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DK2131 Ch17 PDF
DK2131 Ch17 PDF
Spectroscopic Techniques in
Adhesive Bonding
W. J. van Ooij
University of Cincinnati, Cincinnati, Ohio, U.S.A.
I. INTRODUCTION
This chapter reviews the many dierent spectroscopic techniques that can be used to study
the composition and performance of adhesively bonded materials. Such a review was
deemed necessary because many new analytical techniques have been developed lately
and a large number of interesting applications have been published recently. The most
widely used spectroscopic techniques are x-ray photoelectron spectroscopy (XPS, also
called ESCA), Auger electron spectroscopy (AES), secondary ion mass spectrometry
(SIMS), and infrared spectroscopies (FTIR). The distinction should be made here between
microscopic and spectroscopic techniques for surface and interface characterization. Both
types of techniques are invariably applied for the development and failure analysis of
adhesives. Examples of microscopic techniques are optical microscopy, scanning electron
microscopy (SEM), transmission electron microscopy (TEM), scanning transmission
microscopy (STEM), scanning tunneling microscopy (STM), and atomic force microscopy
(AFM). In general, spectroscopic techniques provide qualitative analysis of the chemistry
of a surface or an interface, although in certain cases quantitative analysis is possible.
Microscopic techniques are primarily employed to study surface and interface morphology
of adhesives and adherends. When these techniques are applied to failure surfaces, impor-
tant information on failure modes can be obtained.
This review is limited to spectroscopic techniques. Excellent reviews already exist on
the use of microscopic methods in adhesive bonding technology [1,2].
In general, the applications of spectroscopic techniques in the study of various
aspects of adhesive bonding that have been reported are the following:
Surface characterization of materials prior to bonding; cleanliness, surface contam-
ination, oxide thickness, and so forth
Modication of surfaces to improve bondability; examples are modication of poly-
mer surfaces by plasma or corona treatments, anodization or other treatments
of metals, plasma lm depositions, deposition of functional silanes or other
coupling agents to metal surfaces, and so forth
Table 1 lists a wide range of spectroscopic techniques with details on the type of informa-
tion that these techniques can provide, their sampling depth, their sensitivity, and their
major limitations. Some key references are provided for each technique. The techniques
are classied in ve major categories: ion spectroscopies, electron spectroscopies, x-ray
spectroscopies, vibrational spectroscopies, and miscellaneous techniques. This distinction
is, of course, arbitrary and is based on the type of signal that is recorded in each technique.
It would be equally justiable to classify the techniques on the basis of the primary beam
or excitation source or even on sampling depth [3]. However, in each group a distinction
has been made between those techniques that are well known and currently widely used
and techniques that are either variations of the major techniques or still in a develop-
mental stage. The techniques that are closely related or that are variations of the same
main technique are grouped together.
Another way of comparing techniques is to group them according to the combina-
tion of excitation (i.e., signal in) and response (i.e., signal out). This is frequently done in
the literature [4]. This has been done here for a number of the techniques listed in Table 1.
The results are shown in Table 2, which illustrates that a technique has been developed or
proposed for almost all combinations of ions, electrons, and photons.
Table 1 indicates that the sampling depth for the various techniques varies from 1
monolayer to several millimeters. In general, the ion-based techniques, for instance SIMS
and ISS, have the lowest sampling depths because the mean free path of ions in solids is
not more than one or two monolayers. The penetration and escape depths for photons are
much higher and, therefore, the techniques that are based on the detection of electromag-
netic radiation, such as FTIR and XRF, give information on microns in metals and even
millimeters in organics. This does not mean, however, that these techniques cannot detect
monolayers. In suitable samples, both FTIR techniques and XRF can detect monolayers
with high sensitivity, but it is dicult to restrict the signal acquisition to the monolayer
only because of the larger sampling depths.
