18 Document of Part Wise Inspection Process

Work Instructions
Document Version History

Date Version Change Description Changes Made By
th
30 September 2023 1.0 Initial -
Stakeholders List
Stakeholder Name Designation FYI Sign Off Review
1
WORK INSTRUCTIONS
Title: Contents & Revision Status
CONTENTS
Rev.
S.No. Title Doc. No.
No.
Standard Operating Procedure for Manual
1 -- 00
Soldering
2 Resistor Inspection WI/QA/01 00
3 Capacitor Inspection WI/QA/02 00
4 Diode Inspection WI/QA/03 00
5 Inductor Inspection WI/QA/04 00
6 Transistor Inspection WI/QA/05 00
7 PCB Inspection WI/QA/06 00
8 Light Emitting Diode (LED) Inspection WI/QA/07 00
9 Product Final Inspection WI/QA/08 00
10 Packing WI/QA/09 00
11 Component Inspection Check List WI/QA/10 00
12 General Guidelines for Inspection WI/QA/11 00
13 General Guide lines for Incoming Inspection WI/QA/12 00
Component Mounting on Printed Circuit Board
14 WI/QA/13 00
Assembly (Acceptance Criteria)
Component Soldering on PCB Assembly
15 WI/QA/14 00
(Acceptance Criteria)
16 General Guidelines for Final Inspection WI/QA/15 00
17 General Guidelines for Sampling Inspection WI/QA/16 00
18 Application and Procedure for Conformal Coating WI/QA/17 00
Cleaning and varnishing of printed circuit board
19 WI/QA/18 00
(Acceptance criteria)
Wire connections (wiring soldered connections
20 WI/QA/19 00
acceptance criteria)
21 Application for local potting WI/QA/20 00
22 Critically in Assembly WI/QA/21 00
23 Fasteners WI/QA/22 00
24 Fixing of Helicoil WI/QA/23 00
25 Identification of Interconnection and Wiring WI/QA/24 00
Qualification of a Product -Preparation and
26 WI/QA/25 00
Conduct
ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:
2
Standard Operating Procedure
For
Manual Soldering
Table of Content
3
s
1. Pre Soldering Activities...................................................................................................................................5
2. Soldering Activity............................................................................................................................................5
3. Post Soldering Activity....................................................................................................................................6
3.1. Cleaning of PCB Assemblies.....................................................................................................................6
4. Check List for Soldering..................................................................................................................................6
5. Dos and Don’ts...............................................................................................................................................6
4
1. Pre Soldering Activities
1. Arrange the work place with the required materials and tools.
a) Materials:
I. Solder wire 63SN/37Pb, 62SN/36Pb/2Ag & 60SN/40Pb (SN-Tin, Pb-Lead) of 22 to 26 AWG. As per the
requirements.
II. Flux RMA of liquid or Paste.
III. Cleaning solvents - IPA EL grade (Iso Prophyl Alcohol), TCE (Trychloro Trifloro Ethane).
b) Tools: Cutter, Thermal / Mechanical Stripper, Tweezers, Desolder Wicks, Cleaning Brush, Tip Activator /
Sponge, ESD Wrist Strap, Soldering Iron, Iron Bits (as per the size requirement).
2. Check for the approval of assembly drawings and part list.
3. Verify the parts as per the part list.
4. Tinning of required leaded components refer to WI/QA/01.
5. Check the PCB for physical and continuity damages.
6. Trimming of PCBs for compatibility.
7. Test Pins / Cleat nuts shall be riveted to the PCB before starting of components mounted on the PCB.
2. Soldering Activity
1. Switch ‘ON’ the Iron. Set the temperature to 275°C up to 300°C as per the requirement of the joint.
2. Use Se-Ionized water to dampen the tip of a cleaning sponge.
3. Wait a few minutes for the soldering iron to warm to the set temperature. Check its readiness by trying
to melt a little solder on the tip.
4. Switch ON the smoke absorber to absorb the fumes formed during melting of flux cored solder.
5. Wipe the tip of the iron on the damp sponge to clean the tip.
6. Melt a little solder on the tip of the iron. This ‘Tinning’ will ensure proper heat transfer.
7. Verify the first Pin, Polarity, Value, Size & Part No. Of the components to be soldered.
8. Components shall be mounted as far as possible in such a manner that markings pertaining to value, part
type, etc., are visible to the extent possible.
9. Place the component on the PCB by using tweezer and align it on to the pads as per the disable layout.
Refer to work instructions WI/QA/13 for component mounting. Care to be taken while using tweezer to
avoid damage to the components and PCB track/pads.
10. Hold the soldering iron like a pen near the base of the handle. Do not touch the hot element.
11. Touch the soldering iron tip flat on to the joint to be made. Ensure it touches both the component
terminal lead and the PCB track for 2 to 5 seconds for normal joint and upto 10 sec for higher thermal
mass area.
12. Feed a little solder on to the joint not on the iron bit to flow smoothly on to the lead / terminal and the
tracks.
13. Remove the solder wire and then the iron to prevent peaking.
14. There shall be no relative motion of the part and the PCB to avoid disturbed joints.
15. While soldering ground points (A PCB having a base plate attached), use a heater plate between 100°C
to 150°C depending upon the size of the PCB.
16. Return the soldering Iron to its Stand.
17. A coat of solder should be left on the iron bit when it is hot and left to idle to prevent oxidation of the
tip surface.
18. Switch ‘OFF’ the iron after use if not required.
19. Inspect the joints closely under 10X magnification for acceptable joints. It should look shiny, smooth
and have a concave shape. Refer to WI/QA/13 for inspection of the joint.
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3. Post Soldering Activity
3.1. Cleaning of PCB Assemblies
1. Manual cleaning with a three tray method.
2. Take three cleaned trays.
3. Fill 1st and 2nd trays with IPA to the level that the PCB is completely immersed.
4. Put the PCB in the first tray and wait for 10 minutes.
5. Clean the PCB with a natural bristle brush until all visible contaminants have been removed.
6. Rinse the PCB assembles in the second tray and clean the left out contamination.
7. Finally, hold the PCB assemblies and clean them by spraying / pouring the solvents from a bottle.
8. Check the PCB assemblies visually for any evidence of the flux residue or other contaminants.
9. Solvent baths in the first tray should be replaced when they become visibly contaminant.
10. Remove the solvent and clean the first tray and place it in the 3rd tray position.
11. Put the 2nd and 3rd trays in 1st and 2nd tray positions and repeat the process.
12. After cleaning, place the PCB assemblies in an anti static covers and offer them for Quality Control
Inspection.
4. Check List for Soldering

1. Weekly check the ESD (Electro Static Discharge) wrist strap resistance in the range of 250KΩ to 1MΩ.
Replace if not meet the value.
2. Check for the correct wattage for soldering iron as per the job requirements to avoid cold joints.
3. Check the potential difference between the ground and tip of soldering iron, about 2mv for proper
grounding.
4. Check for full insertion of the soldering iron bit and tight attachment to the heating element.
5. Check for the contaminants of cleaning solvents in the trays at the end of working shift.
6. ESD control measure shall be ensured during cleaning operations and handling of charge sensitive
devices like CMOS ICS.
5. Dos and Don’ts

1. Do not clean the tips with files, emery cloth & sand paper.
2. Do not solder the joint with a dry tip.
3. Do not use normal water to wet the sponge, use de-ionized water only.
4. Do not use soap to wash the sponge, use de-ionized water only.
5. Do not give a physical shock (tapping on the edge of the table) to remove excess solder on the tip. Clean
on a wet sponge only.
6. Do not use the soldering iron for any other purpose other than soldering.
7. Do not increase the soldering iron temperature while soldering ground points (A PCB having a base plate
attached). Slowly increase the hot plate temperature to the requirement till the solder melts on the joint.
8. Ultrasonic cleaning shall not be used for cleaning assemblies that contain electronic parts.
9. Do not store the PCB assemblies in polythene or similar materials. use anti-static bags only.
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WORK INSTRUCTIONS
Document Ref: WI/QA/01
Title: Resistor Inspection
Page: 01 of 01
1. Type
2. Colour bands / Screening
3. Wattage
4. Tolerance
5. Tinning of leads / Electrodes
6. Physical Damage
7. Value (Measuring with DMM)
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WORK INSTRUCTIONS
Title: Capacitor Inspection
Page: 01 of 01
1. Type
2. Rating
a) Capacitance
b) Working Voltage
3. Tinning of Leads / Electrodes
4. Physical damage
5. Value of the capacitance (Measuring with DMM)
6. Leakage Current
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WORK INSTRUCTIONS
Title: Diode Inspection
Page: 01 of 01
1. Package Type
2. Rating code on body (Marking Case)
3. Cathode marking
4. Tinning of Leads / Electrodes
5. Physical damage
6. Junction Voltage drop(Forward Bias)
7. Junction Voltage drop(Reverse Bias)
8. Leakage Current.
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WORK INSTRUCTIONS
Title: Inductor Inspection
Page: 01 of 01
1. Type
2. Tinning Quality of Leads / Electrodes
3. Physical damage
4. Value measured (Inductance)
5. No. Of turns
6. Wire guage
7. Pitch
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WORK INSTRUCTIONS
Title: SMPS Transformer
Page: 01 of 01
1. Type
2. Tinning Quality of Leads / Electrodes
3. Physical damage
4. Value measured (Inductance)
5. DC Resistance
6. Leakage Inductance
7. No. Of turns
8. Wire guage
9. Pitch
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WORK INSTRUCTIONS
Title: Transistor Inspection
Page: 01 of 01
1. Package Type
2. Rating code / Screening
3. Plating finish on leads
4. Physical damage
5. Forward bias Resistance
a) Base to Emitter
Should be equal
b) Base to Collector
6. Reverse bias resistance

a) Base to Emitter
Should be High (in Mega Ohms)
b) Base to Collector
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WORK INSTRUCTIONS
Title: PCB Inspection
Page: 01 of 01
1. Material Type
2. Layout as per respective films
3. Physical damage
4. Continuity on the track
5. Size
6. Drilling Details
7. PCB thickness
8. Solder Masking Quality
9. Legend as per films
10. Continuity of PTH
11. Quality of Tinning
12. Edges and corners finish (No Burrs)
13. They should not have scratches / cracks on the surfaces
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WORK INSTRUCTIONS
Title: Light Emitting Diode (LED) Inspection
Page: 01 of 01
1. Colour
2. Tinning of the leads
3. Glowing
4. Voltage drop across LED
5. Leakage Current
6. Size
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WORK INSTRUCTIONS
Title: Product Final Inspection
Page: 01 of 01
I. Visual / Mechanical Check:

The following are inspected with respect to given document.
1. The product is inspected for Final Finish Quality and screen-printing details
2. Name plate is verified for correctness of S.No., M.No., Frequency.
3. Mounting holes are verified as per the Template.
4. Spring Washers for all connector-mounting screws to be checked.
5. Check the tightening of all screws.
6. Ensure that protective caps are provided for all the connectors.
7. Inspection is to be carried out for all the units.
II. Electrical Check:

1. Product parameters are inspected as per given document.
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WORK INSTRUCTIONS
Title: Packing
Page: 01 of 01
1. Packing the item inside a polythene cover.

