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I. Summary Activity
Understanding assembly process timer H3CR
II. Purpose
New Employee can understanding assembly process of H3CR and can apply the knowledge to give
a contribution and solution to improve quality products.
III. Result
PCB Assy process at PT. SMT can be done in 2 process, there is reflow process
Add pasta to the machine and printing test for every changing PWB type
Stencil (Metal Mask ) Thickness setting is 0,15 mm for solder pasta and 0,2 mm for adhesive
Stencil Hole size following OMS standard
After the process, machine do inspection, if NG operator do the checking
d. Cutting PCB I/O then assembly with pcb front and PCB Power, then do soldering.
e. Repair the part with machine to remove solder ball.
f. Inspect VR with machine, this machine function is for input value VR after VR has been
programmed in front line and calibrating it.
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i. Then final inspect the product to check characteristic of the product. If Ok then packing the
product.
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