Methods based on electron detection have intermediate sampling depths. The
sampled thickness in techniques such as AES and XPS is of the order of 50 A. Since
the escape depth of an electron is dependent on its energy, the sampling depth in XPS and
Sampling
Technique Acronym depth Information Sensitivity Principle Limitation Ref.
A. Ion spectroscopies
Secondary ion mass spectrometry SIMS 5 A Mass spectrum; All elements Ion beam excitation UHV; 79
Static SIMS SSIMS mapping;
monolayer qualitative; 6
Time-of-ight SIMS TOFSIMS SNMS also matrix eects; 28
Surface analysis by laser ionization SALI depth prole 12
Fast atom bombardment SIMS FABSIMS 6
Secondary neutrals mass spectroscopy SNMS 8
Laser microprobe mass analysis/ LAMMA, 1 mm Mass spectrum All elements Laser excitation Reproducibility; 105
spectrometry LAMMS of small area damage
Laser ionization mass analysis LIMA
Laser ionization mass spectrometry LIMS
Ion scattering spectroscopy ISS 2 A Elements; <1 monolayer Ion beam scattering Spectral 106
Low-energy ion scattering LEIS(S) heavier than resolution 107
spectroscopy primary ion
Medium-energy ion scattering MEIS(S)
spectroscopy
High-energy ion scattering HEIS(S)
spectroscopy
Rutherford backscattering RBS >1 mm Depth prole; High Scattering; Equipment cost 101104
spectroscopy nondestr. meV ions few elements
Neutral scattering spectrometry NSS 108
Nuclear reaction analysis NRA 1 mm 111
Electronstimulated desorption ESD 5 A Mass spectrum; <1 monolayer e beam Poor sensitivity; 109
spectroscopy small spot excitation e damage
Electron-induced ion desorption EIID 110
Electron-stimulated desorption ion ESDIAD
angular distribution
(continued )
Copyright 2003 by Taylor & Francis Group, LLC
Table 1 Continued
Sampling
Technique Acronym depth Information Sensitivity Principle Limitation Ref.
Single photon ionization SPI As SIMS Mostly as Lower than SIMS Postionization Lower 12
Surface analysis by resonance SARISA SIMS; more of sputtered sensitivity
ionization of sputtered atoms quantitative neutrals than SIMS
Resonantly enhanced multiphoton REMPI
ionization
Non-resonant multiphoton ionization NRMPI
spectroscopy
B. Electron spectroscopies
Auger electron spectroscopy AES 1050 A; Elements; >He; 0.1 at. -% e beam UHV; 14, 18
Scanning Auger microscopy SAM to 1 mm depth proles excitation; conductors
X-ray induced Auger electron XAES in depth e detection only; limited
spectroscopy proling; chemical info
Ion-induced Auger electron IIAES mapping 8
spectroscopy
Ion neutralization spectroscopy INS 112
Appearance potential spectroscopy APS 113, 131
Electron energy loss spectroscopy EELS 50 A All elements 0.1 at. -% e excitation in Low sensitivity 17
Scanning low energy electron SLEELM SEM/TEM 116, 117
energy loss microscopy
Ionization low spectroscopy ILS 118, 132
C. X-ray spectroscopies
Energy-dispersive x-ray analysis EDXA 1 mm Elements; >B 0.01 at. -% e beam; hn No chemical 119
Wavelength dispersive x-ray WDXA PIXE less detection info; not
analysis surface
Electron probe microanalysis EPMA sensitive
Particle-induced x-ray emission PIXE 120
Extended x-ray ne structure EXAFS varies Chemical states Low Oscill. in x-ray Slow; 121, 122
spectroscopy spectra synchrotron
Surface extended x-ray ne SEXAFS
structure spectroscopy
Near-edge x-ray absorption ne NEXAFS
structure
X-ray absorption near edge structure XANES
D. Vibrational spectroscopies
Fourier transform infrared FTIR 10 mm Molecules, Low Excitation of Mainly 38, 40,
spectroscopy functional bonds by hn qualitative 124
Diuse-reectance infrared Fourier DRIFT groups
transform spectroscopy
(continued )
Copyright 2003 by Taylor & Francis Group, LLC
Table 1 Continued
Sampling
Technique Acronym depth Information Sensitivity Principle Limiatation Ref.