2. Pack the inside thermocole box or corrugated box.
3. The required quantity of these boxes is to be packed inside a master carton box of the correct size. The
master carton box will have to be filled with thermocole sheets.
4. Insert the Installation Manual & Connection Details inside the carton box.
5. All the consolidated Test Reports will be submitted to customer seperately.
6. Close the master carton box and tape on all corners with gum tape.
7. Paste the address slip with details on the carton box.
8. Strap the carton box with a strapping machine.
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WORK INSTRUCTIONS
Title: Component Inspection Check List
Page: 01 of 02
Reference documents
a) Purchase Order.
b) Inward Inspection check list format.
c) Manufacturer’s catalog / data sheet.
1. ICs (Integrated Circuits):-

(a) Physical Check:- 1) Package 2) 1st Pin reference 3) Tinning of Pins 4) Physical damages.
(b) Dimensional Check:- Verify the dimensions as per the data sheet if required ESD care and pins
damage to be taken while handling.
(c) Electrical Checks:- If there are no facilities available in QA to check the Electrical parameters, take
clearance from the user department OR accept the material on the basis of COC and test reports
received from the supplier / manufacturer.
2. Connectors:-
(a) Physical Check:- 1) Type 2) Pin reference marking 3) Tinning of Pins
4) Physical damage. Refer catalog / data sheet.
(b) Dimensional Checks:- Verify the dimensions as per the catalog / data sheet.
(c) Electrical Checks:- Continuity Check.
(d) Any other Checks:- Mating.
3. AC - DC Converters:-
(a) Physical Check:- Refer the data sheet for 1) Pin configuration
(b) Dimensional Checks:- Verify the dimensions as per the catalog / data sheet.
(c) Electrical Checks:-
1) Refer to the manufacturer’s data sheet for recommended instructions before starting the
electrical checks.
2) Apply I/P Voltage to the DUT as per the pin configuration.
3) Apply sufficient resistive load to DUT at the O/P pins and measure the O/P Voltage on full load
condition.
4) In the case of multi-out put converters, apply the required load at all the O/P pins as per the
data sheet and measure the O/P voltage in full load condition.
5) Record all the I/P and O/P Voltages in no load and full load conditions.
4. Resistor Inspection:-
(a) Physical Check:- 1) Type. 2) Screening / Colour bands. 3) Tinning of leads / Terminals. 4) Size /
dimensions. 5) Wattage. 6) Tolerance. 7) Physical damage.
(b) Electrical Checks:- 1) Value (Measure with DMM or LCR meter) 2) Wattage.
5. Capacitor Inspection:-
(a) Physical Check:- 1) Type 2) Rating (a. Capacitance b. Working Voltage) 3) Tinning of leads /
Terminals 4) Physical damage.
(b) Electrical Checks:- Value (Measure with DMM or LCR meter). Refer to the data sheet to select the
frequency on LCR meter if required during testing of Tantalum Capacitors, Voltage.
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WORK INSTRUCTIONS
Title: Component Inspection Check List
Page: 02 of 02
6. Diode Inspection:-
(a) Physical Check:- 1) Type 2) Rating code on body 3) Cathode marking 4) Tinning of Leads / Terminals
5) Physical damage.
(b) Electrical Checks:- 1) In Forward bias resistance should be low, 2) In Reverse bias resistance should
be high (Measure with DMM), Leakage Current & Forward Current.
7. Inductor Inspection:-
(a) Physical Check:- 1) Type 2) Screening / Colour bands 3) Tinning of leads / Terminals 4) Size /
Dimensions 5) No. Of Turns 6) Wire Guage 7) Physical damage
(b) Electrical Checks:- Value measured (Measure with DMM or LCR meter). Refer to the data sheet to
select the frequency in the LCR meter if required.
8. Transistor Inspection:-
(a) Physical Check:- 1) Package Type 2) Part code on body / Screening 3) Tinning of leads 4) Physical
damage 5) Refer Data sheet.
(b) Electrical Checks:- 1) In Forward bias - Base to Emitter and Base Collector should be Low equal
Resistance. 2) In Reverse bias - Base to Emitter and Base Collector should be high Resistance (in
Mega Ohms). Measure with DMM, Leakage Current, Forward Current & Voltage.
9. Load Termination Inspection:-
(a) Physical Check:- 1) Type 2) Screening / Colour codes (for Wattage rating) 3) Physical damage
(b) Electrical Checks:- Measurement of Resistance Value (Measure with DMM).
10. LED (Light Emitting Diode) Inspection:-
(a) Physical Check:- 1) Type 2) Colour 3) Tinning of leads / Terminals 4) Size / Dimensions
(b) Electrical Checks:- Glowing (Check with DMM in Forward bias mode), Forward Current, Voltage &
Brightness.
11. Miscellaneous Components:- All other miscellaneous components not described in the checklist will
be inspected as per the manufacturer’s catalog / data sheet guidelines.
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WORK INSTRUCTIONS
Title: General Guidelines for Inspection
Page: 01 of 01
The following guidelines should be observed for in-process inspection/testing, final and customer
inspection.
1. In-process Inspection: All products have to undergo in-process inspection at different stages of
production according to a quality plan prepared by QAD. (In the absence of a quality plan, in-process
inspection should be carried out at the stage of PCB assembly, module assembly, wiring and mechanical
assembly and final assembly). This is to ensure compliance with design requirements and the relevant
workmanship standards. Skipping in-process inspection may result in unreliable products and
consequent customer dissatisfaction.
2. In-Process Inspection: Sub-units of all products are required to undergo electrical testing. Test stages,
specifications and procedure are according to the product documentation released by PED. The results
of testing should be recorded by the production team. Also, any non-conformance should be noticed
and its disposition should be recorded. This record is a prerequisite for final inspection and testing by
QAD. Effective oral communication between QAD and the Production team will help in not missing in-
process inspection.
3. Final Inspection and Testing: A product is tested for electrical performance as specified in the
product documentation. After the production team completes, the product should be offered to QAD at
at least one day's notice. It will greatly help to plan QC activities if the offer note is given as much in
advance as possible. No oral communication shall be accepted for final inspection by QAD. At the time
of final inspection, QAD shall review in-process inspection and test records to ensure that no stage of
inspection or test is skipped. Final stage clearance shall not be given unless all the previous stages of
inspection and testing are successfully completed. Any exceptions shall be reported to the in-charge
QAD of the concerned unit for decision. A weekly report of exceptions shall be given to GM (QA) by
each person in-charge of QAD. When there are no exceptions in any week, a ‘nil’ report shall be sent.
4. Customer Inspection: When required by the customer's order or contract, the product should be
offered for customer inspection according to acceptance the of test procedure (ATP). After final
inspection by QAD, the production team should offer the product to QAD for customer inspection. In-
charge QAD shall ensure that all necessary quality records for the product are available and any other
requirements according to customer order are complied with. Thereafter, the offer note should be sent
to Marketing to arrange customer inspection. No dispatch shall be made unless the product is cleared
by QAD and (where required by contract) by the customer.
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WORK INSTRUCTIONS
Title: General Guidelines for Incoming Inspection
Page: 01 of 02
INCOMING INSPECTION:
1. Only approved items and approved sources will be permitted.
2. Inspect all items on a 100% basis unless sampling is authorized by in-charge QAD.
3. Reference documents:
 Purchase order
 Technical data sheet (approved/authorized)
 Work Instructions, check list, etc.
 General guidelines for incoming inspection (with reference documents)
 Certificate of compliance and / or test results from the supplier.
4. If the material under inspection does not meet one or more requirements and if the user department
(Production or R&D) wants to seek a Concession Form No. QA/IW/F06 shall be used by the user /
Initiating department. All such requests for concession are reviewed and disposed of by the Material
Review Board (MRB). The MRB is composed as below:
 Head (QA): Chairman
 I/C QAD of the concerned unit: Member - Convenor
 Representative of concerned PDD / PED - Member
 I/C PPC of the concerned unit - Member
After considering and reviewing all aspects of the non-conforming material including reliability and its
application, the MRB may decide on one of the following actions:
 Accept the material with or without re-work
 Reject and scrap the non-conforming material
 Refer to the customer for guidance (when sufficient data is not available for taking a decision).
 Decisions taken by MRB shall be recorded on the request for concession and the same shall
form part of the incoming inspection record of the material. Where required by contract, all
concessions granted by MRB shall be reported to the customer.
 No non-conforming material shall be passed unless a concession is granted.
5. Records:
 Certificate of compliance and/or test result (Hard copy)
 Inspection decision (soft copy from SAP)
 Inspection/test results (Hard copy)
 Concession if any.
 Screening reports. Where applicable.
6. All ESD sensitive items shall be inspected in a static safe area.
7. All mechanical items with close tolerances (better than ±0.1 mm) shall be inspected in a dust-free, air-
conditioned area maintaining a temp of 23°C ± 2°C. Where necessary, corrections will be applied for
temperature variation.
8. All records shall be maintained by QAD.
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WORK INSTRUCTIONS
Title: General Guidelines for Incoming Inspection
Page: 02 of 02
9. Whenever a particular inspection /test cannot be carried out by QAD, due to lack of capacity or
expertise, such inspection/test may be carried out by the User department or an outside laboratory as
decided by I/C QAD. If the service of an outside laboratory is used, the adequacy, suitability and
expertise of the laboratory, including its personnel, should be evaluated by the concerned I/C QAD and
recorded before outsourcing the job. Request for such inspection/test shall be made by I/C QAD in Form
No.QA/IW/F07. On the strength of the inspection report received, I/C QAD shall give a usage decision.
10. Regarding reference documents, note the following:
In the Purchase order check the following information:
 Manufacturer’s Part Number or ordering Number.
 Varaahi material code.
 A brief description of the item.
 The inspection clause includes information such as inspection at the supplier’s premises or at
Varaahi, special tests required etc.
 Certificate of compliance and/or batch acceptance test results from the supplier (wherever
required), packing instructions such as method and materials for packing special precautions for
ESD and silver / gold plated parts.
 Split supply is permitted or not.
Technical Data Sheet:

This is applicable to electronic and electrical items where a purchased parts drawing is not made
by Varaahi.
In this case, a copy of the relevant technical data given by the manufacturers is taken for
reference.
The manufacturer’s part number or ordering code and Varaahi’s material code are marked on
the data sheet and authorized by the I/C QAD. Only such authorized data sheets shall be used for
incoming inspection.
Work Instructions / Check Lists:
For each material or group of materials, a work instruction is prepared to indicate:
 Verification of Compliance to Purchase Order Conditions.
 The Parameters or aspects that need to be inspected for acceptance and the corresponding test
/ inspection methods. (Refer: Technical Data Sheet)
 Acceptance criteria.
 Screening requirements / method, where applicable.
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WORK INSTRUCTIONS
Title: Component Mounting on Printed Circuit Document Ref: WI/QA/13
Board Assembly (Acceptance Criteria) Page: 01 of 32
1. Scope:
This standard illustrates the recommended methods of mounting components on printed circuit boards
(PCBs). Unless otherwise specified or restricted by design and contractual requirements, Components shall
be mounted as specified, herein.
2. Component Lead Forming:
2.1 Horizontal Mounting Components:
2.1.1 There must not be any cuts/nicks? Fractures or neck formation on the leads
2.1.2 The components shall be bent such that markings shall be visible.
2.1.3 No sharp bending of leads (Minimum Bending radius = Diameter of lead).
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2.1.4 Leads must be bent at a minimum distance of (1.5* dia. Of lead) from the seal/body of the
component.
2.1.5 The lead must not be bent near the body.
2.1.6 The lead must enter the PCB at the right angle
2.1.7 Looping of Leads

a) If the distance between holes is less than the length of the component body, looping
must be done.
b)Loops must not be too large.
c) The minimum distance between the lead and the body must be 0.8mm (if the distance is
less, use sleeve).
d)No loops in R.F Assemblies are allowed.
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2.1.8 The Leads which contain a welded joint must never be bent near the joint. The minimum required
distance between the joint and the bend is 1.5mm (min.).
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2.1.9 Maximum Component Lead Length

The total length of both leads of axial leaded components shall not exceed 25mm for components
weighing less than 7 grams per lead.
If the component weighing 7 grams or more per lead must be mechanically secured.
2.1.10 Stress Relief:
Mechanically sensitive components such as glass diodes shall have one or more leads formed with
a stress relief loop as shown.
2.1.11 Jumpers
2.1.12 Hermetically Sealed Components:

Hermetically Sealed Components like miniature relays, headers, glass sealed capacitors, diodes and
transformers shall be handled carefully. Leads shall be bent at least 1.6 mm from the seal.
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2.2 Vertically Mounted Components:

2.2.1 The axial leaded component, if required to be mounted vertically, must be bent in such a way that
the markings (value and polarity) can be read easily from the top down.
2.2.2 If the distance between pads is more than the distance between the leads, lead forming shall be
done. The leads shall not be forced apart. If there are tracks under such components, sleeves are to be
used over leads.
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2.2.3 Lead Forming for ICs and Transistors:
There shall be no stress on the lead-entry point.

