ELNC-6004-23s
Electronic Components & Processes
SOLDER PROJECT PCB
PURPOSE
Assemble a circuit card assembly
Practice soldering various electronic components on to a printed circuit board
Practice soldering wire leaded components on to a printed circuit board
Clean and inspect workmanship and evaluate
OBJECTIVES
After completing this exercise, you should be able to:
• Demonstrate soldering of various electronic components on to a PCB
• Demonstrate soldering of wire leaded components on to a PCB
• Evaluate workmanship for solder joint acceptability
MATERIALS
• SKLS-1021 Soldering Kit
• Components from previous lab, Component Preparation
• Soldering Iron & Tips
• 63/37, tin-lead, rosin core solder
• Isopropyl Alcohol, 99%
• Cleaning brush
• Needle-nosed pliers
• Wire cutters
Lab 4 - Solder Project PCB – ELNC-6004-23s Page 1 of 6
Created by: C. Talbot, Revised by: W. Bąk
ELNC-6004-23s
Electronic Components & Processes
PROCEDURE
When building a circuit card assembly, it is important to install components with the lowest standing
profile first. The profile is the height from top of the installed component to the surface of the PCB. If
larger profile components are installed first, access for installing smaller profile components may be
obstructed.
PHASE 1
1. From the kit, select 16 resistors of any value.
2. On the Component Side of the PCB, Top side,
insert and clinch each resistor at the locations shown in Figure 1.
The components MUST be installed flat to the PCB, balanced between their lands and with
colour code bands read in the same direction.
Figure 1: Resistor locations
3. On the Solder Side of the PCB, Bottom side, solder each lead to its land.
4. Trim each lead at each sloder joint.
5. Clean every solder joint with isopropyl alcohol until residue is gone, then inspect your
workmanship.
6. Have your work checked and evaluated by the Instructor. You may be requested to re-
touch solder joints or redo this phase.
Student Name: ______________________ Instructor: ______________________
Date: _________________
Lab 4 - Solder Project PCB – ELNC-6004-23s Page 2 of 6
Created by: C. Talbot, Revised by: W. Bąk
ELNC-6004-23s
Electronic Components & Processes
PHASE 2
1. Select:
(1) 1N4148 diode
(4) 8-pin IC sockets
(1) 14-pin IC socket
Figure 2: Diode and Socket Locations
2. On the Component Side of the PCB
- insert and clinch the diode then IC sockets on the PCB in the locations shown in Figure 2.
- The components MUST be installed flat to the PCB with polarities as indicated in Figure 2.
3. On the Solder Side of the PCB, solder each lead to its land.
4. Trim any excess leads from the solder joints.
5. Clean every solder joint with isopropyl alcohol until residue is gone, then inspect your
workmanship.
6. Have your work checked and evaluated by the Instructor. You may be requested to re-
touch solder joints or redo this phase.
Student Name: ______________________ Instructor: ______________________
Date: _______________________
Lab 4 - Solder Project PCB – ELNC-6004-23s Page 3 of 6
Created by: C. Talbot, Revised by: W. Bąk
ELNC-6004-23s
Electronic Components & Processes
Figure 3: Transistor and Capacitor Locations
PHASE 3
1. Select the transistor and 5 small capacitors.
2. On the Component Side of the PCB, insert and clinch the transistor and capacitors in the locations
as shown in Figure 3. ENSURE the bodies stand ¼”, ~6mm above the PCB surface.
3. On the Solder Side of the PCB, solder each lead to its land.
4. Trim any excess leads from the solder joints.
5. Clean every solder joint with isopropyl alcohol until residue is gone, then inspect your
workmanship.
Student Name: ______________________ Instructor: ______________________
Date: _________________
Lab 4 - Solder Project PCB – ELNC-6004-23s Page 4 of 6
Created by: C. Talbot, Revised by: W. Bąk
ELNC-6004-23s
Electronic Components & Processes
Figure 4: Trim Pot and Prepared Component Locations
Phase 4
1. Select 3 trim potentiometers and the components from the Component Preparation exercise.
2. On the Component Side of the PCB, insert and clinch the trim pots in the locations shown in
Figure 4. The components MUST be installed flat to the PCB.
Insert and clinch the wires from the prepared components, through the PCB from the
Component Side, in the locations shown on Figure 4.
3. On the Solder Side of the PCB, solder each lead to its land.
4. Trim any excess leads from the solder joints.
5. Clean every solder joint with isopropyl alcohol until residue is gone, then inspect your
workmanship.
6. Have your work checked and evaluated by the Instructor. You may be requested to re-touch
solder joints or redo this phase.
Student Name: ______________________ Instructor: ______________________
Date: ______________________
Lab 4 - Solder Project PCB – ELNC-6004-23s Page 5 of 6
Created by: C. Talbot, Revised by: W. Bąk
ELNC-6004-23s
Electronic Components & Processes
Evaluation Rubric
3 2 1 0
All Components
Completeness Missing Components
Installed
[Stop Grading]
No Solder Joint Acceptable Solder 1-2 Solder Joint >2 Solder Joint
Soldering
Defects Joints Defects Defects
1-2 Acceptable
All Markings Read Markings are Markings Not
Observed Damage
in Same Direction Discernible Discernible
Incidents
Components
Acceptable Vertical 1-2 Tilted or Mounted >2 Tilted or Mounted
Placement Mounted Flush to
Mounting Poorly Poorly
PCB
Components
Acceptable 1-2 Horizontal >2 Horizontal
Balanced Between
Horizontal Mounting Balanced Poorly Balanced Poorly
Thru-holes
Lead Protrusion Lead Protrusion
1-2 Excessive Lead >2 Excessive Lead
Leads Conforms to Class Conforms to Class 2,
Protrusion Protrusion
3, 0.059" 0.091"
1-2 Acceptable
No Damage to >2 Incidents of
Damage Observed Damage
Components or PCB Damage
Incidents
1-2 Incidents of >2 or Residue Not
Cleanliness All Residue Cleaned
Residue Present Cleaned
Stripping at Insulation Stripped ≤ 1-2 Excessive
>2 Excessive Stripping
PCB 1 Wire Diameter Stripping
Student Name: Mark:
_________________________________ _____ / 18
Lab 4 - Solder Project PCB – ELNC-6004-23s Page 6 of 6
Created by: C. Talbot, Revised by: W. Bąk