Raman spectroscopy RS 10 mm; 50 A Bonds and Low Scattered Low sensitivity; 36, 62,
Laser Raman spectroscopy LRS in SERS molecules photons qualitative 70
Fourier transform Raman spectroscopy FTRS
Hadamer transform Raman spectroscopy HTRS
Surface-enhanced Raman spectroscopy SERS
Resonance Raman spectroscopy RRS
Inelastic electron tunneling spectroscopy IETS 1 monolayer Molecular vibrations Low Excitation Sample 125
by voltage preparation
Glow-discharge optical spectroscopy GDOS > 10 mm Depth prole High Sputtering Quantitative 99, 100
of elements by Ar
ions
E. Other techniques
Low-energy electron diraction LEED 50 A Crystalline Limited 128,
Elastic low-energy electron diraction ELEED surface applicability 129,
Inelastic low-energy electron diraction ILEED structure 130
Reection high-energy RHEED
electron diraction
spins elds
Surface composition analysis by SCANIIR 8
neutral and ion impact radiation
Signal
AES is not the same for all elements detected in the sample. Further, by varying the angle
between the sample surface and analyzer, the sampling depth can be varied, resulting in a
nondestructive quantitative concentration depth prole in the range 550 A. This feature
is especially useful in XPS.
The type of information provided by the techniques listed in the tables also varies
greatly. Many spectroscopic techniques give qualitative and/or quantitative elemental
composition. The vibrational techniques, however, generally provide information on the
molecular structure. SIMS, especially in the static mode (SSIMS or TOFSIMS), can yield
information on molecular structures and even orientation of monolayers [510]. This is
particularly useful for the study of the absorption of coupling agents on metals or to
determine the eects of plasma treatments on polymer surfaces [11]. TOFSIMS instru-
ments also have capabilities for determining the two-dimensional distributions of elements
or molecular species at the surface, similar to the capabilities (for elements only) oered by
AES and EDXA or WDXA.
The major technique for determining a depth prole of elemental compositions is
AES. A newer technique for this purpose is SNMS, which has a better interface resolution
(due to a lower sampling depth) than AES and a better sensitivity for many elements than
AES [10,12,13]. In SNMS the neutrals emitted in the SIMS process are ionized and then
mass-analyzed. The emission of neutrals is much less matrix-dependent than the emission of
positive or negative ions detected in regular SIMS. Depth proling can also be done in
regular SIMS (the so-called dynamic SIMS version), but this technique then requires exten-
sive calibration of sputtering rates and elemental sensitivities. Depth proling in both AES
and SIMS techniques is done by sputtering, usually by means of a beam of Ar ions.
Despite the enormous number of spectroscopic techniques that have been described and
developed, only a limited number are commercially available and are actually used in the
study and development of adhesive bonding materials. These techniques will be described
in more detail in this section.
The techniques highlighted here are XPS, AES, SIMS, various forms of FTIR,
Raman spectroscopies, and HREELS. This selection is based on their relative ease of
application and interpretation, their commercial availability, and the unique capabilities
that each technique possesses for the study of an aspect of adhesive bonding. These
capabilities are also highly complementary. The applications discussed are chosen to
illustrate the applications in three major areas described earlier: surface characterization,
modication of metal or polymer surfaces, and analysis of interfaces.
Dynamic SIMS. In this version of SIMS, the total ion dose is much higher than in
static SIMS, up to a factor of 104. Therefore, sputtering is now the dominant process and
an elemental depth prole is obtained [27]. Organic structural information is no longer
contained in the spectra, because organics decompose to the elements and CHx fragments.