Pads shall be used for all transistors and metal can ICs. Wherever the pads are not provided for
transistors, all leads shall be provided with sleeving.
2.2.4 Axial leaded component, if required to be mounted vertically, shall be provided with sleeving on the
longer lead. The distance between the PCB and sleeve end shall be 0.8 to 1.6 mm.
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3. Component Mounting:
3.1 Orientation:
Horizontally mounted, non-polarized components shall be mounted so that component marking and
colour codes can be read in the same direction. (Left to Right or Top to Bottom). This is the preferred
condition.
3.2 Vertically mounted, non-polarized components shall be mounted so that the component marking can
be read top down.
3.3 All polarized components shall be mounted such that their polarization markings are visible.
3.4 If the PCB is marked for vertically mounted components with axial leads, all components should be
mounted on the circle-side of the marking.
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3.5 Horizontally mounted, non-heat dissipating components shall be preferably flush-mounted on PCB.
The maximum allowable offset at one end, when the other end rests on the PCB is 0.8 mm.
3.6 Location:
All components shall be mounted on the component side of the board, unless otherwise specified in
the design.
3.7 Alignment:
All components shall be mounted with their major axis parallel to the board edge. The components
shall be mounted mutually parallel or perpendicular to provide an orderly appearance.
3.8 Accessibility:
The components shall be mounted such that it will not prevent the insertion or removal of any tools
used for assembly.
The mounting of one part shall not prevent the removal of any other part unless the assembly is
considered disposable and is not intended for repair.
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3.9 Mounting of Heat Dissipating Resistors:

The resistors dissipating 1watt or more shall be mounted on terminals. Beads/Teflon sleeves be
provided on both leads. In all cases, a gap of more than 1.5 mm from the board shall be maintained.
3.10 Vertically Mounted Axial Lead Components:

(Components weighing less than 7 grams/lead)
Components shall not be mounted in flush with the PCB. (A gap of minimum of 0.4 mm and a
maximum of 3.2 mm is allowed between the body and PCB.)
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3.11 Vertically Mounted Axial Lead Components:
3.11.1 Components shall be mounted in a perpendicular direction to the PCB (Maximum allowable tilt =
150)
3.11.2 The insulated portion of the lead shall not be forced in the mounting hole. A minimum gap of 1.5
mm provided between body and PCB.
4. Mechanical Securing of Components:

4.1. Components weighing 7 grams or more per lead shall be mechanically secured.
Such components shall be mechanically secured by means of clamp, string, glue/soft rubber.
4.2. Secured by Clips, Clamps, and Brackets
4.2.1. The clips, clamps, and brackets shall be secured to prevent rotation by means of using two fasteners,
one fastener and a non-turn device and any other means.
4.2.2. Clamps and brackets which require removal to replace the component shall be mounted with
threaded fasteners or other non-permanent fastening devices.
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4.2.3. Spring type clips which do not require removal to remove the component can be mounted with
permanent fastening devices like rivets or eye lets.
4.2.4. Spring type clips shall require a positive displacement to remove the component.
4.2.5. There shall not be any sharp corners in the clamp.
4.3. Secured with Wire:

The wire or strap will be wrapped over the component and passed through holes in the board.
The leads shall be soldered similar to component leads. Sleeving should be used over the wire on
heat sensitive or fragile components.
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4.4. Secured by Adhesives:

If the mounting of component using clamps, wires, clips is not possible, the suitable adhesive may be
used to meet support requirements. The adhesive must be soft. No hard adhesive/glue shall be used.
5. Mounting of Metal Body Components:

When a connection is made by physical contact, both metal surfaces must be thoroughly cleaned
before assembly.
Eg. 1) Collector of a power transistor connected to a track via a screw {Fig.(a)}.
2) A power diode connected to a track via its fasteners {Fig.(b)}.
such as power diodes and power transistors (TO-220 and TO-3 packages) on heat sinks.
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Thermally conductive heat sink compound shall be applied (a thin, uniform layer) on both sides of the
mica washer for proper heat transfer. The evidence of Mica, Plastic Film or Thermal compound
showing around edges of the component shall be visible.
6. Terminals:
Terminals are used on PCBs to mount components that are frequently replaced or are selected for
optimum value at system test. (Test selected components).
Terminals are also used to connect the PCBs to proper parts of the system external to the board.
6.1. Mounting of Terminals on PCB:

The body of the terminal shall be located on the component side of the PCB.
The terminals shall be perpendicular to the board surface within 50.
The flange shall not be flattened on to the board.
The lugs, shall be press-fitted on to the PCB.
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More than three cracks on the flange after flaring of the terminal is not acceptable. The flanged
terminals shall be flared on to the pads using riveting tool.
6.2. Mounting of Components on Terminals:
The lead length between the body of the part and the point of contact with the terminal to which its
lead is attached shall be a minimum of 4.8 mm to 12.7 mm.
6.3. Component lead and wire attachment to Terminals:

6.4. Placement of Heat Sensitive Components:
Where a number of different types of components are mounted on a turret terminal, the most heat-
sensitive component shall be placed at the top. The sequence of mounting from top to bottom shall
be as follows:
a) Semi conductors and Diodes
b) Resistors
c) Relays
d) Capacitors
e) Coils
f) Hook-up Wires
g) Jumpers
6.5. Terminal Wire Wrap prior to Soldering:
The wire or component lead before soldering shall be sufficient to hold the wire in place without
movement during the soldering operation. The minimum should be one-half or 180 0 of wire-wrap.
The maximum wire-wrap shall be 2700.
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7. Connector Assembly:
The pins of the connector shall be inserted in to the component mounting holes (pads). The
connector shall rest on the board at both edges.
The screw for mounting the connector should have the screw head on the PCB soldering side and the
screw should project on the connector side. Spring washer and nut shall be mounted from the
connector side. The polarizing pin or bracket shall be mounted as per the drawing.
The multi pin connector may have one edge lifted off the board. This is acceptable provided the
following conditions are fulfilled.
Lift off should not be more than 0.5 mm while the other edge rests on the board.
The leads of the connector meets the minimum protrusion requirements (i.e. 1.5 mm for S.S. boards
and flush with the board for D.S. PTH boards.)
The lift off shall not result in improper mating with the corresponding mating connector.
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8. Mounting of Pot Cores Assemblies, Transformers and other Mechanical Parts:

The screw head along with the plain washer shall be on the solder side of the PCB and the spring
washer and nut shall be on the component side while mounting the pot core assembly, transformers
and any other mechanical parts.
9. Component Lead Attachment to printed Wiring:
9.1. Leads may be attached to PCB pads by clinching or straight through (un-clinched) lead attachment.
The attachment shall be completed by soldering.
a) The clinched lead shall be of sufficient length to allow direct contact with the pad or the conductor
but shall not extend beyond the edge of the pad, or the conductor.
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b) The lead shall be cut off and clinched before the soldering operation.
c) The lead must never be flattened against the PCB.
d) Clinched lead shall be cut to length (1.6 mm minimum, 4.8 mm maximum), and the tip of the lead
(whether clinched or not) shall not protrude more than 2.25 mm from the surface of the board.
e) The angle between a clinched lead and the surface of the PCB must be approximately 15 0 so that the
necessary mechanical restraint is provided during the soldering process.
9.2. Straight through lead attachment in both plated through and unsupported holes. The lead is passed
through the hole in the PCB, cut to length and soldered.
In the non-PTH holes, (un-supported holes), the leads shall extend from 0.5 to 1.5 mm from the pad
surface.
The leads should extend at least to the surface of the pad or maximum 2.30 mm from the pad in the
case of PTH (supported) holes.
Note: For PTH boards more than 2.3 mm thick, components with pre-established lead lengths, like
DIPS, Sockets, etc., lead protrusion may not be visible.
10. Masking of Component Mounting Pads:
Sometimes, it becomes necessary to mask certain component mounting pads because of unsealed
components, heat sensitive components, non-availability of components. Masking such component
mounting pads is necessary when the board is wave soldered to avoid solder filling the PTH.
There are two types of masks:
a) Liquid Mask
b) Tape Mask
Liquid Mask:
a) The mask shall be able to withstand soldering temperature for a minimum of 10 seconds.
b) The mask shall not contaminate the PTH and pads.
c) After wave soldering when the mask is peeled off, the adhesive shall not remain on the PCB.
d) This masking compound can be easily applied on the pads of the soldering side of the PCB.
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e) For spot mask, only one drop should be applied.

f) For masking several pads in a line, it should be applied continuously.
g) After application of the masking compound, the PCB should be taken for components mounting
only after the masking has become tak-free.
Tape Mask:
a) The masking tape shall be cut to the required size and stuck on the component pad.
b) Care shall be taken to provide sufficient width for the masking tape to avoid the chances of the
tape getting peeled off from the PCB at the time when the tape comes in contact with the molten
solder (Wave Soldering).
c) The tape shall be pressed evenly on the board so that it adheres on the PCB fully.
11. General:
11.1. The component body shall not be damaged while mounting and handling.
11.2. The markings on the PCB shall be visible after mounting of the components.
11.3. Clean surroundings shall be maintained in the area where the assembly is carried out.
11.4. Dirt, dust, solder particles, clipped wires shall be removed at frequent intervals.
11.5. ESD (Electro-static Discharge) precautions shall be observed while mounting components.
11.6. The work area must have good ventilation and be well illuminated.
11.7. Check the cutters, pliers for their proper operation.
11.8. The cut leads shall never be scattered, mixed up with the formed components.
11.9. Twisted leads shall be straightened with a smooth nose plier without causing strain to the lead joints
(i.e. component leads shall not be pulled). Heavily twisted component leads shall be rejected.
11.10. Components prone to static charge damage shall be collected in anti-static bins/tubes/containers
and also the necessary precautions are to be taken while handling as per the laid down guidelines.
11.11. Care shall be taken to choosing the correct cutting tool and the leads shall be cut in such a way that
the transmission of shock to the component lead joint is minimum.
11.12. Check the component lead for solderability prior to reforming of leads or mounting.
If the tinning on the component lead is damaged/rusted, retinning of components shall be carried
out.
11.13. The small - sized components shall be mounted first.
12. Leadless Components
Chip resistors, chip capacitors, inductors, attenuators, terminations, and standard assemblies shall be
mounted in accordance with 12.1 through 12.6.
12.1. Chip Devices:
Chip devices shall be mounted only on printed wiring circuit board. The devices shall not be stacked
nor should they bridge spacing between other parts or components such as terminals or other
properly mounted chip devices. (See fig. 12.1).
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Fig 12.1: Improper Mounting of Chip Devices
Fig 12.2: Acceptable Chip Overhang
The device shall be positioned such that the device shall not overhang the terminal areas more than
10% of the device width (W). (Refer fig 12.2). It is preferred that the device be positioned with no
overhang. The end cap of the chip device shall extend on to the terminal area a minimum of (See Fig
12.3). 75% of x and in no case this should be less than 0.15 mm.
Mispositioning of chip devices shall not reduce the specified minimum spacing to adjacent printed
circuit board.
Fig 12.3: Minimum Lap of Chip on Terminal Area
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Fig 12.4: Minimum Lap of Chip on Terminal Area
The device shall be mounted flat and parallel with the surface of the printed circuit board within 10-
degrees (See Fig 12.4).
The space between the body of the solderer-in-place chip device and the terminal areas shall not
exceed (0.40 mm) (See Fig 12.5).
Fig 12.5: Maximum Chip Elevation
Fig 12.6: Leadless Chip Components

In addition to the above requirements, Leadless chip components of end cap configuration, as
illustrated in Fig 12.6A, and Leadless chip components of the reflow configuration, as illustrated in Fig
12.6B, shall be mounted only if the components are in accordance with the requirements below. If
the vertical (v) dimension of reflow configuration chips is greater than the thickness (T) dimensions.
(See fig 12.6B), the reflow configuration chips should not be used assemblies subject to high vibration
or shock loads environment.
If the chip component is secured to the printed circuit board with an adhesive bonding resin, the area
or resin coverage shall not obscure the subsequent soldering operation on the chip device.
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a) There shall be no discontinuities in the metalized terminal areas of leadless components of the
reflow configuration (See fig. 12.6B).
b) Discontinuities in the metalized end caps shall not reduce the effective width (W) by more than
20% nor the area by more than 30% (See fig. 12.6C).
c) The body of the component shall not be cracked, scored, chipped, broken or otherwise damaged
as referred to the incoming inspection.
d) Components with electrical elements deposited on the external surface (such as chip resistors)
shall be mounted with that surface facing away from the printed wiring board or substrates (See
fig. 12.6).
e) Solder shall cover and blend smoothly to the complete substrate land or printed board terminal
areas and shall fillet to the blend smoothly with the metalized end cap. It is preferred that solder
cover the complete metalized area of the end caps as, but coverage to half the thickness (T) of
the component (including metalization) shall be acceptable provided there are not pits, voids, or
other discontinuity in the solder fillet.
f) There shall be no discontinuities in the solder coverage of terminal areas of components of the
reflow configuration. Solder shall not encase any nonmetalized portion of the body of a
component of the reflow configuration.
Fig 12.7: Minimum Acceptance
Fig 12.8
Fig 12.9: The preferred attachments is placement of the part on its respective land areas with no tillting
relative to the surface of the PWB
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Fig 12.10
Fig 12.11
Note: The part lead is misaligned but the lateral overhang does not exceed 25% of the lead width (w)
and does not violate the minimum spacing requirements as defined by the engineering document.
Fig 12.12: Maximum Acceptable - Lateral Overhang
Note: The part lead is misaligned but the lateral overhang does not exceed 25% of the lead width (w)
and does not violate the minimum spacing requirements as defined by the engineering document.
Fig 12.13: Maximum Acceptance - Toe Overhang
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13. Leaded Parts (See Fig 13.1 to 13.5)

