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IADR General Session

April 1-4, 2009

Miami, FL

1800 A Comparison of Shear Bond Strengths Among Different Self-Etching Primers

Friday, April 3, 2009: 2 p.m. - 3:15 p.m.


Location: Exhibit Hall D (Miami Beach Convention Center)

L. EVANS, K.R. MCGRORY, J. ENGLISH, S.Z. PAIGE, J.C. ONTIVEROS, J.M. POWERS, G.N. FREY, and P.J. DUKE,
University of Texas Dental Branch at Houston, Houston, TX
Objective: This study investigated whether three different self-etching primers have comparable shear bond
strengths to a conventional bonding system. It also looked at how each responded when contaminated with either
saliva or water.

Methods: The sample of 240 bovine incisors was divided into 4 groups of 60 each. Each group tested one of four
bonding systems: conventional 35 % phosphoric acid etch, 3M Unitek Transbond Plus Self-etching Primer, Reliance
Self-etching Primer, and GAC Ideal 1 Self-etching Primer. The 4 groups were further divided into 6 groups of ten
with bond strength tested under 3 different conditions (saliva contamination, water contamination, and according
to manufacturer's instructions) and at two different times (15 minutes and 24 hours) post-bond. The shear bond
strength was measured on a universal testing machine.

Results: Analysis of variance and Fisher's PLSD multiple comparisons test was performed at the 0.05 level of
significance. In five of the six groups that compared the primers, Reliance SEP had the highest bond strengths.
However, for two of the groups, the measurements were not significantly different than those of the conventional
phosphoric acid etching system. In all six groups, GAC Ideal 1 had the lowest bond strengths. Although the saliva
and water contamination groups showed lower bond strengths in some of the groups, the measurements were still
well above the minimum recommended bond strength for orthodontic bonding.

Conclusions: Both Transbond Plus Self-etching Primer and Reliance Self-etching Primer had bond strengths similar
to those of the control group treated with phosphoric acid.

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