Therefore, concentration depth proling of organic materials, with retention of some of
the molecular structure, is impossible. However, some information can be obtained if one
of the constituents is specically isotopically labeled, for instance by deuterium. As in
AES, the proling process can be automated. As a result of the lower sampling depth in
SIMS, the depth resolution is better than in AES. On the other hand, the quantication of
elemental concentrations is more complicated in SIMS because ion emission is strongly
matrix-dependent.
Imaging SIMS. In this variation, the ion beam is rastered across a surface and a
two- dimensional distribution of elements or organic materials is obtained. If this version
is combined with the static SIMS mode, mapping of each peak observed in the spectrum
can be performed, so even in mixtures of many organic compounds each component can
be individually mapped as long as the component has at least one specic peak in the
spectrum. For metals, oxides, and semiconductors, the mapping capabilities are similar to
that of AES, although the sensitivity for many elements in SIMS is much higher. An
example of mapping of an organic compound is shown in Fig. 3.
those of the quadrupole analyzer. As a consequence, TOFSIMS has higher sensitivity (so
that spectra can be recorded with lower total ion dose) and a mass resolution that enables
peaks with nominally the same mass to be separated. The actual resolution obtained
depends on the quality of the ion gun, which has to deliver pulses at the nanosecond
level rather than being run continuously, as in quadrupole SIMS.
Because of the high mass accuracy, peak identities can now also be identied
uniquely. An example is given in Fig. 5. This capability has removed most of the guess-
work from SIMS analysis and has opened up many applications in materials science that
are impossible in quadrupole SIMS because of peak overlap. For instance, studies of most
practical metals, e.g., Al, are very dicult in quadrupole SIMS because the metal ions of
interest almost always overlap with organic ions at nominally the same mass. Another
important advantage of TOFSIMS is the much higher mass range than in quadrupole
SIMS, which enables very large ions to be detected. An example is illustrated in Fig. 6,
which shows the distribution of oligomers present in the surface of a polymer sample [23].
However, such results cannot be obtained with bulk materials. The polymer has to be
present as an extremely thin lm on an active metal (usually Ag). In the SIMS process the
oligomers, which are emitted as neutral molecules, then become cationized by Ag ions.
The spectra in TOFSIMS are similar to those in quadrupole SIMS, but not identical.
The time-of-ight analyzer can detect ions with a much greater kinetic energy spread than
the quadrupole. Therefore, inorganic ions or low-mass organic fragments, such as C and
CH, which are emitted with high kinetic energies, appear in higher intensities in
TOFSIMS spectra than in quadrupole spectra.
TOFSIMS is rapidly gaining popularity as a tool for studying chemistry and orien-
tation at organic surfaces, such as polymers and polymer blends. The problem of surface
charging (the surface charges up positively as a result of electron emission) has been
satisfactorily solved by the development of pulsed electron sources, which neutralize the
charge. Imaging (as shown in Fig. 3) can be performed routinely with high sensitivity and
sub-micron resolution. A limitation of the technique is, however, that standard spectra of
many materials are not yet available. Although much can be derived from the chemistry of
the material (if known!) and the exact mass of the ions, in many cases it is not possible to
identify exactly the composition or structure of the material. Much more work needs to be
done in this area before the technique can be applied routinely by unskilled analysts.
Fortunately, several databases (for quadrupole SIMS) have been published [19,20] and
others (for TOFSIMS) are being prepared.
made. XPS was performed on the same samples at two dierent takeo angles. Lowering
the takeo angle increases the surface sensitivity (sampling depth) of the technique. Shown
in Fig. 7a are the Si2p lines from which the conclusion can be drawn that the surface of the
lm is enriched in SiO bonds, whereas the bulk has a higher concentration of SiC bonds.