a) Accept Criteria
i. Concave solder fillet with evidence of good wetting of the lead to land (a heel fillet is
mandatory) (Fig 13.5)
ii. The contour of the lead remains visible through solder (See Fig 13.5)
b) Reject Criteria
i. Lateral overhang exceeds 25% of the lead width
ii. Toe overhang exceeds 25% of the lead width
iii. Foot nonplanarity exceeds 0.26 mm (0.010 inch) above the pad
iv. A short or incomplete solder fillet which does not extend to the land edges
v. No evidence of a heel fillet
Fig 13.1
Fig 13.2
Fig 13.3
Fig 13.4
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Fig 13.5
14. J-Leaded Parts (See Fig. 14.1 to 14.5)
a) Accept Criteria
i. Concave solder fillet with evidence of good wetting (Fig 14.4)
ii. Lead is partially discernible in the inside curvature next to and under the part body (Fig.
14.5)
iii. Lead is partially discernible at the heel (Fig. 14.5)
b) Reject Criteria
i. Lateral overhang exceeds 25% of the lead width
ii. Toe overhang exceeds 25% of the lead width
iii. Insufficient solder does not wash the staff of the lead bend
iv. Excess solder extends beyond 50% of the lead height (Fig. 14.5)
v. A negative wetting angle (Fig 14.5)
vi. No evidence of a heel fillet (Fig. 14.5)
vii. The contour of the lead is not visible through the solder fillet (Fig. 14.5)
Fig. 14.1
Fig 14.2
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Fig. 14.3
Fig 14.4
Fig. 14.5
15. L-Leaded Parts (See Fig. No. 15.1 to 15.4)
a) Accept Criteria
i. Concave solder fillet with evidence of good wetting (Fig. 15.3)
ii. Lead is discernible under the solder (Fig. 15.4)
Fig. 15.1
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Fig. 15.2
Fig. 15.3
Fig. 15.4
b) Reject Criteria
i. Lateral overhang exceeds 25% of the lead termination width
ii. No evidence of a heel fillet (Fig. 15.4)
iii. Excess solder extends beyond 75% of the lead height (Fig. 15.4)
iv. A short or incomplete solder fillet which does not extend to the land edges (Fig. 15.4)
16. I-Leaded Parts (See Fig. 16.1 to 16.4)
Fig. 16.1
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Fig. 16.2
Fig. 16.3
Fig. 16.4
a) Accept Criteria
ii. Lead is discernible under the solder (Fig. 16.4)
b) Reject Criteria
i. Lateral overhang exceeds 25% of the width
ii. No evidence of a heel fillet across the entire contact area
iii. Excess solder extending beyond 75% of the lead height (Fig. 16.4)
iv. A short or incomplete solder fillet which does not extend to the land edges.
17. Melt Parts (See Fig. 17.1 to 17.4)
Fig. 17.1
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Fig. 17.2
Fig. 17.3
Fig. 17.4
a) Accept Criteria
ii. Solder exhibits a positive wetting angle (Fig. 17.4)
b) Reject Criteria
i. Lateral overhang exceeds 25% of the termination thickness.
ii. Inside overhang exceeds 50% of the termination width.
iii. Insufficient solder not extending 25% of the thickness of the termination
iv. Solder fillet doesn’t extend the entire contact area. (Fig. 17.3 & 17.4)
v. Excess solder exhibiting a negative wetting angle. (Fig. 14.5)
vi. No evidence of solder flow under the ends of the part.
vii. Termination is not discernible (Fig. 17.4)
18. Potentiometers
Potentiometers and other adjacent devices weigh less than 3.5 grams per lead shall, unless the
diameter of each lead is 1.0 mm or greater, be mounted in accordance with local potting shall be
provided for leads less than 1.00 mm diameter.
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19. Tall Profile Components

Tall profile transformers and other devices with a center of gravity in the upper half of the component
body (Fig. 19.1) shall be mounted with all leads seated on the terminal areas or in through holes.
Leads shall not be truncated. Components of the flatpack configuration shall be mounted in
accordance with 20.1 and those of the DIP configuration shall be mounted in accordance with
Fig. 19.1. Flatpacks and DIPs

20. Non-axial Multi Leaded Components
Flatpacks, dual in-line package (DIP) components, and other devices configured with leads extended
from two or more sidewalls (Fig. 16.2) shall be mounted with all leads seated on terminal areas or in
through holes. Leads shall not be truncated. Components of the flatpack configuration shall be
mounted in accordance with 20.1 and those of the DIP configuration shall be mounted in accordance
with 20.2.
20.1 Flatpacks
Whether planar mounted or mounted with leads inserted in through holes, flatpacks utilized in
conjunction with printed wiring assemblies shall be mounted with the body seated in accordance
with the following.
a) Body seating: Flatpacks shall be mounted with the body seated in accordance with the following
requirements.
b) Any component with a body of non-conductive material shall be mounted with the body seated
in contact with the surface of the printed board or circuitry thereof unless:
i. The body covers more than one printed conductor on the board is not (or is not to be)
coated.
ii. The terminal area pattern for the device is such that the portion of the terminal area
shutting any plated through hole used for interfacial or interlayer connection is partially or
totally beneath the body.
c) Any component with a body of conductive material shall be seated on the printed board only if
there is no printed conductor beneath the body.
d) If there are one or more conductors beneath a conductive body or if a body is non-conductive
but covers more than one printed conductor on a board and the board is not (or is not to be)
conformally coated, the body shall be:
i. Mounted flat on electrical insulation that is firmly affixed (either by pressure or adhesive) to
the printed board such that the moisture traps are precluded.
ii. Spaced from the board a minimum of 0.5 mm.
e) If the terminal area pattern for the flatpack is such that any interlayer portion of the area
surrounding a plated through hole used for interfacial or interlayer connection underlies either a
conductive or non-conductive body, the body shall be spaced a minimum of 0.5 mm above the
surface of the terminal area to permit solder to flow through the hole onto the terminal area.
f) The maximum space between the component body and the surface of the terminal area shall be
1.0 mm.
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g) Leads on opposite sides of planar mounted flatpack shall be formed such that component can’t
(non-parallelism between the base surface of the mounted component and the surface or the
printed wiring board) is minimal and in no instance shall body can’t result in non-conformance
with the minimum and maximum spacing limits 0.5 mm and 1.0 mm respectively.
20.2 Lead Configuration
Whether ribbon, flatted or square configuration, the leads of the flatpacks of the normal and butterfly
configuration (leads egressing from two or more sidewalls) shall be configured as shown in Fig. 20.1 if
the component is planar mounted and as shown in Fig. 20.2 if mounted with leads dressed through
the board.
Fig. 20.1. Configuration of ribbon leads for planar mounted flatpacks
Fig. 20.2. Configuration of Ribbon leads for through hole mounted flatpacks
20.3 Lead Seating for Planar Mounted Flatpacks
a) Leads shall be seated such that the heel to terminal area relationship shall conform to Fig. 20.3.
Leads shall be seated such that there is no side overhang. Toe overhang is acceptable provided
the following requirements of are met.
Fig. 20.3. Heel mounting requirements for ribbon leads
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Fig. 20.4. Toe overhang limits for ribbon leads

b) The length of lead contact shall be 3.0 to 5.0 times the width of the lead. (See Fig. 20.4).
c) Toe overhang is permissible, provided that it does not exceed 25% of the width or diameter of
the lead and the spacing to adjacent conductive elements remains greater than the minimum
specified.
d) Toe curl should not exceed twice the lead thickness.
e) It is preferred that leads be seated in contact with the terminal area for the full length of the
foot. Separation between the foot of such leads and the surface of the terminal associated area
shall not exceed 0.01 mm.
f) Leads shall be formed such that foot twist is minimal and in no instance shall foot twist result in
non-conformance with the 0.01 mm maximum spacing requirement.
20.4 Lead Seating for Planar Mounted Flatpacks
Whether of a round, square or ribbon cross section, leads shall be dressed to and through the printed
wiring board such that canting, bending, bowing, twisting, or other deformation does not cause
clearance, spacing to be reduced beyond the minimum specified conductor spacing. Canting, bowing
and bending of leads in any direction shall not exceed 25% of the lead width (or diameter) nor shall
leads be twisted more than 150.
20.5 Dual in-line packages
A dual in-line package (DIP) used in conjunction with printed wiring assemblies shall be mounted in
accordance with the following requirements.
a) The base of the device shall be spaced from the surface of the printed wiring board a minimum
of 0.25 mm and a maximum of 2.0 mm.
b) The base of the device shall be parallel to the surface of the printed wiring board within one
percent of the length of the DIP and shall not be greater than 0.2 mm.
c) DIP devices shall not be mounted in sockets, or other plug-in devices which rely upon contact
pressure for part retention. Leads of the DIP device shall be soldered in place.
d) Leads on DIP may be bent, rather than clinched towards the termination area to retain parts
during soldering operations, but such bent leads shall conform to all requirements applicable to
unclinched straight through leads. Bends shall be limited to 30 0 maximum outward from the axis
of the hole and to a maximum of 4 leads per component, not more than 2 leads on one side.
When DIP leads are bent, they shall be bent outward (away from the center of the part body).
This is an exception to
e) The lead-to-body seals of mounted devices shall be undamaged. Body chipouts that extend to or
into the glass seal and chipouts that expose a normally encased area of lead, are unacceptable.
Hairline cracks in either the seal or the body are not acceptable as in Fig. 20.5.
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Fig. 20.5. Not acceptable body and seal conditions

References:
1. Printed Board Component Mounting - IPC-CM-7708-Feb. 1980
2. MIL-STD-2000A, 14th Feb, 1991.
3. Quality Standards Manual (QSM 0005)
Printed Wiring Board Assemblies
British Telecommunications, 1984
4. IPC-A-610 Revision B. January 1996.
5. ISRO-PAX-300 Issue. 3rd Dec 1998.
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Title: Component Soldering on PCB Assembly Document Ref: WI/QA/14
(Acceptance Criteria) Page: 01 of 09
1. Scope:
This standard illustrates the recommended soldering joints on printed circuit board assembly. Unless
otherwise specified or restricted by design and contractual requirements, the solder joints on the PCB
shall be made as specified, herein.
2. Requirements of Good Solder Joint:
Good electrical contact with lowest contact resistance.
Enough mechanical strength to withstand vibrations and thermal shocks.
3. Acceptance Criteria:
3.1. The following are the characteristics of an acceptable solder connection:
a) Clean, bright, smooth, undisturbed surface
b) Concave fillet between conductor and termination
c) Contour on conductor visible
d) Complete wetting as shown by a low (or near zero) contact angle between the solder & the
pad/component lead surface.
e) Proper amount and distribution of solder.
3.2. The solder joint shall be free of:

a) Sharp edges
b) Exposed base metal
c) Flux residue
d) Inclusions of foreign material
3.3. Solder connections may have a matte gray (dull) or grainy appearing finish if:
a) The soldering is done with hard solder.
b) One or more of the connection elements, i.e., component leads or pads are gold, or silver-plated.
c) The solder joint is cooled at a slow cooling rate. (The case of high-density assembly).
3.4. The solder joint shall be free of:
a) Cracks, fractures or separation within the solder between the solder and component leads.
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3.5. PTH holes soldering:

3.5.1. With Component Lead Inserted:
PTH shall be filled with solder and shall be continuous from solder to component side.
The solder shall cover at least 90% on the solder side pad (approximately 330 0 of circumferential fillet
and wetting on the solder side.
The solder may flow back in to the hole provided that wetting is done on both the lead and the pad.
However, the total flow back of solder in a PTH shall not exceed 20% of the hole depth. (Hole depth is
measured from the surface of the pads).
Plated through holes with component Leads-minimum Acceptable Conditions:

Circumferential % of original land area
Circumferential covered with wetted
wetting Vertical
fillet and solder
Creteria component filling of
wetting solder
side-lead and solder Component
side Solder side
barrel side
Minimum 2700 75% 3300 0% 75%
Acceptable
3.5.2. Via Holes:
PTH shall be completely filled with solder and the top of the pads show good wetting.
Acceptable condition sides of the holes are wetted with solder.
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Note: Unsupported holes with a lead or plated through holes not subjected to wave, dip or drag
soldering used for interfacial connections need not be filled with solder. Via holes shall not be filled by
manual soldering operation.
3.6. Joint Height:
For PTH Joints: Maximum: 2.3 mm
Minimum: Top of the lead in flush with the pad (0.0 mm)
For Non-PTH Joints: Maximum: 1.5 mm
Minimum: 0.5 mm
If the top of the lead does not come up to the surface of the pad, it is not acceptable. However for
plated through hole boards greater than 2.3 mm thick, components with pre-established lead length,
(DIPs, Sockets), lead protrusion may not be visible. The figures in brackets are for PTH Joints.
3.7. Solder on the lead bend radius:

Solder may be preset in the formed bends of components, which results from normal wetting action.
The topside bend radius will be visible. The maximum solder climb (wetting) on the lead shall be up to a
distance of 1d (diameter of the lead) from the component body.
3.8. Lead cutting after soldering:

3.8.1. The cutting of component leads after soldering shall be followed by either reflow of the solder
connection, or the visual inspection of the solder joint at 10X to ensure that the original solder connection
has not been damaged (e.g. fractured or deformed).
3.8.2. The leads must be cut without sharp edges.
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4.0. Solder Defects:

4.1. Non-Wetted / Poorly Wetted Solder Joint (Dry Joint):
Can be identified by a separating line between the soldering surface and the solder fillet.
Or
A high contact-angle between solder and the soldering surface. In most cases, the lead moves in the
joint.
4.2. Insufficient Solder:
Solder fillet not in accordance with criteria given in the table at 3.5.1.
4.3. Excess Solder:
Excess solder sometimes covers a dry joint. The lead profile is concealed by the solder fillet.
4.4. Blow Holes and Pin Holes:
Pinholes and Blowholes shall not be accepted under the following conditions:
a) Large voids (Pin holes) reduce the wetted area (Fig. 1).
b) The void extends into PTH (Fig. 2).
c) More than one void per solder joint (Fig. 3 & Fig. 4).
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Icicles are sharp projections over the solder fillet. Such projections, which violate height requirements,
electrical clearance or pose a safety hazard, are not acceptable.
Bridging is an undesirable short circuit between conductors or component leads. Not acceptable.
4.7. Grainy or Cold Joints:
The surface of the fillet is rough, like an orange peel. Not acceptable.
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4.8. Charred Joint:

The charred remains of flux, which are visible between the soldering surface and the fillet are not
acceptable.
4.9. Superficial Fillets:
Superficial fillets are very thin, even if they appear like normal fillets. Superficial fillets occur if the gap
between the lead and the pad is too large. The fillet will collapse even if the lead is moved slightly as it is
very thin. Hence, its mechanical strength is very poor.
4.10. Lumps, Grain or Bubbles:
The charred remains of flux, which are visible between the soldering surface and the fillet are not
acceptable.
4.11. Unclean connections, flux residues, solder splashes and any other contamination are not acceptable.
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4.12. Lifted Pads / Tracks:

Pads / tracks lifted from the PCB surface are not acceptable.
4.13. Damage to PTH:

Damage PTH through forced insertion / removal of lead, or by any other means is not acceptable.
Drilling of PTH is not allowed.
5.1. Measling:
This is an internal condition occurring in laminated base material in which the glass fibers are separated
from the resin at the weave intersection. This condition manifests itself in the form of discrete white
spots or “Crosses” below the surface of the base material, and is usually related to thermally induced
stress.
Measling is acceptable if the assembly meets the functional requirements.
5.2. Crazing:
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This is an internal condition occurring in laminated base material in which the glass fibers are separated
from the resin at the weave intersections. This condition manifests itself in the form of discrete white
spots or “Crosses” below the surface of the base material, and is usually related to mechanically
induced stress.
Crazing is acceptable if the assembly meets the functional requirements.
5.3. Blistering and Delamination:
Blistering:
A localized swelling and separation between any of the layers of the base material or between the
material and the metal cladding.
Delamination:
A separation between any of the layers of the base material or between the base material and metal
cladding.
Acceptance Criteria:
1) The blistering/delamination between non-functional areas and functional areas may be
acceptable provided that imperfections are non-conductive and that other criteria are met.
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The blistering/delamination shall not exceed 25% of the distance between plated through holes (PTH) or
conductors.
Blistering/delamination bridges between PTH or bridges between conductors is not acceptable.

5.4. The bow and twist of the PCB shall not exceed 0.015 mm per mm. Where the assembly drawing has
tighter requirements, then the requirements given in the drawing should hold well.
5.5. Haloing is permissible if it is induced mechanically during mounting of terminals etc and it shall not be
present around PTH. The presence of haloing around PTH shall be treated as measling.
5.6. PCBs shall be free of foreign matter like grease, silicones, flux residue, dirt, chips, solder splatter,
solder balls, insulation residue and wire clippings.
5.7. Solder Masking:
a) There shall be no evidence of cracking of the solder mask after the soldering and cleaning
operations.
b) Wrinkling of the solder mask film over area of reflowed solder is acceptable provided there is no
evidence of breaking, lifting or degradation of the film.
c) Excessive blisters or wrinkling of the solder mask after cleaning operations shall not be
acceptable.
d) Cracking of the solder mask shall not be acceptable.
e) Degradation of the mask film that permits solder bridging or exposed basis metal shall not be
acceptable.
f) Preferably, there should not be any evidence of blisters, scratches, voids or wrinkling evident
under the solder mask after soldering and cleaning operations.
Note: Blisters, scratches, voids are acceptable provided.
6.0. References:
a) MIL-STD-2000A. 14 February 1991.
b) IPC-A-610. Revision B. January 1996.
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WORK INSTRUCTIONS
Title: General Guidelines for Final Inspection
Page: 01 of 02
Final inspection is the last stage at which Varaahi can check and ensure the quality of a product
before it is dispatched to the customer or offered for customer inspection. The following paragraphs
define the Final Inspection Process:
1. The team leaders will ensure the following before offering a product for final inspection.
 Release of all products documentation.
 Availability of approved QT/AT document in liaison with QAD, wherever applicable.
 Completion of all production activities and all in-process inspection / testing stages.
 Completion of environmental stress screening (ESS), if applicable, in liaison with QAD.
 Availability of record of sub-unit test results.
 Availability of record of 100% final electrical performance test results.
2. The team leader will prepare an inspection offer note (ION) and allot a serial number. The ION
along with 100% final electrical performance test results will be handed over to in-charge QAD for
carrying over inspection.
3. In-charge QAD will enter the following details of ION into a register. Serial number of the ION, date
of receipt, sale order number, product description, quantity offered and date of completion. This
register provides a control mechanism for final inspection activities. An Assigned Inspector from
QAD will check and ensure the following:
 Completeness of product documentation.
 Availability of approved QT/AT document, where applicable.
 Completion and clearance of all in-process inspection stages and relevant records.
 Completion of ESS and its records, where applicable.
 Completeness and compliance of 100% final electrical performance test results with
requirements.
4. The inspector will record his/her remarks on the record of test results. If a stage of in-process
inspection was skipped or some inspection remarks were pending, the team leader would take
necessary action for compliance. If there is any difficulty in this compliance activity, in-charge, QAD
will take an appropriate decision and record the same on a QAD copy of the ION.
5. After the above said verification and clearance by in-charge QAD (where required) the inspector
will take a random sample if the offered quantity is 25 nos. or more. Samplings will be according to
WI/QA/16. If the quantity offered is less than 25 no. 100% inspection will be carried out. However,
100% inspection may be used if the contract calls for it. Also in-charge QAD may decide to take up
100% inspection in case of new or unstabilized products.
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WORK INSTRUCTIONS
Title: General Guidelines for Final Inspection
Page: 02 of 02
6. The reference documents for inspection are one or more of the following:
 Applicable workmanship standards.
 Approved and applicable product documentation - drawings and test procedures.
 QT/AT document approved by the customer, where applicable
 Customer order / sale order.
Inspection will be carried out for:
 Physical and mechanical aspects
 Electrical parameters
 ESS tests (where specified).
Where required, the previous stages may also be verified. The results of inspection should also be
compared with the production test results (see point 2 above) to confirm consistency of electrical
performance.
7. The results of inspection will be recorded in the relevant formats. All inspection records shall carry
the S.O (sale order) / customer order reference. The results of inspection will be reviewed for
compliance with requirements. Any difference should be resolved between QAD and the team
leader. The product and other items should be according to the ‘list of deliverables’ specified in the
S.O. / customer order.
8. In-charge of QAD will make an accept / reject decision and record the same on the inspection
record and ION. In the case of sampling inspection, the whole lot is rejected if the sample fails. In
case of urgency, lots rejected on a sampling basis may be re-inspected on a 100% basis for
segregating conforming items. The accepted and / or rejected products will be marked (QC stamp
or tags) with their status by the inspector.
9. In-charge QAD will handover the following to the team leader for further action.
 The inspected products with their acceptance status marked.
 Copy of ION
 Copy of inspection record.
10. Packing inspection will be carried out according to check list WI/QA/09. If a packing inspection
check list is made for a specific product, the same will be used in place of WI/QA/09. At this stage,
conformance to the ‘list of deliverables’ should be checked. After packing, each packet will be
marked with a QC stamp.
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Title: General Guidelines for Sampling Inspection
Page: 01 of 08
Scope: This guideline covers inspection of in-coming and in-process materials on sampling basis.
Objective: To ensure that the right usage decisions are taken with the least possible inspection effort.
Reference Documents:
1. IS 2500 (Part 1):1992 - Attribute Sampling Plans indexed by Acceptable Quality Level (AQL) for lot-
by-lot inspection.
2. IS 2500 (part 2):1965 - Inspection by variables for percent defective.
3. IS 2500 (part 3):1995 - Attribute sampling plans indexed by Limiting Quality (LQ) for isolated lot
inspection.
Explanation for certain terms used:

1. Critical item: Any item (electrical or electronic or mechanical) that affects the electrical
performance or mechanical alignment or interchangeability of the final product or its sub-units is
designated as a critical item.
2. Non-critical item: An item other than a critical item.
3. Continuous series of lots: When a number of lots of an item are produced as a continuous series in
a stabilized and controlled production set-up or process, it is called a ‘continuous series of lots’.
4. Isolated lots: Sometimes a single or a few lots are produced and the production set-up is
dismantled. Such situations occur when items are custom-made in small batches. Sometimes a lot
can be termed as ‘isolated’ with respect to the consumer even though the supplier is producing the
item in a continuous series of lots. For example, electronic components are made in continuous
series of lots by the supplier but Varaahi buys in isolated lots.
5. Inspection by attributes: When inspection is made to classify an item as conforming or non-
conforming (defective) or to count the actual number of non-conformities (defects) on each item, it
is called inspection by attributes. For example, this method is used in inspecting PCB assemblies for
workmanship (component mounting and soldering(), electroplated / painted parts for surface
defects etc. In such cases, the inspection is subjective. Inspection by attributes objective in nature
but the results indicate only conformities / non-conformities or a go/no-go information.
6. Inspection by variables: When inspection is carried out by measuring and recording variable
parameters such as length, weight, power output, noise level, carrier frequency etc., it is called
inspection by variables. Inspection by variables gives us much more information about the nature
of the lot than in the case of inspection by attributes. Such information is useful in ensuring that
the lot not only meets the specification limits but also to gauge the nature of the mean and
variability of the parameters.
7. Variability: When a lot is produced, variability of its parameter(s) is expressed in terms of standard
deviation for the lot. This gives an indication of the piece-to-piece variation of the lot. Sometimes
such information is not available.
Guidelines:
1. Use sampling inspection wherever feasible for in-coming and in-process materials unless 100%
inspection is mandated by either customer contract or by the internal quality system.
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Page: 02 of 08
2. Identify the requirements for the material under inspection from the relevant technical data sheets
/ product documentation / reference standards. Where possible, classify the requirements into
‘major’ and ‘minor’ categories.
3. Prepare a check-list for inspection and establish acceptance criteria.
4. Before deciding to use sampling inspection ensure that the lot under inspection is homogenous
and is from one process run or batch. If the lot is made up from several assorted or dissimilar lots
or is otherwise not homogenous, carry out 100% inspection.
5. In case of miniature components, sensitive devices, large quantity lots etc, a notional sample size of
5 Nos is adopted for incoming inspection. This is due to the practical limitations of handling the
devices, repacking etc. However, 100% inspection or sample size as per guidelines in table 1 is
adopted wherever necessary and feasible.
6. If A1, A2, B1, B2, D1 or D2 tables are used, then use flow-chart enclosed for moving between 100%
inspection and sampling inspection. Also, to decide on the level of inspection. In any sampling plan,
level II is for normal inspection, level III is for tightened inspection and level I is for reduced
inspection.
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Page: 03 of 08
ISSUE No. 01 REVISION No. 00 ISSUE DATE AUTHORISED BY:
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Page: 04 of 08
Table 1
Guidance for choosing sampling plans
Type of lot Sampling plan Remarks
1. Critical item - continuous series of lots -
Table A1
inspection by attributes
2. Non-critical item - continuous series of lots -
Table A2
inspection by attributes
In this plan, inspection is
3. Critical item - continuous series of lots - possible with less number of
Table B1
inspection by variables - lot variability not known. samples than in table A1 but,
involves calculations.
In this plan, inspection is
4. Non-Critical item - continuous series of lots - possible with less number of
Table B2
inspection by variables - lot variability not known. samples than in table A2 but,
involves calculations.
5. Critical item - isolated lot as agreed by Varaahi
Table C1
and supplier - inspection by attributes.
6. Non-Critical item - isolated lot as agreed by
Table C2.
Varaahi and Supplier - inspection by attributes.
7. Critical item - lot considered isolated by Varaahi
but as part of a continuous series of lots by supplier Table D1.
- inspection by attributes.
8. Non-critical item - lot considered isolated by
Varaahi but as part of a continuous series of lots by Table D2.
supplier - inspection by attributes.
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Page: 05 of 08
Table A1
Lot-by-lot inspection by attributes
Single sampling
AQL = 0.65%. Ref. IS 2500 - Part 1 - 1992.
Level II Level III Level I
Lot Size Sample Ac Re Sample Ac Re Sampl Ac Re
e
16-25 20 0 1 100% - - 8 0 1
26-50 20 0 1 32 0 1 8 0 1
51-90 20 0 1 32 0 1 8 0 1
91-150 20 0 1 32 0 1 8 0 1
151-280 20 0 1 125 1 2 8 0 1
281-500 32 0 1 125 1 2 8 0 1
501-1200 80 1 2 125 1 2 8 0 1
1201-3200 125 2 3 200 2 3 32 0 2
3201-10000 200 3 4 315 3 4 32 0 2
Table A2
Single sampling
AQL = 1.5. Ref. IS 2500 - Part 1 - 1992.
Level II Level III Level I
Lot Size Sample Ac Re Sample Ac Re Sampl Ac Re
e
16-25 8 0 1 13 0 1 3 0 1
26-50 8 0 1 13 0 1 3 0 1
51-90 8 0 1 50 1 2 3 0 1
91-150 32 1 2 50 1 2 3 0 1
151-280 32 1 2 50 1 2 3 0 1
281-500 50 2 3 80 2 3 13 0 2
501-1200 80 3 4 125 3 4 13 0 2
1201-3200 125 5 6 200 5 6 20 1 3
3201-10000 200 7 8 315 8 9 32 1 4
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Page: 06 of 08
Table B1
Single sampling - variability unknown - standard deviation method
AQL = 0.65%; Level IV. (Ref. IS 2500 - Part 2 - 1965.)
Lot Size Sample Size (n) k’ C
26-50 5 1.65 0.294
51-100 7 1.75 0.266
101-150 10 1.84 0.248
151-300 15 1.91 0.235
301-500 20 1.96 0.229
501-1000 25 1.98 0.225
1001-3000 30 2.00 0.223
FOR ONE-SIDED SPECIFICATION LIMIT:

Take measurements of the variable for the sample quantity and record them.
Calculate X = (x1+………..+xn)/n.
Where, x1………….xn are the measured values of the variable.
X = mean.
Calculate the standard deviation (s) of the variable for the sample.
S = Square root of {[x12+………………+xn2) - nX2]/(n-1)}
If the specification is given as “less than or equal to” i.e., an upper limit, ‘U’ is given, Calculate (X+k’s)
If the specification is given as “greater than or equal to” i.e., a lower limit, ‘L’ is given, Calculate (X-k’s)
Accept the lot if (X+k’s) is less than or equal to ‘U’

Or
(X-k’s) is greater than or equal to ‘L’
FOR TWO-SIDED SPECIFICATION:
Let the upper limit = ‘U’
Lower limit = ‘L’
Calculate s/(U-L)
(X+k’s)
(X-k’s)
Accept the lot if
S/(U-L) is less than or equal to ‘C’ and
(X+k’s) is less than or equal to ‘U’ and
(X-k’s) is greater than or equal to ‘L’.
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Page: 07 of 08
Table B2
Single sampling - variability unknown - standard deviation method
AQL = 1.5%; Level IV. (Ref. IS 2500 - Part 2 - 1965.)
Lot Size Sample Size (n) k’ C
26-50 5 1.40 0.323
51-100 7 1.50 0.295
101-150 10 1.58 0.276
151-300 15 1.65 0.262
301-500 20 1.69 0.255
501-1000 25 1.72 0.251
1001-3000 30 1.73 0.249
Calculations and acceptability criteria are the same as in Table B1.

Table C1
Isolated lot inspection (As agreed by the supplier and Varaahi)
Single sampling
LQ= 2.0%. (Ref. IS 2500 - Part 3 - 1995.)
Lot Size Sample Size (n) Acceptance Number (Ac)
51-90 50 0
91-150 80 0
151-280 95 0
281-500 105 0
501-1200 125 0
1201-3200 200 1
Note: For lots smaller than 51 inspect 100%.
Table C2
Isolated lot inspection (As agreed by the supplier and Varaahi)
Single sampling
LQ= 2.0%. (Ref. IS 2500 - Part 3 - 1995.)
Lot Size Sample Size (n) Acceptance Number (Ac)
26-50 28 0
51-90 34 0
91-150 38 0
151-280 42 0
281-500 50 0
501-1200 80 1
1201-3200 125 3
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Page: 08 of 08
Table D1
Isolated lot inspection (considered isolated lot by Varaahi, but as part of a continuous series of lots
by supplier)
Single sampling
LQ= 2.0%. (Ref. IS 2500 - Part 3 - 1995.)
Level I Level II Level III
Lot Size
n Ac n Ac n Ac
26-50 - - - - 200 1
51-100 - - - - 315 3
101-150 - - 200 1 - -
151-300 200 1 - - - -
Note: For quantities less than 200 inspect 100%.

Table D2
Isolated lot inspection (considered isolated lot by Varaahi, but as part of a continuous series of lots
by supplier)
Single sampling
LQ= 5.0%. (Ref. IS 2500 - Part 3 - 1995.)
Level I Level II Level III
Lot Size
n Ac n Ac n Ac
81-500 - - - - 80 1
501-1200 - - - - 125 3
81-1200 - - 80 1 - -
1201-3200 - - 125 3 200 5
3201-10000 - - 200 5 - -
81-10000 80 1 - - - -
>3200 - - - - 315 10
Note: For quantities less than 81 inspect 100%.
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Title: Application and Procedure for Conformal Document Ref: WI/QA/17
Coating Page: 01 of 03
1. Conformal Coating
It is a thin uniform layer of electrically non-conductive coating to a printed wire assembly packages to
provide protection against degradation of electronic assembly by environmental influences and to
provide electrical insulation. The most suitable material for coating is polyurethane and paraxylene.
Conformal coating should have the following properties.
 Good adhering and wetting to most of the surface
 Less shrinkage and easily curable
 High mechanical strength after curing
1.1 Work Area
The are shall be isolated from all other activities to prevent contamination and adequate ventilation like
exhaust & fund ducts shall be provided so that the harmful vapors are drawn away from the operators
and are routed to the outside.
1.2 Safety Precautions
Conformal coating materials may affect the skin, so protective care should be taken during processing.
In case of chemical contact with the body part, wash it immediately with cold water and take medical
advice if required. Solvents and compounds shall be stored as per the manufacturer’s
recommendations.
1.3 Urethane Type Coating Applications
Conformal coating can be done by spraying, brushing, dipping and pouring, depending upon the
requirements.
1.3.1 Spraying
Spray coating shall be done from all four directions to cover all areas. Due to line of sight spraying and
the shadowing effect, it may not be possible to get a uniform coating on the PCB. It is not used since it
requires 100% exhaust along with clean air and is not easy to implement. (Thickness 10 - 20 µm.)
1.3.2 Brush Method
The material shall be applied without forming fillets and ensuring uniform thickness. Particular attention
shall be paid to the underside of components and lead wires. The brush selected shall provide adequate
coverage. The brush method is adequate for rework and for coating. A minimum of three coats shall be
applied to achieve the proper coating thickness. The recommended coating thickness for polyurethane
is 20 to 50 microns.
1.3.3 Dipping Method
The entire assembly shall be dipped in resin. The extraction rate shall be such as to allow the coating
material to stop running and minimum composition of filleting is achieved. The wired assembly board
shall be immersed and withdrawn vertically at the rate of 5 mm to 30 mm per minute. Slow
immersion allows air escape. If the card is immersed rapidly, it causes foam and air to get entrapped.
1.3.4 Pouring Method
Sufficient material shall be poured or flowed on to the assembly so that it will be covered and spread
outward and down ward without entrapping air.
1.4 Curing
Manufacturer’s instructions shall be followed for curing the conformally coated assembly. For Conap:
CE 1155: the curing conditions are 60° temperature for 3 hours. Curing time at room temperature is 7
days.
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1.5 Parylene Conformal Coating

Parylene is the generic name for the members of the unique polymer series. The basic member of the
series is poly para xylylene, a completely linear highly crystalline material, meeting MIL-I-46058.
Parylene conformal coating provides corrosion resistance and dielectric protection for electronic
components and assembles. Conformality means that all surfaces, even corners and sharp edges like
cutting wire ends, are coated to a constant thickness. The operator should take care of the true
conformability of surface and deep penetration into small spaces, coupled with excellent electrical
and atmosphere properties.
1.5.1 Preparation for Coating (For Polyurethane and Parylene)
1.5.2 Cleaning
The surface to be coated shall be cleaned by suitable methods, which will assure that the assemblies
are free from solder, flux and other ionic, oily and other particulate contaminants as per applicable
standards for space use.
1.5.3 Masking
Masking is required in the areas, which require no conformal coating. It shall be done with suitable
materials like 3M adhesive tapes, heat-shrinkable sleeves, RTV, epoxies, spot on etc. Areas where
coating is not required, such as tuning screws of variable resistors and capacitors, shall be masked prior
to coating. The areas, which have to be soldered later, shall be protected using approved masking
materials, which do not leave a residue.
1.6 Application Procedure
Procedure for conformal coating “CONAP CE 1155” application with Brush method:
Clean the card, beaker and glass rod with alcohol and dry it with a blower. Mix part A and part B in
the ratio of 10:7 and thinner 15 to 20% of the above mixture and apply it with a soft brush on the
required surfaces.
Procedure for coating with Parylene:
Consult process in-charge for Procedure.
1.7 Inspection Uniformity
Coating should be uniform in colour and texture.
Continuity: Coating should be continuous and present a smooth and ripple free surface.
Adhesion: It should adhere to all coated surface.
Thickness Coating shall be uniform in thickness with no excessive build up around components. The
acceptable limit of thickness is 10 to 50 microns for different types of coatings.
1.8 Precautions for Local Potting & Conformal Coating
Presence of any of the contaminants of bubbles larger than 0.03 inch (0.76mm) or bubbles bridging
more than 50% of the distance between electrically uncommon conductors, for normal electrical
voltages shall be rejected. Coating shall exhibit no charred spots, no excessive runs or buildup.
Coating can be measured on a separate test samples and it is peeled off and its thickness can be
determined using a micrometer.
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Check List for Inspection
Sl. No Check points Remarks

Before CC
1 Improper Cleaning of PCB Rework
2 Un-supported jumper wire (Local Potting missed) Rework
3 Flux entrapped below component body Rework
4 Crack Solder joint Rework
5 Wax particles, loose dust particles, solder ball etc., Rework
6 Discoloration (other than greenish color) Rework
7 Masking details etc., Ref. Document
After CC
8 Mask material residues Rework
9 Improper Adhesion of CC film Reject
10 CC film lift / peel off Reject
11 Un-coated patches Rework
12 Foreign particle embedded in CC Reject
13 CC on unmasked area as per Fab. Details Reject
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WORK INSTRUCTIONS
Title: Cleaning and varnishing of printed Document Ref: WI/QA/18
circuit board (Acceptance criteria) Page: 01 of 02
21. Scope:
This standard gives the acceptance criteria for cleaning and conformal coating
(varnishing) of the Printed Circuit Board.
22. General:
Cleaning of Printed Circuit Boards is carried out to remove the ionic and non-ionic
contaminations. These contaminations cause corrosion of components, from leakage
path between conductors and also spoil the appearance of PCB.
Varnishing of Printed Circuit Boards is done to provide:
− Protection against humidity, dust and chemical vapours.
− Protection against accidental shorting of tracks due to stray conductor strands,
fasteners, etc.
− Protection against damages to PCB and tracks due to abrasion.
− Protection against fungus growth.
− Protection against current leakage and high voltage flash over (especially at high
altitudes).
23. Process Employed:
Any of the following processes can be employed for cleaning depending on the solvent
used.
− Brush cleaning with/without soaking.
− Ultrasonic cleaning
− Vapour cleaning
− A combination of Ultrasonic, vapour, and spray cleaning
Any of the following processes can be employed for varnishing.
− Brush application
− Spray application
24. Cleaning Requirements:
− There shall be no residue of flux.
− There shall be no dust particles entrapped.
− Care shall betaken that no damage is caused to the component body (particularly
plastic) by the accumulation of excess solvent.
− No dirty patches or finger prints on the cleaned PCB.
− The excess solvent shall be removed by the application of compressed air prior to
drying.
25. Varnishing Requirements:
25.1 Aesthetic Checks:
− No variation in thickness of varnish
− No unvarnished patches.
− No stains in the varnish.
− No brush marks and brush bristle in the coating. (In case of brush applications).
− No misty appearance and air bubbles (in case of spray applications)
− Varnish non-sticky
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Title: Cleaning and varnishing of printed Document Ref: WI/QA/18
circuit board (Acceptance criteria) Page: 02 of 02
− Varnish does not accumulate on edges.

