope
QC

DC-DC
Cold_Side_Temperature Converter

Cold-side Temperature TEG Module Voltage Scope

(b) 2.3800e-002
f(u)
Seebeck Coefficient
Seeback f(u) 1
Coefficient Current Scope
Function Current Function

-C-

f(u) 2
Resistance Function
Voltage Scope
Voltage Function
2.9813e-001

Resistance
f(u)
Hot-side
Temperature Optimal Load
1 Resistance Function

2
Cold-side
Temperature
f(u) f(u) 1.6985e+000

FOM Function Thermal Thermal Conductivity

Conductivity
Function 1.1186e-003

FOM
(c)

Fig. 3. TEG module: (a) masked implementation, (b) subsystem implementation, and (c) dialog box.
2110
used to calculate the required current input, which
can be expressed as
2 0:5
I fSTH  DT  STH  DT  2DT=Z g=R:
The voltage of the TEC is then given as
2 0:5
V Vmax  STH  DT  2DT=Z : (30)
Therefore, the proposed model and its subsystem for
the TEC module can be implemented using Matlab/
Simulink as shown in Fig. 1ac. In order to make
the proposed model easier to use and understand,
the user-friendly icon with an image file of a TEC
icon is shown in Fig. 1b. In addition, the masked
model is designed to have a dialog box as shown in
Fig. 1c, in which the parameters of the TEC module
can be configured in the same way as for Simulink
block libraries.
Taking the TEC1-12710 cooling module as an
example, the manufacturers datasheets show that
DS = 68C, Imax = 10 A, and Vmax = 15.4 V under
the condition that TH = 27C. Through the configu-
ration dialog of TEC block, the model parameters
are S 0:0513 V/K; R 1:1909 X; jth 0:8757 W/K,
and Z 0:0026 K 1 ; as shown in Fig. 1b. The out-
put characteristics of TCI and TCV for the TEC
are shown in Fig. 2. In order to control the cold-side
temperature to the value of 270 K, the output cur-
rent and power supply voltage are set to 2.1 A and
4.1 V, respectively.
From the standpoint of TEG applications, it is
highly desirable to maximize power output, which is
the load power at the matched load of RL = R. The
maximum current is the short-circuit current at
VL = 0, i.e.,
ISC 2Im 2Wm =Vm :
Therefore, the voltage output can be formulated as
V RI  ISC :
The hot-side temperature TH is a source input and
the temperature difference can be obtained for a
given cold-side temperature TC as DT TH  TC .
Then, the current output and voltage of the TEG
can be calculated from Eqs. 29 and 32 with the
temperature of the heat source remaining constant.
The output power and thermal efficiency can be
represented as functions of the electric current.
The proposed model and its subsystem for TEG
module are implemented using Matlab/Simulink as
shown in Fig. 3ac. In order to make the proposed
model easier to use and understand, an image file of
the TEG icon is used as a masking icon. The user-
friendly icon is shown in Fig. 3a. In addition, the
masked model is designed to have a dialog box as
shown in Fig. 3c, in which the parameters of the
TEG module can be configured in the same way as
for Simulink block libraries.
Tsai and Lin
5 20
4.5 18
4 16
(29)
Voltage (V) / Efficiency (%)
3.5 14
3 12
Power (W)
2.5 10
2 8
1.5 6
1 4
: Voltage (V)
0.5 : Power (W) 2
: Efficiency (%)
0 0
0 2 4 6 8 10 12 14 16
Current (A)
Fig. 4. IV and IW output characteristics.
Taking an HZ-20 module for example, the man-
ufacturers datasheets show that TH = 230C, TC =
30C, Wm = 19 W, Vm = 2.38 W, and gmax = 4.5%.
Through the configuration dialog of TEG block,
one can calculate the model parameters: S
0:0238 V/K; R 0:2981 X; jth 1:6985 W/K, and
Z 0:0011 K1 ; as shown in Fig. 2b. The output
characteristics of IV and IW for the TEG are
shown in Fig. 4. The TEG has maximum power
output with the matched load of RL = R. Taking the
hot-side temperature as an input variable, the out-
put characteristics of current, voltage, and power at
the matched load are depicted in Fig. 3ac. These
results reveal that the maximum power is about
19 W at I = 7.9832 A and V = 2.3800 V, and the
(31) maximal thermal efficiency is 4.5% as I approaches
about 7.2 A. For the MPPT design of the TEG,
the working voltage of the DCDC converter is
controlled at 2.38 V.
(32)
CONCLUSIONS
The utility of both TEC and TEG modules is based
on the commercial datasheets of TEM manufactur-
ers. TEM parameters can be extracted and perfor-
mance analysis conducted in this way. The TEC and
TEG models proposed herein are compatible with
Matlab/Simulink libraries for further DC and AC
electronic circuit simulation. These models are built
in the same way as Simulink block libraries. The
masked icon makes the block model more user-
friendly, and a dialog box allows the user to con-
figure the TEM model easily. Such user-friendly
blocks are easy to use for applications of tempera-
ture control systems and maximum power point
trackers. On the other hand, validation experiments
of the proposed TEC and TEG models are still
lacking; they will be carried out at the Clean Energy
Research Center (CERC) of Da-Yeh University.
Model Building and Simulation of Thermoelectric Module Using Matlab/Simulink
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