In Fig. 7c, parts of the TOFSIMS spectra are shown of the same lm before and after
solvent cleaning. This rinse was performed to check on the presence of low molecular
weight materials at the lm surface, which are known to form in plasma polymerization.
This rinsing treatment had practically no eect on the XPS and AES results, but the
TOFSIMS spectra before and after rinsing are quite dierent. Before rinsing, the spectrum
resembles that of polydimethylsiloxane [19,20]; after cleaning the surface is similar to that
of SiO2. The spectrum indicates a high concentration of silanol groups, as can be con-
cluded from the high intensity of the peak at 45 amu (SiOH). The peak identication
and the t between observed and calculated masses are shown in Table 3 for a silane lm
on CRS [31]. Only those compositions were accepted that had a deviation of less than 0.01
amu from the calculated mass. It is clear from this example that application of the three
pH 10.5 pH 8.0
Ion Composition im a
Counts/yieldb ima Counts/yieldb
1 H 0 50.57 0 28.92
16 O 2 16.70 3 12.60
17 OH 2 10.55 1 5.56
17 NH 3 1 0.41 1 1.42
18 NH 4 2 0.80 2 2.65
28 Si 0 23.30 0 19.29
31 CH5N 1 0.80 3 3.42
35 Cl c 0 28.60
39 d
C2HN/C3 H 3 1 1.85 2 4.18
41 CHN 2 7 0.13 5 0.07
41 d
C3H5/C2H3N 3 3.30 3 5.90
42 d
C2H4N/C3 H 6 3 2.06 2 2.48
43 d
C3 H 7 =C2 H5 N
4 2.73 1 2.60
44 SiO 10 3.01 10 1.35
45 Si(OH) 2 2.15 8 2.86
55 C4 H 7 5 1.14 2 1.03
56 Fe 0 4.76 3 0.44
60 SiO 2 2 0.26 1 0.27
61 HSiO 2 11 0.15 10 0.13
62 SiOH 2
77 HSiO 3 6 0.07 5 0.065
79 SiO 3 6 0.15 3 0.36
89 C2H7NSiO 1 0.01 1 0.01
100 C2 H2 NSiO 2 3 0.60 3 0.10
102 C2 H4 NSiO 2 1 0.13 2 0.15
105 C3 H11 NSiO
118 C3 H10 N2 SiO 4 0.03 4 0.008
121 C3 H11 NSiO 2
121 HSi2 O3 NH 2 0 0.013 2 0.009
127 C2H3SiOFe 10 0.028
137 HSi2 O4 NH 2 5 0.008 5 0.005
147 (CH3)5Si2O 5 0.05
149 C3 H11 NFeO 2 4 0.17
163 C4 H13 NSi2 O 2 5 0.06
207 C5 H15 Si3 O 3
221 C7 H21 Si3 O 2
281 C7 H21 Si4 O 4
a
Dierence between listed composition and measured mass in milli-amu.
b
Ratio of counts in peak area and total ion yield.
c
Ions listed without im and counts/yield values are for methanol-cleaned sample only.
d
At pH 10.5/pH 8.0.
Source: Ref. 31.
B. Vibrational Spectroscopies
The major spectroscopic techniques for use in adhesive bonding technology that are based
on vibrational principles are several forms of infrared spectroscopy, Raman spectroscopy,
and the more recent technique HREELS, the vibrational version of EELS used in electron
microscopes. These techniques will be discussed in this chapter and some recent develop-
ments and applications of the techniques in adhesion studies will be given. Raman and IR
The principles of these three major categories are shown in Fig. 12. ATR is useful
primarily for identication of polymer lms, liquids, or other materials that can be coated
onto a crystal of high refractive index, such as Ge. The sample must be in very good contact
with the crystal for good spectra to be obtained. IR light is shone into the crystal at an angle
of incidence that is higher than the critical angle of reection for the crystal, so internal
reection of the radiation occurs and its intensity is attenuated as a result of absorption by
the sample. Mostly rectangular crystals are used, but circular crystals have recently been
developed for the study of aqueous solutions, lms, and bers [4346]. Although the
requirement of intimate contact between crystal and sample is severely limiting, the tech-
nique has the useful capability of providing a depth prole by varying the angle of incidence
or by using crystals with dierent optical densities. As an example, the surface crystallinity
or orientation of bers with respect to their axis has been reported [46]. Further, the
technique is uniquely suited for the study of solid/aqueous interfaces.