− No dirty patches/finger prints on varnish.
− Human hair, lint, cotton, thread, solder blob, metal fillings.
− No peeling of varnish from PCB i.e., varnish shall adhere to the PCB properly.
25.2 Other Criteria:
− No jamming of PCB-mounted variable components like Potentiometer, Variable
capacitor, Coil adjuster.
− No varnish on areas where electrical contact is made by fasteners (Not by
soldering). Eg: Conductor area under Power Transistors, Power Rectifiers, etc.
− No varnish on test points.
− No varnish on terminal pins where wires are to be soldered.
− No varnish on connector pins, jumper plugs, etc.
− No varnish on light-emitting components like LED, LED displays, LCD displays and
lamps.
− No varnish between the electrical contacts of relays/switches.
− No varnish present on heat dissipating components like: High Power Resistors,
Metal can ICS, Heat Sinks, Power Transistors and Rectifiers.
− The thickness of the varnish coating must be between 30 to 130 microns.
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Title: Wire connections (wiring soldered Document Ref: WI/QA/19
connections acceptance criteria) Page: 01 of 18
1. Scope:
This standard covers the acceptance criteria for wire connections (wiring soldered
connections). Unless otherwise specified or restricted by design and contractual
requirements, wire connections shall be made as herein.
2. Wiring Preparation:
2.1 Coaxial Cables:
The braid of co-axial cable should be stripped in such a way that the soldering point of
the braid is at least 1.6 mm away from cable surface.
The center conductor (with dielectric) of a co-axial cable should never be exposed for
longer lengths. (Maximum exposed length = 10 mm).
2.1.3. Trimming of Stripped Cable:
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− There shall be no excessive solder on the conductor and the braid.

− The braid shall be twisted properly and there shall be no frayed ends.
− There shall be no rough surface.
− The solder coverage should be more than 90%
2.1.4. Cuts or Nicks on the center conductor that reduce the cross-sectional area to less
than 90% of the original cross-section area are not acceptable.
2.1.5. Termination of Co-axial cables:
The long length of the centre-conductor (with its insulator) must not be exposed. The
braid must cover the largest possible part of the total length of the wire.
The long lengths of the center-conductor (with its insulator) must not be exposed. The
braid must cover the largest possible part of the total length of the wire.
There should be slight slack in the center-conductor, while keeping the braid as stiff as
possible. (This shall be done to ensure that the braid takes the full stress when the cable
is pulled as it is stronger than the center-conductor).
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2.1.6. Termination of Connector (Co-axial):
The center-conductor shall never be looped. The looped center-conductor acts as a

spring trying to break away from the joint, resulting in a weak joint.
2.2 Stranded Wires:
2.2.1.
− There should not be any bird caging with separation between strands greater than
one strand diameter.
− The strands must be properly twisted.
− There shall not be severed or broken strands.
− The cuts or nicks that reduce the cross-sectional area of the stranded wires to less
than 90% of the original cross-sectional area is not acceptable.
The number of nicks or scratches shall not exceed the limits as given below. No broken
strands are allowed.
Number of Strands Maximum allowable Nicked Strands
Less than 7 0
7-15 1
16-18 2
19-25 3
26-36 4
37-40 5
41 or more 6
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2.2.2.
The bus wire shall not have any twists or nicks.
2.2.3. Stripping of Insulation:
The insulation shall not be stripped for too long. Too little insulation stripping is also not
acceptable as it is likely to get embedded in the solder.
The length of the stripping should be sufficient for wrapping around the terminal and
facilitate soldering with the soldering iron without burning the insulation.
2.2.4. Excessive discoloration of the wires or strands as a result of over heating is not
acceptable.
2.2.5. After insulation removal, insulation deformation shall not exceed 20% of the
insulation thickness. Slight discoloration resulting from thermal stripping is acceptable.
2.2.6. The insulation shall not be crushed or burned. Abrasion of insulation, cuts, nicks
or tearing shall not be present.
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2.2.7. Tinning of Stripped wires:

The portions of stranded wires for soldering shall be tinned prior to mounting. The
solder shall penetrate to the inner strands of the wire and shall wet the tinned portion
of the wire.
− The solder shall adhere to the contours of the strands.

− No excessive solder shall be present.
− All conductors shall be intact after tinning.
− There shall be wetting of all strands. (coverage shall be more than 90%)
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3. Routing and Clamping of Cable/Harness:

3.1 Cable Routing and Clamping:
− The cable shall be supported by a suitable clamp.
− The clamps shall be oriented correctly, cable in line and adequately supported.
− Adequate loop shall be provided to avoid strain on the joint.
− Bend radius of the cable loop must be a minimum of 2 times the cable diameter,
including the insulation.
3.1.1. The clamps shall not squeeze the cable, cut the insulation. The proper size of the
clamp should be used.
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3.2 Harness Routing and Clamping:

3.2.1. The harness shall be routed with the adequate number of clamps used.
The clamps shall be appropriately positioned near the breakouts such that the
breakouts are not under stress.
a) Clamps are positioned at appropriate positions.
b) Clamps are positioned approximately one inch from breakouts. No strain on
breakouts.
c) Harness shall be retained suitably every 2 inch on extended or long run.
3.2.2.
− The clamps shall not squeeze the harness.
− All the individual wires and cable ties shall be intact.
− Insulation and wires shall not be broken.
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3.2.4. Harness Tieing and Wrapping:
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3.2.5. Grommet Strip:

A suitable size and length of Grommet Strip shall be used, to protect the cable/harness
from chafing due to sharp panel edges.
3.2.6. Mounting Pad:

The mounting pad shall be able to withstand the load of cable/harness. The size of cable
tie must be comparable to a cable/harness. Tie end must be cut properly.
3.2.7. Cable Tie:

The cable tie shall be used with uniform spacing.
3.3 Hooking of Wires:

The wires shall be mechanically secured to their terminals before soldering. Such
mechanical securing shall prevent motion between the parts of a connection during
soldering.
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WORK INSTRUCTIONS
3.3.1. Fork and Turret Type Terminals:
The conductor must be hooked around the terminal before soldering.

a) Between ½ and ¾ turn-wrapping is acceptable.
b) Less than ½ turn wrapping resulting in a weak joint is not acceptable.
c) More than ¾ turn wrapping resulting in difficulty to remove is not acceptable.
Turret Terminals
Fork Terminals
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WORK INSTRUCTIONS
a) The stranded wires shall be properly placed in its place on the terminal. No strands
shall be sticking out.
b) In the case of single strand of size 28 swg and smaller the upper acceptable limit is
2½ turns and minimum limit is 1 turn.
c) More than 2½ turns wrap is not acceptable.
3.3.2. Strawger Tags:
The wires shall be wrapped 1½ turns around a strawger tag.

a) Less than 1½ turns is not acceptable.
b) More than 2 turns wrap is not acceptable.
c) For wires, with a small diameter, (28 swg or smaller), upto 2½ turns wrap shall be
acceptable.
d) More than 2½ turns wrap is not acceptable.
3.4 Service Loops:
Wires shall be placed in the proper position with a slight or gradual bend. The bend
shall be sufficient to prevent tension on the connection and to permit one field repair.
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3.5 Orientation of Wire Wrap:

Lead wires may be wrapped clock-wise or anti-clockwise but shall continue the
curvature of the lead wires and shall not interfere with the wrapping of other wires on
the terminal.
3.6 Approach of Wires to Terminals:
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WORK INSTRUCTIONS
The wire should be preferable to have no bend between the joint and the soldering
point. (Angles upto 900 are acceptable).
− There shall be no sharp corners in a wire.
− The wires shall never be folded such that the insulation comes too near to a joint,
otherwise the insulation will burn while soldering.
3.7 Separation of Connections on a Terminal:
When two or more connections are made to a terminal, each should be terminated
separately.
(‘Connection’ means a wire, the lead of a component, or a short link).
− In case of turret terminals, more than one connection per turret is allowed
provided a gap of one lead wire diameter exists between two wires.
− In case of strawger tags, more than one connection per notch is not allowed.
− In case of fork terminals, use a different finger for each connection.
3.7.1. Twisting two or more connections together before soldering them to the terminal
shall not be allowed.
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WORK INSTRUCTIONS
4. Soldering of Wiring Connection:

3.1 The solder should form a fillet with that portion of the wire in contact with the terminal.
The solder shall not hide the contour of the wire.
3.2 Wire Soldering to Solder Cups:
a) The solder almost fills the cup and follows the contour of the cup
entry.
b) Wetting between wire and cup is visible
c) No bird caging
d) The wire soldered inside the cylindrical pin and not on the outside
wall.
e) No excessive solder
f) No breaks in the strands
g) No separating line between the wire and the solder fillet.
h) Any solder on the outside surface of the solder cup is in the form of a
thin film.
4.2.1 No strands shall be removed or distributed. The wire fillet shall be inserted to the
full depth of the cup and a fillet shall be formed along the surfaces of the contact. The
solder will wet the entire inside of the cup. The solder should follow the contour of the
cup and shall fill at least 75% of the mouth of the cup. Any solder on the outside of the
cup shall be in the form of a thin film.
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WORK INSTRUCTIONS
3.3 Solder on Connector Pins:
a) Solder visible in the inspection hole.

b) Solder wetting between wire and cup is visible.
c) Any solder on the outside surface of the solder cup is
in the form of a thin film only.
3.4 Characteristics of Good Wire Joint:
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WORK INSTRUCTIONS
1. Concave fillet
2. No exposed copper/untinned strands in the stripped portion of wire.
3. Strands of a multi-strand wire twisted properly.
4. The lead profile is clearly visible under the fillet.
− No sharp edges. Edges of fillet merge into soldered surfaces.
− No damage to insulation of wire.
− Smooth and uniform solder.
− All solder joints shall have a shiny satin lustre appearance (dull matte appearance is
also acceptable).
3.5 Defects in Soldering - Wire Connections:
4.5.1. Insufficient/Excess Solder:
− Too less solder which makes the joint weak shall not be acceptable.
− Too much solder which can hide the cracks or dry joints should not be acceptable.
Out lines of the soldering surfaces shall not be hidden under the solder layer.
4.5.2. Non-Wetted/Poorly Wetted (Dry) Solder Joint:
Dry joint can be recognized by a distinct line between the solder fillet and one of the
soldering surfaces.
Dry joint results in intermittent contact and shall not be acceptable.
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WORK INSTRUCTIONS
4.5.3. Moved Joints (Dislocated/Disturbed Joints):
The moved joint is the result of the movement of the joint while the fillet is cooling. This
causes the fillet to become rough like orange peel.
Sometimes the fillet of a moved joint is fractured.
The moved joints shall not be acceptable.
4.5.4. Spikes (Icicles):
Spikes which are sharp projections of solder shall not be acceptable.

4.5.5. Grainy (Cold) Joints:
Grainy joint has an appearance similar to that of a moved joint with a rough surface
(orange peel surface). A cold joint is the result of cooling the joint too fast.
Grainy joints shall not be acceptable.
4.5.6. Charred Joints:
The joints that show the traces of the charred flux between the soldering surface and
the fillet shall not be acceptable. Charred joint is the result of rapid and excessive
heating.
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Bridging:
Bridging is an undesirable short circuit between the conductors caused by either

− Use of a soldering iron bit, which is too large for the application.
− The diameter of the solder wire is too large.
− Use of excess solder.
Bridging shall not be acceptable.
References:
1. PC-A-010. Revision B, January 1996.
2. MIL-STD-2000A, 14 February 1991.
3. WS-10112 Clamping/cable harness.
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WORK INSTRUCTIONS
Title: Application for local potting
Page: 01 of 02
1. Purpose:
Potting is filleting or moulding of parts with a suitable adhesive compound in order to
protect them from mechanical shock or vibration. Room temperature vulcanize
materials (RTV) are used as local potting materials.
RTV 3145 and Anabond 666 are being used. It is applied for mechanical support and
electrical insulation, main purpose is to protect components from vibration, shock,
humidity, and temperature, vacuum also.
2. Selection Criteria for the material:
 It must adhere well to the surface involved.
 Easy to apply and re-workable if needed.
 Electrically insulated.
 Transparent/Opaque.
 Meeting specifications of cleanliness.
 Total Mass Loss (TML) and Collectible Volatile Condensable Mass (CVCM) within
limits.
3. Surface Preparation:
All surfaces, cards and components where local potting is to be applied must be
thoroughly cleaned with alcohol or approved solvent and dried.
3.1. Tools: Sharp wooden or Teflon rod, tissue paper, Tweezer.
3.2. Fillet: Continuous, smooth fillet in specified place on the leads and base of the
component.
3.3. Parts requiring potting: Tantalum Capacitor, Glass diode, vertically mounted capacitor,
welded lead components, component weighing more than 14 gms (7 gms per lead).
3.4. Curing: At room temperature for 72 hours. (However, after 24 hours duration, system
can be inspected and checked for electrical testing).
3.5. Inspection: On-line inspection should be done during application and after curing.
4. Precaution for Local Potting:
4.1. Work area: The area shall be isolated from all other activities to prevent contamination.
Adequate ventilation shall be provided, so that any vapors are drawn away from the
operators are routed to the outside.
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WORK INSTRUCTIONS
Title: Application for local potting
Page: 02 of 02
5. Check List:
S. No Check Points Remarks
Before Curing
1 Improper cleaning of PCB Rework
2 Gap between component body PCB not filled completely Rework
3 Bubble bindings more than 50% of the distance between Rework
uncommon connectors
4 Excess/insufficient quality of polthy material (⅓ of ht of Rework
component)
5 Improper filtering (Not smooth equal) Rework
6 Air bubbles, cavity, voids, holes > 0.76 mm Rework
7 Foreign particles inclusion Rework
8 Spreading up on near by component Rework
After Curing
9 The surface remains sticky even after 2 hrs of curing. Allow 6 Replace material
hrs more curing if still sticky.
10 Material not sticking to the component Rework
11 Potted area with blisters, cracks, and discoloration. Rework
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WORK INSTRUCTIONS
Title: Critically in Assembly
Page: 01 of 01
Recommended Practices in Assembly

