Scribd
Upload
407 views3 pages

PCB Assembly Process Overview

The document summarizes the PCB assembly process at PT. SMT, which involves two main processes: reflow and final assembly. In the reflow process, solder paste is applied via machine and components are mounted before being sent through a reflow oven. In final assembly, the front and back of the PCB are connected, soldered, repaired if needed, and inspected through various machines to check characteristics like switches, resistors, and insulation before final packaging.

Uploaded by

rizkiamandas
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
407 views3 pages

PCB Assembly Process Overview

The document summarizes the PCB assembly process at PT. SMT, which involves two main processes: reflow and final assembly. In the reflow process, solder paste is applied via machine and components are mounted before being sent through a reflow oven. In final assembly, the front and back of the PCB are connected, soldered, repaired if needed, and inspected through various machines to check characteristics like switches, resistors, and insulation before final packaging.

Uploaded by

rizkiamandas
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd

Understanding PCB Assy Process

I. Summary Activity
Understanding assembly process timer H3CR
II. Purpose
New Employee can understanding assembly process of H3CR and can apply the knowledge to give
a contribution and solution to improve quality products.
III. Result

PCB Assy process at PT. SMT can be done in 2 process, there is reflow process

Raw Preparation Front Assy Final Assy


Material Line

1. PWB Preparation : Install label to pwb and insert pwb to tray

2. Solder pasta machine :

 Add pasta to the machine and printing test for every changing PWB type
 Stencil (Metal Mask ) Thickness setting is 0,15 mm for solder pasta and 0,2 mm for adhesive
 Stencil Hole size following OMS standard
 After the process, machine do inspection, if NG operator do the checking

3. Part Mounting Machine:


a. Operator put the part to the machine regarding part list
b. Machine do high speed mounting, if part drop in suction process or part split in 2 or more
pieces machine detect NG
4. Reflow Machine
a. This machine for hardened solder pasta and component so the component can’t be released
easily
b. This Machine using 7 pre heat machine, temperature range for the machine is 150 – 250 0C
for solder pasta and 150-160 0C for adhessive
c. Time is 1,1 s/M
5. Inspection Area
Picture 2

d. Cutting PCB I/O then assembly with pcb front and PCB Power, then do soldering.
e. Repair the part with machine to remove solder ball.
f. Inspect VR with machine, this machine function is for input value VR after VR has been
programmed in front line and calibrating it.

Picture 3

g. Inspect switch is to check operating mode, scale and time range.

Picture 4

h. Inspect H/V to check insulation resistance of the product.

Picture 5
i. Then final inspect the product to check characteristic of the product. If Ok then packing the
product.

Picture 6

You might also like