The technique of choice for studying thin lms on metals (or certain other substrates)
directly is single reection RAIR [4754]. The limitation here is that the substrate must be
very smooth, but this can be easily achieved by polishing the metal before deposition of the
lm. Characterizations of thin organic layers on metal (oxide) surfaces, such as occur in
lubricants, corrosion inhibitors, adhesives, polymers, paints, and so forth, are specic
applications of this rather recent form of FTIR. It should be noted that the relative
band positions and shapes may be dierent in this technique than in conventional trans-
mission IR. The spectrum may also change with the thickness of the organic lm, which
implies that polymer/metal interactions are in principle observed [47,51]. The technique is
so surface sensitive that oxidation of metals can be determined in situ [51] and the packing
and Alpolyimide [8486]. Very recently the interfaces formed between vacuum-evapo-
rated Al and polyvinyl alcohol, polyacrylic acid, and polyethylene terephthalate (PET)
were investigated [87]. Figure 15 shows the HREELS spectrum of PET. The vibrational
assignments and their comparison with IR intensities are shown in Table 4. The HREELS
spectra observed during PET metallization are shown in Fig. 16. The bands that disappear
are those of OCH2 and C O, and the new band that forms has been ascribed to the
formation of a COAl group and eventually a carboxylate.
Figure 16 High-resolution electron energy loss (HREEL) spectrum of a metallized PET sample;
(a) clean PET; (b)(g) increasing coverage of the PET by Al atoms. (From Ref. 78.)
C. Miscellaneous Spectroscopies
The ion/electron and vibrational spectroscopies are the most widely used techniques in
adhesive bonding technology. However, several lesser known spectroscopies are worth
mentioning here briey also, because they can provide unique information on metal
polymer interfaces in certain cases. A more complete list with suitable references is
given in Table 1. The techniques that are discussed in this section are ellipsometry, elec-
trochemical impedance spectroscopy (EIS), glow discharge optical spectroscopy (GDOS),
and Rutherford backscattering spectroscopy (RBS).
1. Ellipsometry
This is a widely used optical technique for measuring lm thicknesses. The technique uses
polarized light at oblique incidence and yields information on the optical constants of
materials and the thickness of overlayers. The signal is generated by interference of the
components of the primary beam, which are reected at phase boundaries between the
substrate and the lm. Best results are obtained when the lms are no thicker than only a
few multiples of the wavelength of the light. Discontinuous or island lm structures can
also be studied. An ellipsometric analysis gives two numbers delta and psi ( and ),
which together dene the so-called complex reection ratio r of the reection coecient
in the directions parallel and perpendicular to the plane of incidence. More information on
the principles can be found in the literature. There is a wealth of literature on the subject
[8891], both concise introductions and more comprehensive discussions or conference
proceedings.
For applications in adhesive bonding research or technology, ellipsometry is useful
for the quantitative determination of lm thicknesses. Especially aluminum is a metal that
has been studied extensively. It lends itself well to oxide thickness measurements because
Al2O3 is transparent, which is a requirement. The thickness of the oxide formed in certain
media can be determined [92]. Other studies reported on the use of ellipsometry to inves-
tigate the corrosion or rate of oxide lm dissolution in certain environments in situ. As the
lm dissolves, the formation of pores and dierences between the densities of dierent
layers in the oxide lm can be distinguished and related to the conditions of the anodizing
process [93].