 Spring washer should never contact directly with any parts like PCB, box, and cover,
otherwise it will bite into the surface. A plain washer should be used along with a
spring washer.
 A gap between the box and cover is not allowed.
 Warpage should be within limits.
 Screw should not foul with any component.
 The safe gap between any screw and component should be greater than or equal
to 3 mm.
 Spring washer should be compressed fully.
 Epoxy resins: Ensure that its expiry date is not crossed. Use it well within its pot life
time. Ensure proper mixing before use. Follow instructions for surface preparation,
application, and curing.
 The torque wrench/screw driver should be periodically calibrated.
 RF cable should be laid properly and evenly before engaging with connectors.
 Fix cable ties/saddles firmly and properly for all cables.
 Know the difference between breakaway torque wrench and clinch type torque list.
 Use recommended torque according to torque tables for tightening any screw or
nut.
 Ensure proper Torquing sequence while fixing items such as top covers, etc.
 Teflon grommet should have a tight fit.
 After torquing, at least one thread should be seen projecting out of the nut.
 PCB track should not fouled with any metallic parts like a plain washer, multi pin
body, etc.
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WORK INSTRUCTIONS
Title: Fasteners
Page: 01 of 05
1. Purpose of Fasteners:
Screws are versatile and powerful fasteners. They are used for fastening together parts
made of wood, plastic and metals. Different varieties have been developed to maximize
efficacy for particular applications.
2. Material Specification:
Stainless steel-304 or equivalents are suggested for screws, plain washers, spring
washers & nuts.
Any other grades or special requirements should be followed if specified in a customer
contract.
Types & Details of Fasteners:
A
1. Hexagonal socket head screws.
2. Slotted cheese head screws
3. Slotted CSK & raised CSK and Phillip head screws
4. Hexagonal head bolt/crew
5. Hexagonal Nut
6. Spring washers
7. Grub screws
B
1. Fully threaded
2. Partially threaded
C
1. Precision
2. Semi-precision
3. Black
Types of Washers
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WORK INSTRUCTIONS
Title: Fasteners
Page: 02 of 05
Driving Methods:
 Slotted: Slotted screw heads are perhaps the oldest and most common variety; a
linear slot in the head accepts a standard (flat) screwdriver of the right size.
 Phillips: The phillips head is an improvement to the slotted screw; cross-shaped
grooves accept a phillips-head screwdriver. These heads provide a larger mating
surface between the screw and the screwdriver, which minimizes wear and helps
prevent slipping.
 Hexagonal: These heads do not have any grooves or slots at all; the entire head is
hexagonally shaped and are tightened with a wrench. Since the size of the heads
varies, a wrench set or an adjustable wrench is required for driving hex screws.
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WORK INSTRUCTIONS
Title: Fasteners
Page: 03 of 05
 Square: These heads have a square indentation to minimize slipping; they also
require a special driver for tightening and loosening.
3. Good Quality:
I. Rust and burr free
II. Good spring back of spring washer
III. No tool slippage while tightening
3.1 Screws, Nuts, Bolts, etc: Shall show no evidence of cross threading, burrs and shall be
tight. The word tight means the screw shall be finally secured and that there shall be no
relative movement possible between the tightened parts.
3.2 Screw Lengths: Shall be so as to provide an extension beyond the nut a minimum of 1
thread to a maximum of 2 threads.
3.3 Thread cutting (Self tapping): Screws shall be installed in such as manner that no burns
are evident and with the head tightly seated.
3.4 Flat Head: Screws should be essential to flush with their countersunk surface. In case,
the screws are flush above or below the surface after installation, the variation from
flushness shall be with in the limits as shown.
Thread size M2 M3 M4 M5 M6
Max. Variation from flush ‘mm’ 0.2 0.3 0.4 0.5 0.5
4. Magnetic Specification:
The specimen shall not have any residual magnetism developed in the stainless steel
fasteners.
5. Surface Finish:
Should be free from detects like burrs, cracks, irregular surface seams, voids, tool
marks, nicks or gouge which affects serviceability.
6. Visual Inspection:
Visual inspection of fasteners should be carried out to check workman ship and bright
surface finish should be bright.
7. Packing & Transportation Requirements:
Fasteners must be properly packed to avoid damage during transportation. Each packet
shall have its batch number, identification number, size, material, type of fasteners and
total quantity listed in each packet.
8. Fasteners Checking:
Fasteners must be checked using Go/No-Go threading gauges. Screws shall be checked
with a threaded ring gauges for tolerances and Nut shall be checked with threaded plug
gauges for tolerances.
9. Magnetic Cleanliness Test:
Fasteners shall not have residual magnetism developed in the SS fasteners. The extent
of residual magnetism within fasteners after keeping it in the magnetic field of 25 Gauss
for 15 minutes and shall not be greater than 1 Gauss.
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Title: Fasteners
Page: 04 of 05
10. Configuration of Fasteners

A. For usage in helicoil
B. For usage in through holes
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WORK INSTRUCTIONS
Title: Fasteners
Page: 05 of 05
C. Working with gravity
D. Fighting gravity
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WORK INSTRUCTIONS
Title: Fixing of Helicoil
Page: 01 of 01
Fixing of Helicoil
1. Purpose of Helicoil:
As aluminium is a soft metal, frequent tightening and loosening of screws will cause
damage to the tapped hole in the box/housing, plus helicoil made out of steel wire is
used as thread protection in soft metals like aluminium, plastics, etc.
2. Material: High Tensile Stainless Steel Wire
3. Types of Helicoils:
A. Free running:
B. Screw lock:
4. How to fix Helicoil:

For example M2 helicoil
 Drill 2.1 mm diameter hole in the aluminium block/housing.
 Do the tapping in the hole with the tap size recommended for M2 size by the
helicoil manufacturer.
 Hold the helicoil tang with tool.
 Rotate the tool gently in to the hole for a specified number of turns.
 Break the tang after full insertion of helicoil inside the tapped hole.
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WORK INSTRUCTIONS
Title: Identification of Interconnection and Document Ref: WI/QA/24
Wiring Page: 01 of 02
Identification of Interconnection and Wiring

1. Scope: To identify the cables & interconnections through sleeves.
2. Process:
2.1 Choose the sleeve with the correct internal diameter (ID) as per the cable or wires
(bundle) outer diameter (OD).
2.2 Prepare the required length of cable or wire.
2.3 Slide down the sleeve on the wire or cable with the help of tweezers.
2.4 The sleeve shall be placed away from the stripped end of the wire. If required spacing
shall be specified in the wiring drawings.
3. Types of Sleeves:
(I) Number Type (II) Coloured Sleeves
I. Number Type: Number type can be used when the interconnections are identified with
numbers in the wiring diagrams. The sleeve shall be introduced as such that the higher
significant figure shall be slide down first followed by the subsequent numbers and the
number shall be read from left to right.
Example: If a connection J1 to J2 and vice versa is identified with No.124 in wiring
diagram.
First slide down No. 1, next slide down No. 2 and thirdly side No.4
The sleeves shall be positioned closely to each other.

II. Coloured Sleeves: Where the interconnection are identified with colours in the wiring
diagram. The reference of coloured sleeves shall be positioned in the same order given
in the wiring diagram.
Example: If a connection is identified as blue/red/yellow colour strips. The colour of
sleeves shall be introduced as follows:
Blue colour sleeve shall be introduced first, followed by red colour and yellow colour.
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WORK INSTRUCTIONS
Title: Identification of Interconnection and Document Ref: WI/QA/24
Wiring Page: 02 of 02
3.1 The sequence of colour sleeves must always be read from left to right.
3.2 The length of the colour sleeve shall be 5 mm for internal diameter of sleeve up to 5.5
mm and 10 mm for the ID of the sleeve above 5.5 mm.
3.3 The sleeves should be positioned closely and 10 mm away from the end.
4. Either number type or colour type coded sleeves shall be used as per the requirement.
109
WORK INSTRUCTIONS
Title: Qualification of a Product -Preparation Document Ref: WI/QA/25
and Conduct Page: 01 of 02
Scope: These guidelines are applicable to all products of the company.
Guidelines:
1. Study the customer contract and/or design plan of the product. Note down all the
relevant points for qualification.
2. Study the user requirements and technical specifications to understand the
product and its application. Where required, discuss user requirements and
application of the product with the user/customer or the concerned design
engineer/project engineer. This step is important to understand the relevance of
each qualification step to the end use or application. Make necessary notes.
3. Study the qualification plan document as given in the customer contract and/or
design plan. Also, study all relevant reference standards such as MIL/JSS/ISRO.
Understand each of the tests, their levels/intensity/test methods and the
corresponding reference standard clauses. Make necessary notes.
4. Decide the number of samples required, method of serializing the samples and
allocation of samples for each test. Make notes. Prepare a sample allocation chart
in the form of a flowchart or in any other convenient form.
5. Draw a plan chart giving a) description of the test b) test conditions c) requirement
of visual inspection and measurements to be taken before, during and after the
test d) required electrical/mechanical test instruments e) availability of the test
facility and its location f) test charges and logistics in case of outsourced tests g)
total time required for each test.
6. Prepare a Gantt chart (bar chart) for qualification programme. The sample
allocation chart and the qualification programme chart are useful for monitoring
the execution of the programme.
7. Obtain approval for the charts prepared in steps 4, 5 and 6 from the competent
authority.
8. Keep a notebook to log the progress of everything qualification tests in a
chronological order. Note down all relevant observations, test/inspection results
and any special remarks or deviations in a chronological order. The name of the
person/organization who conducted the test/inspection should also be recorded.
This will form the basic evidence and record of qualification of the product.
9. Report any major deviations/failures/delays to the relevant authority immediately
after such happenings. Sometimes there may be a need to re-conduct one or more
tests or even a need to abort the entire programme and restart the whole process
of qualification. Take timely action in all such eventualities.
10. After the programme is fully executed, review the test/inspection results and notes
made in the diary, and draw conclusions. If necessary, discuss the conclusions with
the concerned authority/functions/customer representative.
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WORK INSTRUCTIONS
Title: Qualification of a Product -Preparation Document Ref: WI/QA/25
and Conduct Page: 02 of 02
11. Prepare a draft report in a proper format and put up for review and approval by the
competent authority.
12. Prepare a final report and obtain approval from the competent authorities.
Distribute the report according to distribution list.
13. Preserve all records of qualification and final report until the product is phased out
of production and declared obsolete.
111

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4. Check List for Soldering

5. Dos and Don’ts

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

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ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

6. Reverse bias resistance

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

I. Visual / Mechanical Check:

II. Electrical Check:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

1. Packing the item inside a polythene cover.

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

1. ICs (Integrated Circuits):-

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

Technical Data Sheet:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

2.1.3 No sharp bending of leads (Minimum Bending radius = Diameter of lead).

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

2.1.5 The lead must not be bent near the body.

2.1.7 Looping of Leads

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

2.1.9 Maximum Component Lead Length

2.1.12 Hermetically Sealed Components:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

2.2 Vertically Mounted Components:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

2.2.3 Lead Forming for ICs and Transistors:

There shall be no stress on the lead-entry point.

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

3.9 Mounting of Heat Dissipating Resistors:

3.10 Vertically Mounted Axial Lead Components:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

3.11 Vertically Mounted Axial Lead Components:

4. Mechanical Securing of Components:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

4.3. Secured with Wire:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

4.4. Secured by Adhesives:

5. Mounting of Metal Body Components:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

6.1. Mounting of Terminals on PCB:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

6.3. Component lead and wire attachment to Terminals:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

8. Mounting of Pot Cores Assemblies, Transformers and other Mechanical Parts:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

e) For spot mask, only one drop should be applied.

ISSUE No. 01 REVISION No. 00 ISSUE DATE: AUTHORISED BY:

Fig 12.1: Improper Mounting of Chip Devices

Fig 12.2: Acceptable Chip Overhang