Figure 17 Electrochemical impedance data (Bode plots) for epoxy-coated steel as a function of
immersion time in 0.5 N NaCl solution. (From Ref. 98.)
Cp capacitance of coating; Rpo pore resistance of coating; Cdl double-layer capacitance (interface);
Rp polarization resistance (interface); R1 slope of impedance curve in range 102104 Hz.
Source: Ref. 98.
galvanized steel [100]. Residual elements such as carbon can be detected below the coating.
Also, entire conversion coatings can be proled rapidly, such as phosphates and chromates
or anodization layers, which are beyond the scope of AES or SIMS depth proling. The
technique could thus be used in quality control, for instance for determining the homo-
geneity of electrodeposits across the width of the strip, or for control of the oxide thickness
in metal pretreatment operations.
The technique requires only a moderate vacuum and has a spatial resolution of a few
millimeters. Currently, two commercial instruments are available. Most elements can be
detected, including hydrogen. Limitations are the quantication, which requires suitable
standards, and the sample has to be electrically conductive. Nonconductive samples can be
analyzed only by grinding them and mixing them with a metallic or graphite powder.
As a typical example, Fig. 18 shows the depth prole of a several microns thick
metallic coating on steel [100].
small fraction of the primary particles. Below the surface, inelastic energy losses occur
also. Therefore, the mass scale can also be converted to an energy scale. These principles
are schematically shown in Fig. 19.
In addition to providing a depth prole, RBS can also give crystallographic infor-
mation if the instrument is equipped with a precision goniometer. In certain directions of
single crystals the phenomenon of channeling occurs. The backscatter yield is reduced
when the beam is aligned with the major low index axes [104]. By aligning both incident
and reected beams along such directions, the relative positions of surface atoms can be
determined with high precision. Also, the sites of impurity atoms can be determined,
because for interstitial positions the backscatter yield is the same as for the random
direction value.
RBS can be considered an almost ideal tool for the analysis of thin lms of a few
microns thickness if stoichiometric information is required. All elements >H are detected.
Quantitative measurements of lm thickness and composition and concentrations of
impurities can be performed. A single RBS spectrum can show the amount of an impurity
and its distribution throughout a thin lm.
In general, however, only rather simple structures and compositions can be investi-
gated successfully. The depth range that can be accessed varies but is of the order of 12
mm for proton and alpha particle beams. This depth depends on the primary particle
energy, which has an upper limit of a few meV above which nuclear reactions may
occur. The depth resolution is very high, e.g., 10300 A, and can be improved for very
low depths by tilting the sample.
Table 6 summarizes some of the parameters of RBS and Fig. 20 shows an example of
the quantitative measurement of the epitaxial growth of an oxide lm [101].
This chapter summarizes the principles of some of the many spectroscopic techniques that
are available for the analysis or study of aspects of adhesive bonding science and technol-
ogy. As indicated in Table 1, there are dozens of techniques and new acronyms appear
almost on a daily basis. The number of instrumental spectroscopies available today to the
scientist is bewildering, especially the many techniques for surface characterization.
Therefore, it is likely that some techniques have been missed, although it was attempted
to cover them all, at least in Table 1. The choice of techniques from that listing that were
actually discussed in this chapter had to be limited and was in some cases somewhat
arbitrary and subjective. However, some emphasis was put on techniques that can be
used in the study of the science of adhesive bonding technology. Techniques for routine
analysis, e.g., NMR or the various mass spectrometries, were not discussed in depth.
It is clear that tremendous developments have been made in recent years with certain
techniques. A large number of spectroscopic techniques are now available that can be
adapted, with little or no adaptation, to the study of various aspects of adhesive bonding.
REFERENCES
1. E. A. Ledbury, A.G. Miller, P.D. Peters, E.E. Peterson and B.W. Smith, Proc. 12th Natl.
SAMPE Techn. Conf. Series, SAMPE, Azusa, CA, 1980, p. 935.